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Journal Articles

Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation

Hsien-Chie Cheng, Yan-Cheng Liu

J. Electron. Packag. June 2023, 145(2): 021005.

Paper No: EP-22-1012

DOI: https://doi.org/10.1115/1.4055591

Published Online: September 28, 2022

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Topics: Capacitance, Circuits, Computational fluid dynamics, Energy dissipation, Heat conduction, Junctions, Modeling, MOSFET transistors, Network models, Power conversion systems

Journal Articles

Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate

Vahideh Radmard, Ahmad R. Gharaibeh, Mohammad I. Tradat, Cong. H. Hoang, Yaman Yaseen Manaserh, Kourosh Nemati, Scott N. Schiffres, Bahgat G. Sammakia

J. Electron. Packag. June 2023, 145(2): 021001.

Paper No: EP-22-1003

DOI: https://doi.org/10.1115/1.4054972

Published Online: August 8, 2022

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Topics: Computers, Cooling, Copper, Corrosion, Nickel plating, Plates (structures), Pressure drop, Temperature, Thermal resistance, Flow (Dynamics)

Journal Articles

Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology

Mohammad I. Tradat, Yaman “Mohammad Ali” Manaserh, Ahmad Gharaibeh, Bahgat G. Sammakia, Dave Hall, Kourosh Nemati, Mark Seymour

J. Electron. Packag. September 2022, 144(3): 031015.

Paper No: EP-21-1151

DOI: https://doi.org/10.1115/1.4053890

Published Online: March 8, 2022

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Topics: Air flow, Computational fluid dynamics, Cooling, Data centers, Flow (Dynamics), Pressure, Temperature, Tiles, Modeling

Journal Articles

Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics

Satyam Saini, Pardeep Shahi, Pratik Bansode, Jimil M. Shah, Dereje Agonafer

J. Electron. Packag. June 2022, 144(2): 024501.

Paper No: EP-21-1070

DOI: https://doi.org/10.1115/1.4053363

Published Online: January 28, 2022

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Topics: Computational fluid dynamics, Data centers, Heat sinks, Particulate matter, Simulation, Contamination, Flow (Dynamics), Particle flow

Journal Articles

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

Xingjun Yao, Weijie Jiang, Jiahui Yang, Junjie Fang, Wenjun Zhang

J. Electron. Packag. December 2022, 144(4): 041003.

Paper No: EP-20-1094

DOI: https://doi.org/10.1115/1.4052275

Published Online: November 22, 2021

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Topics: Computational fluid dynamics, Flip-chip, Flip-chip packages, Flow (Dynamics), Simulation, Solders, Surface energy, Uncertainty, Shapes, Packaging

Journal Articles

Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers

Pardeep Shahi, Apruv Pravin Deshmukh, Hardik Yashwant Hurnekar, Satyam Saini, Pratik Bansode, Rajesh Kasukurthy, Dereje Agonafer

J. Electron. Packag. December 2022, 144(4): 041008.

Paper No: EP-21-1115

DOI: https://doi.org/10.1115/1.4052324

Published Online: November 22, 2021

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Topics: Computational fluid dynamics, Cooling, Design, Flow (Dynamics), Flow control, Valves, Pressure drop

Journal Articles

Influences of Small Jet-to-Wall Spacings on Heat Transfer Characteristics and Flow-Field Entrainment Effects of Microscale Jets

Prabhakar Subrahmanyam, B. K. Gnanavel

J. Electron. Packag. September 2021, 143(3): 031009.

Paper No: EP-20-1104

DOI: https://doi.org/10.1115/1.4049579

Published Online: February 19, 2021

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Topics: Flow (Dynamics), Heat transfer, Heat transfer coefficients, Jets, Nozzles, Reynolds-averaged Navier–Stokes equations, Silicon, Reynolds number, Turbulence, Temperature

Journal Articles

Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap

Yuanchen Hu, Md Obaidul Hossen, Zhimin Wan, Muhannad S. Bakir, Yogendra Joshi

J. Electron. Packag. September 2021, 143(3): 031007.

Paper No: EP-20-1045

DOI: https://doi.org/10.1115/1.4049814

Published Online: February 19, 2021

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Topics: Computational fluid dynamics, Cooling, Integrated circuits, Leakage, Simulation, Temperature, Transients (Dynamics), Fins, Steady state, Heat

Journal Articles

Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling

Rajesh Kasukurthy, Amruthavalli Rachakonda, Dereje Agonafer

J. Electron. Packag. September 2021, 143(3): 031001.

Paper No: EP-20-1016

DOI: https://doi.org/10.1115/1.4049018

Published Online: January 19, 2021

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Topics: Computational fluid dynamics, Coolants, Cooling, Flow (Dynamics), Flow control, Matlab, Optimization, Plates (structures), Temperature, Testing

Journal Articles

Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization

Reece Whitt, Skyler Hudson, David Huitink, Zhao Yuan, Asif Emon, Fang Luo

J. Electron. Packag. December 2020, 142(4): 041004.

Paper No: EP-20-1034

DOI: https://doi.org/10.1115/1.4048493

Published Online: October 12, 2020

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Topics: Additive manufacturing, Coolants, Cooling, Design, Electromagnetic interference, Flat heat pipes, Flow (Dynamics), Fluids, Heat, Heat transfer

Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa

Ki Wook Jung, Eunho Cho, Hyoungsoon Lee, Chirag Kharangate, Feng Zhou, Mehdi Asheghi, Ercan M. Dede, Kenneth E. Goodson

J. Electron. Packag. September 2020, 142(3): 031117.

Paper No: EP-20-1030

DOI: https://doi.org/10.1115/1.4047846

Published Online: August 17, 2020

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Topics: Flow (Dynamics), Fluids, Heat, Heat flux, Manifolds, Microchannels, Pressure drop, Temperature, Uncertainty, Cooling

Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm 2 ) Power Electronics Cooling

Ki Wook Jung, Sougata Hazra, Heungdong Kwon, Alisha Piazza, Edward Jih, Mehdi Asheghi, Man Prakash Gupta, Michael Degner, Kenneth E. Goodson

J. Electron. Packag. September 2020, 142(3): 031118.

Paper No: EP-20-1032

DOI: https://doi.org/10.1115/1.4047883

Published Online: August 17, 2020

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Topics: Computational fluid dynamics, Design, Fluids, Manifolds, Microchannels, Pressure drop, Simulation, Coolers

Journal Articles

Experimental and Computational Investigations of the Thermal Environment in a Small Operational Data Center for Potential Energy Efficiency Improvements

Ismail Turkmen, Cem Ahmet Mercan, Hamza Salih Erden

J. Electron. Packag. September 2020, 142(3): 031116.

Paper No: EP-20-1018

DOI: https://doi.org/10.1115/1.4047845

Published Online: August 5, 2020

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Topics: Air flow, Computational fluid dynamics, Cooling, Data centers, Flow (Dynamics), Temperature, Tiles, Potential energy, Stress, Leakage

Journal Articles

Development and Application of a Thin Flat Heat Pipe Design Optimization Tool for Small Satellite Systems

Steven A. Isaacs, Caelan Lapointe, Peter E. Hamlington

J. Electron. Packag. March 2021, 143(1): 011010.

Paper No: EP-19-1130

DOI: https://doi.org/10.1115/1.4047576

Published Online: July 10, 2020

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Topics: Design, Heat pipes, Optimization, Vapors, Flat heat pipes, Temperature, Condensers (steam plant), Computational fluid dynamics, Heat, Satellites

Journal Articles

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Jeho Kim, J. Michael Brown, Yogendra Joshi, Kevin O'Connor, Marcos Diaz, Zhuomin Zhang, Peiyan Yang

J. Electron. Packag. September 2020, 142(3): 031120.

Paper No: EP-19-1127

DOI: https://doi.org/10.1115/1.4046933

Published Online: May 4, 2020

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Topics: Glass, Heat, Manufacturing, Solar energy, Solar radiation, Temperature, Testing, Simulation, Liquid crystals, Computational fluid dynamics

Journal Articles

Predictive Model Development and Validation for Raised Floor Plenum Data Center

Yogesh Fulpagare, Atul Bhargav, Yogendra Joshi

J. Electron. Packag. June 2020, 142(2): 021009.

Paper No: EP-18-1078

DOI: https://doi.org/10.1115/1.4046554

Published Online: March 19, 2020

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Topics: Computational fluid dynamics, Data centers, Temperature, Testing, Transients (Dynamics), Heat, Stress

Journal Articles

Impact of Overhead Air Supply Layout on the Thermal Performance of a Container Data Center

Wen-Xiao Chu, Jui-Lin Wu, Yeng-Yung Tsui, Chi-Chuan Wang

J. Electron. Packag. March 2020, 142(1): 011008.

Paper No: EP-19-1056

DOI: https://doi.org/10.1115/1.4044775

Published Online: October 10, 2019

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Topics: Air flow, Computational fluid dynamics, Containers, Data centers, Temperature, Ceilings, Cooling

Journal Articles

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger

Hua Zhu, Zhuo Yang, Tariq Amin Khan, Wei Li, Zhijian Sun, Jincai Du, Zhengjiang Zhang, Jianxin Zhou

J. Electron. Packag. September 2019, 141(3): 031008.

Paper No: EP-18-1108

DOI: https://doi.org/10.1115/1.4043482

Published Online: May 17, 2019

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Topics: Artificial neural networks, Computational fluid dynamics, Computer simulation, Flow (Dynamics), Heat exchangers, Heat transfer, Optimization, Friction, Reynolds number, Genetic algorithms

Journal Articles

Simultaneous Optimization of an Array of Heat Sinks

Georgios Karamanis, Marc Hodes

J. Electron. Packag. June 2019, 141(2): 021001.

Paper No: EP-18-1068

DOI: https://doi.org/10.1115/1.4042668

Published Online: February 25, 2019

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Topics: Computational fluid dynamics, Flow (Dynamics), Heat sinks, Optimization, Circuits, Coolants, Modeling

Journal Articles

Impact of Tile Design on the Thermal Performance of Open and Enclosed Aisles

Sadegh Khalili, Mohammad I. Tradat, Kourosh Nemati, Mark Seymour, Bahgat Sammakia

J. Electron. Packag. March 2018, 140(1): 010907.

Paper No: EP-17-1109

DOI: https://doi.org/10.1115/1.4039028

Published Online: March 2, 2018

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Topics: Air flow, Design, Leakage, Tiles, Temperature, Computational fluid dynamics, Simulation, Flow (Dynamics), Pressure

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Journal citation

NARROW

Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation

Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate

Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology

Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers

Influences of Small Jet-to-Wall Spacings on Heat Transfer Characteristics and Flow-Field Entrainment Effects of Microscale Jets

Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap

Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling

Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm 2 ) Power Electronics Cooling

Experimental and Computational Investigations of the Thermal Environment in a Small Operational Data Center for Potential Energy Efficiency Improvements

Development and Application of a Thin Flat Heat Pipe Design Optimization Tool for Small Satellite Systems

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Predictive Model Development and Validation for Raised Floor Plenum Data Center

Impact of Overhead Air Supply Layout on the Thermal Performance of a Container Data Center

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger

Simultaneous Optimization of an Array of Heat Sinks

Impact of Tile Design on the Thermal Performance of Open and Enclosed Aisles

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