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Journal Articles

Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components

Jingshi Meng, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031001.
Paper No: EP-15-1102
https://doi.org/10.1115/1.4036187
Published Online: June 14, 2017
View Article titled, Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components
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Topics: Failure, Failure mechanisms, Microelectromechanical systems, Printed circuit boards, Stress, Resonance, Clearances (Engineering), Vibration, Finite element analysis, Electrical wires
Journal Articles

Simulation of Secondary Contact to Generate Very High Accelerations

Stuart T. Douglas, Moustafa Al-Bassyiouni, Abhijit Dasgupta, Kevin Gilman, Aaron Brown
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031011.
Paper No: EP-13-1121
https://doi.org/10.1115/1.4030685
Published Online: September 1, 2015
View Article titled, Simulation of Secondary Contact to Generate Very High Accelerations
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Topics: Damping, Elastomers, Finite element analysis, Simulation, Springs, Stiffness, Modeling, Manufacturing, Clearances (Engineering)
Journal Articles

Optimization of Pin-Fin Heat Sinks in Bypass Flow Using Entropy Generation Minimization Method

W. A. Khan, J. R. Culham, M. M. Yovanovich
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031010.
https://doi.org/10.1115/1.2965209
Published Online: August 1, 2008
View Article titled, Optimization of Pin-Fin Heat Sinks in Bypass Flow Using Entropy Generation Minimization Method
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Topics: Entropy, Flow (Dynamics), Heat sinks, Optimization, Pressure drop, Heat transfer, Clearances (Engineering)
Journal Articles

A Theoretical Analysis of the Concept of Critical Clearance Toward a Design Methodology for the Flip-Chip Package

J. W. Wan, W. J. Zhang, D. J. Bergstrom
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 473–478.
https://doi.org/10.1115/1.2804098
Published Online: March 13, 2007
View Article titled, A Theoretical Analysis of the Concept of Critical Clearance Toward a Design Methodology for the Flip-Chip Package
Open the PDF for A Theoretical Analysis of the Concept of Critical Clearance Toward a Design Methodology for the Flip-Chip Package in another window
Topics: Clearances (Engineering), Flip-chip packages, Solders, Design
Journal Articles

Experimental Measurements of the Flow and Heat Transfer of a Square Jet Impinging on an Array of Square Pin Fins

Johnny S. Issa, Alfonso Ortega
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 61–70.
https://doi.org/10.1115/1.2160513
Published Online: June 14, 2005
View Article titled, Experimental Measurements of the Flow and Heat Transfer of a Square Jet Impinging on an Array of Square Pin Fins
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Topics: Flow (Dynamics), Heat sinks, Heat transfer, Pressure, Clearances (Engineering), Uncertainty
Journal Articles

Conjugate Heat Transfer From a Vertical Plate With Discrete Heat Sources Under Natural Convection

S. Lee, M. M. Yovanovich
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1989, 111(4): 261–267.
https://doi.org/10.1115/1.3226545
Published Online: December 1, 1989
View Article titled, Conjugate Heat Transfer From a Vertical Plate With Discrete Heat Sources Under Natural Convection
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Topics: Heat, Heat transfer, Natural convection, Vertical plates, Fluids, Radiation (Physics), Temperature, Boundary layers, Clearances (Engineering), Convection
Journal Articles

Convective Heat Transfer From Longitudinal Fin Arrays in the Entry Region of Turbulent Flow

K. S. Lau, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1989, 111(3): 213–219.
https://doi.org/10.1115/1.3226536
Published Online: September 1, 1989
View Article titled, Convective Heat Transfer From Longitudinal Fin Arrays in the Entry Region of Turbulent Flow
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Topics: Convection, Turbulence, Clearances (Engineering), Fins, Thermal resistance, Air flow, Design, Flow (Dynamics), Heat transfer, Heat transfer coefficients
Journal Articles

A Two-Dimensional Conjugate Heat Transfer Model for Forced Air Cooling of an Electronic Device

A. Zebib, Y. K. Wo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1989, 111(1): 41–45.
https://doi.org/10.1115/1.3226507
Published Online: March 1, 1989
View Article titled, A Two-Dimensional Conjugate Heat Transfer Model for Forced Air Cooling of an Electronic Device
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Topics: Cooling, Heat transfer, Clearances (Engineering), Design, Electronic components, Temperature, Thermal analysis, Thermal conductivity