1-3 of 3
Cantilever beams
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

Santosh Sankarasubramanian, Jaime Cruz, Kyle Yazzie, Vaasavi Sundar, Vijay Subramanian, Tsgereda Alazar, Sivakumar Yagnamurthy, Edvin Cetegen, David McCoy, Pramod Malatkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020902.
Paper No: EP-16-1149
https://doi.org/10.1115/1.4036356
Published Online: April 24, 2017
View Article titled, High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method
Open the PDF for High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method in another window
Topics: Adhesion, Cantilever beams, Silicon, Solder masks, Temperature, Testing, High temperature, Adhesives
Journal Articles

Measurement of Interfacial Fracture Toughness Under Combined Mechanical and Thermal Stresses

J. Jiao, C. K. Gurumurthy, E. J. Kramer, Y. Sha, C. Y. Hui, P. Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 349–353.
https://doi.org/10.1115/1.2792645
Published Online: December 1, 1998
View Article titled, Measurement of Interfacial Fracture Toughness Under Combined Mechanical and Thermal Stresses
Open the PDF for Measurement of Interfacial Fracture Toughness Under Combined Mechanical and Thermal Stresses in another window
Topics: Cantilever beams, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture toughness, Stress, Thermal stresses
Journal Articles

A Thermo-Mechanical Approach for Fatigue Testing of Polymer Bimaterial Interfaces

C. K. Gurumurthy, J. Jiao, L. G. Norris, C.-Y. Hui, E. J. Kramer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 372–378.
https://doi.org/10.1115/1.2792649
Published Online: December 1, 1998
View Article titled, A Thermo-Mechanical Approach for Fatigue Testing of Polymer Bimaterial Interfaces
Open the PDF for A Thermo-Mechanical Approach for Fatigue Testing of Polymer Bimaterial Interfaces in another window
Topics: Fatigue testing, Polymers, Thermomechanics, Fracture (Materials), Displacement, Cycles, Fatigue, Cantilever beams, Delamination, Failure