1-5 of 5
Diluents
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Effect of Solder Joint Thickness on Intermetallic Compound Growth Rate of Cu/Sn/Cu Solder Joints During Thermal Aging

Yan Zhu, Fenglian Sun
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041005.
Paper No: EP-16-1069
https://doi.org/10.1115/1.4034819
Published Online: October 10, 2016
View Article titled, Effect of Solder Joint Thickness on Intermetallic Compound Growth Rate of Cu/Sn/Cu Solder Joints During Thermal Aging
Open the PDF for Effect of Solder Joint Thickness on Intermetallic Compound Growth Rate of Cu/Sn/Cu Solder Joints During Thermal Aging in another window
Topics: Solder joints, Solders, Tin, Diluents, Intermetallic compounds
Journal Articles

Gull-Wing Solder Joint Fatigue Life Sensitivity Evaluation

T. E. Wong, L. A. Kachatorian, B. D. Tierney
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 171–176.
https://doi.org/10.1115/1.2792230
Published Online: September 1, 1997
View Article titled, Gull-Wing Solder Joint Fatigue Life Sensitivity Evaluation
Open the PDF for Gull-Wing Solder Joint Fatigue Life Sensitivity Evaluation in another window
Topics: Fatigue life, Solder joints, Wings, Manufacturing, Solders, Design, Modeling, Diluents, Finite element analysis, Finite element model
Journal Articles

How Compliant Should a Die-Attachment be to Protect the Chip From Substrate Bowing?

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 1995, 117(1): 88–92.
https://doi.org/10.1115/1.2792073
Published Online: March 1, 1995
View Article titled, How Compliant Should a Die-Attachment be to Protect the Chip From Substrate Bowing?
Open the PDF for How Compliant Should a Die-Attachment be to Protect the Chip From Substrate Bowing? in another window
Topics: Adhesives, Bending (Stress), Diluents, Elastic constants, Epoxy adhesives, Manufacturing, Mechanical behavior, Rails, Silicones, Stiffness
Journal Articles

Mechanical Deformation of Leadframe Assemblies in Plastic Packages During Molding

E. Suhir, L. T. Manzione
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 1991, 113(4): 421–425.
https://doi.org/10.1115/1.2905430
Published Online: December 1, 1991
View Article titled, Mechanical Deformation of Leadframe Assemblies in Plastic Packages During Molding
Open the PDF for Mechanical Deformation of Leadframe Assemblies in Plastic Packages During Molding in another window
Topics: Deformation, Molding, Deflection, Flow (Dynamics), Stress, Density, Design, Diluents, Gates (Closures), Geometry
Journal Articles

Application of an Epoxy Cap in a Flip-Chip Package Design

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1989, 111(1): 16–20.
https://doi.org/10.1115/1.3226501
Published Online: March 1, 1989
View Article titled, Application of an Epoxy Cap in a Flip-Chip Package Design
Open the PDF for Application of an Epoxy Cap in a Flip-Chip Package Design in another window
Topics: Design, Epoxy adhesives, Epoxy resins, Flip-chip packages, Stress, Buckling, Thermal expansion, Compression, Diluents, Low temperature