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Journal Articles

Recent Developments in Air Pumps for Thermal Management of Electronics

Tsrong-Yi Wen, Jia-Cheng Ye
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2022, 144(3): 030802.
Paper No: EP-20-1109
https://doi.org/10.1115/1.4051970
Published Online: October 1, 2021
View Article titled, Recent Developments in Air Pumps for Thermal Management of Electronics
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Topics: Pumps, Flow (Dynamics), Diaphragms (Mechanical devices), Diaphragms (Structural), Fans, Electronics, Cooling
Journal Articles

An Investigation Into the Effect of the PCB Motion on the Dynamic Response of MEMS Devices Under Mechanical Shock Loads

Fadi Alsaleem, Mohammad I. Younis, Ronald Miles
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031002.
https://doi.org/10.1115/1.2957319
Published Online: July 29, 2008
View Article titled, An Investigation Into the Effect of the PCB Motion on the Dynamic Response of MEMS Devices Under Mechanical Shock Loads
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Topics: Microelectromechanical systems, Shock (Mechanics), Stress, Manufacturing, Diaphragms (Mechanical devices), Diaphragms (Structural)
Journal Articles

Optimization of Synthetic Jet Fluidic Structures in Printed Wiring Boards

Yong Wang, Guang Yuan, Yong-Kyu Yoon, Mark G. Allen, Sue Ann Bidstrup
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 353–359.
https://doi.org/10.1115/1.2351900
Published Online: February 20, 2006
View Article titled, Optimization of Synthetic Jet Fluidic Structures in Printed Wiring Boards
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Topics: Cooling, Dimensions, Heat transfer, Jets, Printed circuit boards, Diaphragms (Mechanical devices), Diaphragms (Structural), Thermal management, Flow (Dynamics), Fluid mechanics
Journal Articles

Boiling Heat Transfer Enhancement Using a Submerged, Vibration-Induced Jet

Steven W. Tillery, Samuel N. Heffington, Marc K. Smith, Ari Glezer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 145–149.
https://doi.org/10.1115/1.2188954
Published Online: February 1, 2006
View Article titled, Boiling Heat Transfer Enhancement Using a Submerged, Vibration-Induced Jet
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Topics: Boiling, Bubbles, Heat transfer, Temperature, Vibration, Vapors, Water, Diaphragms (Mechanical devices), Diaphragms (Structural), Heat flux
Journal Articles

Humidity-Induced Voltage Shift on MEMS Pressure Sensors

J. Albert Chiou, Mem. ASME, Steven Chen, Jinbao Jiao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 470–474.
https://doi.org/10.1115/1.1615249
Published Online: December 15, 2003
View Article titled, Humidity-Induced Voltage Shift on MEMS Pressure Sensors
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Topics: Bonding, Diaphragms (Mechanical devices), Diaphragms (Structural), Finite element analysis, Microelectromechanical systems, Pressure, Pressure sensors, Silicon, Stress, Surface tension