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Journal Articles

Simulation of Secondary Contact to Generate Very High Accelerations

Stuart T. Douglas, Moustafa Al-Bassyiouni, Abhijit Dasgupta, Kevin Gilman, Aaron Brown
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031011.
Paper No: EP-13-1121
https://doi.org/10.1115/1.4030685
Published Online: September 1, 2015
View Article titled, Simulation of Secondary Contact to Generate Very High Accelerations
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Topics: Damping, Elastomers, Finite element analysis, Simulation, Springs, Stiffness, Modeling, Manufacturing, Clearances (Engineering)
Journal Articles

A High Precision Experimental Method to Determine Poisson’s Ratios of Encapsulant Gels

David A. Dillard, Alok Mallick, Donatus C. Ohanehi, Jang-Horng Yu, Didier R. Lefebvre
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031006.
https://doi.org/10.1115/1.2957326
Published Online: July 30, 2008
View Article titled, A High Precision Experimental Method to Determine Poisson’s Ratios of Encapsulant Gels
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Topics: Cylinders, Elastomers, High pressure (Physics), Poisson ratio, Pressure, Casting, Pressure sensors, Deformation, Stress
Journal Articles

Finding the Constitutive Relation for a Specific Elastomer

Yun Ling, Peter A. Engel, Wm. L. Brodskey, Yifan Guo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 329–336.
https://doi.org/10.1115/1.2909336
Published Online: September 1, 1993
View Article titled, Finding the Constitutive Relation for a Specific Elastomer
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Topics: Elastomers, Compression, Deflection, Deformation, Finite element analysis, Natural rubber, Polynomials, Shear (Mechanics), Springs, Stress
Journal Articles

Strains in Aluminum-Adhesive-Ceramic Trilayers

P. M. Hall, F. L. Howland, Y. S. Kim, L. H. Herring
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 288–302.
https://doi.org/10.1115/1.2904381
Published Online: December 1, 1990
View Article titled, Strains in Aluminum-Adhesive-Ceramic Trilayers
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Topics: Adhesives, Aluminum, Ceramics, Epoxy adhesives, Epoxy resins, Elastic moduli, Temperature, Dimensions, Elastomers, Heat