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Journal Articles

Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements

Pradeep Lall, Tony Thomas, Vikas Yadav, Jinesh Narangaparambil, Wei Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041113.
Paper No: EP-20-1037
https://doi.org/10.1115/1.4047579
Published Online: July 10, 2020
View Article titled, Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements
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Topics: Cycles, Failure, Flexible electronics, Modeling, Reliability, Electronics, Regression models, Failure analysis
Journal Articles

Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031107.
Paper No: EP-19-1129
https://doi.org/10.1115/1.4046849
Published Online: April 24, 2020
View Article titled, Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink
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Topics: Circuits, Damage, Electrodiffusion, Failure analysis, Flexible electronics, Inks, Metals, Nanoparticles, Reliability, Density
Journal Articles

Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking

Quang T. Su, Mohammad A. Gharaibeh, Aaron J. Stewart, James M. Pitarresi, Martin K. Anselm
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041004.
Paper No: EP-17-1062
https://doi.org/10.1115/1.4040923
Published Online: August 20, 2018
View Article titled, Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking
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Topics: Deflection, Failure, Failure analysis, Finite element analysis, Finite element model, Manufacturing, Reliability, Resonance, Solder joints, Solders
Journal Articles

Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010903.
Paper No: EP-17-1090
https://doi.org/10.1115/1.4039333
Published Online: March 2, 2018
View Article titled, Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches
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Topics: Electronics, Failure, Reliability, Stress, Temperature, Failure mechanisms, Cycles, Safety, Failure analysis, Simulation
Journal Articles

Special Section on IMECE 2016

Justin A. Weibel, S. Ravi Annapragada
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2017, 139(2): 020301.
Paper No: EP-17-1032
https://doi.org/10.1115/1.4036627
Published Online: June 12, 2017
View Article titled, Special Section on IMECE 2016
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Topics: Failure analysis, Flexible electronics, Packaging, Reliability, Semiconductor wafers, Solders, Thermal analysis, Electronic packaging
Journal Articles

Reviewers Acknowledgment for the Journal of Electronic Packaging

Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. September 2016, 138(3): 038001.
Paper No: EP-16-1065
https://doi.org/10.1115/1.4033688
Published Online: June 6, 2016
View Article titled, Reviewers Acknowledgment for the Journal of Electronic Packaging
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Topics: Density, Electronic packaging, Failure analysis, Packaging
Journal Articles

Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling

Da Yu, Hohyung Lee, Seungbae Park
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041008.
https://doi.org/10.1115/1.4007674
Published Online: November 16, 2012
View Article titled, Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling
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Topics: Cycles, Failure, Fracture (Materials), Reliability, Solder joints, Failure mechanisms, Stress, Failure analysis
Journal Articles

Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

Hung-Jen Chang, Chau-Jie Zhan, Tao-Chih Chang, Jung-Hua Chou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011011.
https://doi.org/10.1115/1.4005956
Published Online: March 19, 2012
View Article titled, Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test
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Topics: Failure, Failure analysis, Fracture (Materials), Intermetallic compounds, Lead-free solders, Printed circuit board assemblies, Solder joints, Solders, Stress, Tin
Journal Articles

Behavior of Lead-Free Solder Under Thermomechanical Loading

Y. Wei, C. L. Chow, K. J. Lau, P. Vianco, H. E. Fang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 367–373.
https://doi.org/10.1115/1.1773197
Published Online: October 6, 2004
View Article titled, Behavior of Lead-Free Solder Under Thermomechanical Loading
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Topics: Constitutive equations, Damage, Deformation, Finite element analysis, Lead-free solders, Solders, Stress, Temperature, Thermomechanics, Alloys
Journal Articles

Failure Analysis of Miniature Solder Specimen

Y. Wei, C. L. Chow, H. E. Fang, M. K. Neilsen, T. J. Lim, W. Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 100–105.
https://doi.org/10.1115/1.1648060
Published Online: April 30, 2004
View Article titled, Failure Analysis of Miniature Solder Specimen
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Topics: Damage, Failure analysis, Finite element analysis, Solders, Creep, Fatigue, Constitutive equations, Nonequilibrium thermodynamics, Stress, Displacement
Journal Articles

Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems

L. J. Ernst, Guest Editor, G. Q. Zhang, Guest Editor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. December 2003, 125(4): 465.
https://doi.org/10.1115/1.1634590
Published Online: December 15, 2003
View Article titled, Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems
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Topics: Engineering simulation, Microelectromechanical systems, Microelectronic devices, Optimization, Thermal management, Computer simulation, Failure analysis, Micromechanical devices, Packaging
Journal Articles

Failure Analysis of Full Delamination on the Stacked Die Leaded Packages

T. Y. Lin, Z. P. Xiong, Y. F. Yao, Lane Tok, Z. Y. Yu, Budi Njoman, K. H. Chua, Y. Y. Ma
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 392–399.
https://doi.org/10.1115/1.1602704
Published Online: September 17, 2003
View Article titled, Failure Analysis of Full Delamination on the Stacked Die Leaded Packages
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Topics: Delamination, Finite element analysis, Stress concentration, Failure analysis, Adhesion
Journal Articles

Investigation of Variable Frequency Microwave Processing for Electronic Packaging Applications

Patricia F. Mead, Aravind Ramamoorthy, Shapna Pal
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 294–301.
https://doi.org/10.1115/1.1571076
Published Online: June 10, 2003
View Article titled, Investigation of Variable Frequency Microwave Processing for Electronic Packaging Applications
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Topics: Failure, Failure analysis, Microwaves, Proton exchange membranes, Radiation (Physics), Stress, Delamination, Heating, Leakage, Electronic packaging
Journal Articles

Evaluation of Smear and Its Effect on the Mechanical Integrity of Plated Through Hole-Inner Plane Interface in Thick Printed Wiring Boards

R. Venkatraman, K. Ramakrishna, Mem. ASME, K. Knadle, W. T. Chen, Fellow ASME, G. C. Haddon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 6–15.
https://doi.org/10.1115/1.1326437
Published Online: July 1, 2000
View Article titled, Evaluation of Smear and Its Effect on the Mechanical Integrity of Plated Through Hole-Inner Plane Interface in Thick Printed Wiring Boards
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Topics: Copper, Double refraction, Drilling, Drills (Tools), Epoxy resins, Failure, Failure analysis, Finite element analysis, Fracture (Materials), Glass
Journal Articles

Lead-On-Chip Versus Chip-On-Lead Packages and Solder Failure Criteria

Boris Mirman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2000, 122(3): 279–280.
https://doi.org/10.1115/1.1286105
Published Online: January 9, 2000
View Article titled, Lead-On-Chip Versus Chip-On-Lead Packages and Solder Failure Criteria
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Topics: Failure, Reliability, Solders, Stress, Molding, Solder joints, Thermal stresses, Integrated circuits, Failure analysis, Integrated circuit packaging
Journal Articles

Failure Analysis of Liquid Crystal Displays Due to Indium Tin Oxide Breakdown

T. J. Dishoungh, M. Dube, M. Pecht, J. Wyler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 1999, 121(2): 126–127.
https://doi.org/10.1115/1.2792667
Published Online: June 1, 1999
View Article titled, Failure Analysis of Liquid Crystal Displays Due to Indium Tin Oxide Breakdown
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Topics: Failure analysis, Liquid crystals
Journal Articles

Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM

Z. Q. Yu, Y. C. Chan, D. P. Webb, G. Y. Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 172–177.
https://doi.org/10.1115/1.483151
Published Online: May 21, 1999
View Article titled, Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM
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Topics: Acoustics, Capacitors, Ceramics, Delamination, Nondestructive evaluation, Testing, Microscopy, Thermal shock, Reliability, Failure analysis
Journal Articles

A Thermal Fatigue Failure Mechanism of 58Bi-42Sn Solder Joints

Zequn Mei, Helen Holder
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1996, 118(2): 62–66.
https://doi.org/10.1115/1.2792133
Published Online: June 1, 1996
View Article titled, A Thermal Fatigue Failure Mechanism of 58Bi-42Sn Solder Joints
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Topics: Fatigue failure, Solder joints, Tin, Coatings, Failure, Agglomeration (Materials), Atoms, Cycles, Failure analysis, Melting
Journal Articles

Integrated Infrared Failure Analysis of Printed Circuit Boards

J. J. Miles, C. R. Zelak, J. M. Kliman, J. E. Sunderland
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 288–293.
https://doi.org/10.1115/1.2792107
Published Online: December 1, 1995
View Article titled, Integrated Infrared Failure Analysis of Printed Circuit Boards
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Topics: Failure analysis, Printed circuit boards, Testing, Heat transfer, Infrared imaging, Manufacturing, Radiation (Physics)
Journal Articles

Reliability Issues in Plated-Through-Holes Due to Insertion-Mount Compliant-Pin Connectors

G. Ganguly, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 147–152.
https://doi.org/10.1115/1.2792082
Published Online: June 1, 1995
View Article titled, Reliability Issues in Plated-Through-Holes Due to Insertion-Mount Compliant-Pin Connectors
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Topics: Copper, Damage, Deformation, Failure analysis, Finite element analysis, Fourier series, Manufacturing, Materials properties, Pins (Engineering), Printed circuit boards