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Journal Articles

The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods

Yuqian Xu, Qiwen Zeng, Yuexing Wang, Mingyong Wu, Xiangyu Chen, Gang Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011205.
Paper No: EP-22-1001
https://doi.org/10.1115/1.4054821
Published Online: August 3, 2022
View Article titled, The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods
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Topics: Algebra, Deformation, Differential equations, Genetic algorithms, Stress, Errors, Solders
Journal Articles

Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging

Yujun Wen, PhD candidate, Cemal Basaran, Assoc. Prof. and Director
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 134–138.
https://doi.org/10.1115/1.1535446
Published Online: March 14, 2003
View Article titled, Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging
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Topics: Delamination, Electronic packaging, Finite element analysis, Finite element methods, Laminates, Stress, Stress analysis (Engineering), Thermal stresses, Materials properties, Thermomechanics
Journal Articles

Interfacial Thermal Stresses in Bimaterial Elastic Beams: Modified Beam Models Revisited

C. Q. Ru
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 141–146.
https://doi.org/10.1115/1.1481037
Published Online: July 26, 2002
View Article titled, Interfacial Thermal Stresses in Bimaterial Elastic Beams: Modified Beam Models Revisited
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Topics: Shear stress, Stress, Thermal stresses, Shear (Mechanics), Differential equations, Displacement, Boundary-value problems
Journal Articles

Prediction of Solder Geometry for an Axisymmetric Through-Hole Joint

A. F. Elkouh, N. Ramasubramanian, T. F. Hsu, N. J. Nigro, S. M. Heinrich, P. S. Lee, D. Shangguan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 268–274.
https://doi.org/10.1115/1.2792248
Published Online: December 1, 1997
View Article titled, Prediction of Solder Geometry for an Axisymmetric Through-Hole Joint
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Topics: Geometry, Solders, Solder joints, Differential equations, Printed circuit boards
Journal Articles

Transient Modeling of the Thermal Behavior of Outdoor Electronic Cabinets

Eric B. Zimmerman, Gene T. Colwell
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 258–263.
https://doi.org/10.1115/1.2792161
Published Online: December 1, 1996
View Article titled, Transient Modeling of the Thermal Behavior of Outdoor Electronic Cabinets
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Topics: Modeling, Transients (Dynamics), Temperature, Computer simulation, Differential equations, Electronics, Runge-Kutta methods, Sensitivity analysis
Journal Articles

Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading

Yi-Hsin Pao, Ellen Eisele
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 164–172.
https://doi.org/10.1115/1.2905382
Published Online: June 1, 1991
View Article titled, Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading
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Topics: Shear (Mechanics), Stress, Solder joints, Deflection, Differential equations, Dimensions, Materials properties, Shear stress, Temperature, Temperature controls
Journal Articles

Thermoplastic Problem of a Thick Orthotropic Beam on Two-Directional Elastic Foundation

V. Birman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1990, 112(1): 47–51.
https://doi.org/10.1115/1.2904340
Published Online: March 1, 1990
View Article titled, Thermoplastic Problem of a Thick Orthotropic Beam on Two-Directional Elastic Foundation
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Topics: Deformation, Differential equations, Shear (Mechanics), Shear deformation, Thermoelasticity