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Journal Articles

Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation

Cemal Basaran, Associate Professor, Yujun Wen, Ph.D. Candidate
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 426–430.
https://doi.org/10.1115/1.1602707
Published Online: September 17, 2003
View Article titled, Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation
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Topics: Ball-Grid-Array packaging, Finite element analysis, Modeling, Reliability, Solder joints, Solders, Temperature, Tin, Surface mount technology, Diffusion (Physics)
Journal Articles

A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys

Z. Qian, W. Ren, S. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 162–168.
https://doi.org/10.1115/1.2792679
Published Online: September 1, 1999
View Article titled, A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys
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Topics: Alloys, Damage, Fatigue, Solders, Viscoplasticity, Constitutive equations, Creep, Damage mechanics, Deformation, Elasticity
Journal Articles

Damage Mechanics of Surface Mount Technology Solder Joints Under Concurrent Thermal and Dynamic Loading

R. Chandaroy, C. Basaran
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1999, 121(2): 61–68.
https://doi.org/10.1115/1.2792669
Published Online: June 1, 1999
View Article titled, Damage Mechanics of Surface Mount Technology Solder Joints Under Concurrent Thermal and Dynamic Loading
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Topics: Damage mechanics, Dynamic testing (Materials), Solder joints, Surface mount technology, Fatigue life, Failure mechanisms, Reliability, Stress, Vibration, Constitutive equations
Journal Articles

A Thermodynamic Framework for Damage Mechanics of Solder Joints

C. Basaran, C.-Y. Yan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1998, 120(4): 379–384.
https://doi.org/10.1115/1.2792650
Published Online: December 1, 1998
View Article titled, A Thermodynamic Framework for Damage Mechanics of Solder Joints
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Topics: Damage mechanics, Solder joints, Damage, Fatigue life, Alloys, Entropy, Low cycle fatigue, Second law of thermodynamics, Solders, Statistical mechanics
Journal Articles

Life Prediction of Solder Joints by Damage and Fracture Mechanics

S. H. Ju, B. I. Sandor, M. E. Plesha
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 193–200.
https://doi.org/10.1115/1.2792152
Published Online: December 1, 1996
View Article titled, Life Prediction of Solder Joints by Damage and Fracture Mechanics
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Topics: Damage, Fracture mechanics, Solder joints, Fracture (Materials), Damage mechanics, Fatigue life, Computers, Fatigue, Finite element methods, Anisotropy