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Journal Articles

Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits

Beihan Zhao, Aniket Bharamgonda, Edwin Quinn, George Stackhouse, Jason Fleischer, Michael Osterman, Michael H. Azarian, Daniel R. Hines, Siddhartha Das, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041105.
Paper No: EP-23-1012
https://doi.org/10.1115/1.4063541
Published Online: November 1, 2023
View Article titled, Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits
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Topics: Aerosols, Failure, Failure mechanisms, Modeling, Reliability, Silver, Temperature, Testing, Circuits, Printing
Journal Articles

A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF Tests

M. Y. Tsai, T. C. Kuo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2023, 145(3): 034502.
Paper No: EP-22-1060
https://doi.org/10.1115/1.4056717
Published Online: February 8, 2023
View Article titled, A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF Tests
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Topics: Bending strength, Silicon, Stress, Displacement, Failure mechanisms
Journal Articles

Failure Mechanisms Driven Reliability Models for Power Electronics: A Review

Okafor Ekene Gabriel, David Ryan Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2023, 145(2): 020801.
Paper No: EP-22-1045
https://doi.org/10.1115/1.4055774
Published Online: October 22, 2022
View Article titled, Failure Mechanisms Driven Reliability Models for Power Electronics: A Review
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Topics: Failure, Fatigue, Reliability, Stress, Temperature, Fatigue life, Electronics, Failure mechanisms, Corrosion, Modeling
Journal Articles

Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

Mahsa Montazeri, Whit M. Vinson, David R. Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021002.
Paper No: EP-22-1037
https://doi.org/10.1115/1.4055024
Published Online: August 8, 2022
View Article titled, Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions
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Topics: Electrodiffusion, Failure, Solder joints, Solders, Stress, Temperature, Tension, Testing, Current density, Tin
Journal Articles

Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses

M. Y. Tsai, H. J. Chen, J. H. Yeh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041007.
Paper No: EP-19-1034
https://doi.org/10.1115/1.4044961
Published Online: October 18, 2019
View Article titled, Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses
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Topics: Bending strength, Boundary-value problems, Displacement, Glass, Stress, Failure mechanisms, Surface roughness
Journal Articles

Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices

Alexander Otto, Sven Rzepka, Bernhard Wunderle
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031012.
Paper No: EP-18-1098
https://doi.org/10.1115/1.4043646
Published Online: June 17, 2019
View Article titled, Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices
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Topics: Cycles, Failure, Junctions, Temperature, Wire, Stress, Failure mechanisms, Thermomechanics
Journal Articles

Study on BEOL Failures in a Chip by Shear Tests of Copper Pillar Bumps

Lei Wang, Jun Wang, Fei Xiao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2019, 141(1): 011003.
Paper No: EP-18-1037
https://doi.org/10.1115/1.4041714
Published Online: February 25, 2019
View Article titled, Study on BEOL Failures in a Chip by Shear Tests of Copper Pillar Bumps
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Topics: Columns (Structural), Copper, Shear (Mechanics), Stress, Failure, Finite element analysis, Failure mechanisms
Journal Articles

Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking

Quang T. Su, Mohammad A. Gharaibeh, Aaron J. Stewart, James M. Pitarresi, Martin K. Anselm
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041004.
Paper No: EP-17-1062
https://doi.org/10.1115/1.4040923
Published Online: August 20, 2018
View Article titled, Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking
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Topics: Deflection, Failure, Failure analysis, Finite element analysis, Finite element model, Manufacturing, Reliability, Resonance, Solder joints, Solders
Journal Articles

Vibration-Induced Failures in Automotive Electronics: Knowledge-Based Qualification Perspective

Karumbu Meyyappan, Milena Vujosevic, Qifeng Wu, Pramod Malatkar, Charles Hill, Ryan Parrott
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020905.
Paper No: EP-17-1083
https://doi.org/10.1115/1.4039301
Published Online: May 9, 2018
View Article titled, Vibration-Induced Failures in Automotive Electronics: Knowledge-Based Qualification Perspective
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Topics: Damage, Electronics, Engineering standards, Failure, Failure mechanisms, Reliability, Solder joints, Vibration, Transportation systems, Fatigue
Journal Articles

Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010903.
Paper No: EP-17-1090
https://doi.org/10.1115/1.4039333
Published Online: March 2, 2018
View Article titled, Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches
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Topics: Electronics, Failure, Reliability, Stress, Temperature, Failure mechanisms, Cycles, Safety, Failure analysis, Simulation
Journal Articles

Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components

Jingshi Meng, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031001.
Paper No: EP-15-1102
https://doi.org/10.1115/1.4036187
Published Online: June 14, 2017
View Article titled, Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components
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Topics: Failure, Failure mechanisms, Microelectromechanical systems, Printed circuit boards, Stress, Resonance, Clearances (Engineering), Vibration, Finite element analysis, Electrical wires
Journal Articles

Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints

Tong An, Fei Qin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 011002.
Paper No: EP-15-1079
https://doi.org/10.1115/1.4032349
Published Online: March 10, 2016
View Article titled, Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints
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Topics: Failure mechanisms, Solder joints, Solders, Surface roughness, Lead-free solders, Intermetallic compounds, Tensile strength, Microcracks, Tin
Journal Articles

Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking Architecture

Jing-Yao Chang, Shin-Yi Huang, Chang-Chun Lee, Tung-Han Chuang, Tao-Chih Chang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031007.
Paper No: EP-14-1083
https://doi.org/10.1115/1.4030392
Published Online: September 1, 2015
View Article titled, Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking Architecture
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Topics: Cycles, Glass transition, Reliability, Solders, Stress, Temperature, Numerical analysis, Failure, Tin, Failure mechanisms
Journal Articles

Reliability Assessment of Wafer Level Packages With Novel FeNi Under Bump Metallization

Jia Xi, Xinduo Zhai, Jun Wang, Donglun Yang, Mao Ru, Fei Xiao, Li Zhang, Chi Ming Lai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031016.
Paper No: EP-15-1016
https://doi.org/10.1115/1.4030974
Published Online: July 21, 2015
View Article titled, Reliability Assessment of Wafer Level Packages With Novel FeNi Under Bump Metallization
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Topics: Ferronickel, Finite element analysis, Reliability, Semiconductor wafers, Solders, Temperature, Fracture (Materials), Failure mechanisms, Alloys, Stress
Journal Articles

Stress–Strain Behavior of SAC305 at High Strain Rates

Pradeep Lall, Sandeep Shantaram, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011010.
Paper No: EP-14-1001
https://doi.org/10.1115/1.4028641
Published Online: March 1, 2015
View Article titled, Stress–Strain Behavior of SAC305 at High Strain Rates
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Topics: Deformation, Displacement, Failure, Finite element analysis, Finite element model, Lead-free solders, Manufacturing, Solders, Stress, Trusses (Building)
Journal Articles

Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging

C. L. Gan, U. Hashim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021010.
Paper No: EP-12-1099
https://doi.org/10.1115/1.4024013
Published Online: April 12, 2013
View Article titled, Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging
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Topics: High temperature, Packaging, Reliability, Stress, Wire, Failure mechanisms, Temperature, Semiconductors (Materials), Nanoscale phenomena, Nanoelectronics
Journal Articles

Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling

Da Yu, Hohyung Lee, Seungbae Park
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041008.
https://doi.org/10.1115/1.4007674
Published Online: November 16, 2012
View Article titled, Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling
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Topics: Cycles, Failure, Fracture (Materials), Reliability, Solder joints, Failure mechanisms, Stress, Failure analysis
Journal Articles

Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO 3 Composite Dielectric

Mohammed A. Alam, Michael H. Azarian, Michael Osterman, Michael Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021009.
https://doi.org/10.1115/1.4006704
Published Online: June 11, 2012
View Article titled, Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO 3 Composite Dielectric
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Topics: Capacitance, Capacitors, Failure, Stress, Temperature, Composite materials, Epoxy resins, Failure mechanisms
Journal Articles

Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages

P. Tumne, V. Venkatadri, S. Kudtarkar, M. Delaus, D. Santos, R. Havens, K. Srihari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020905.
https://doi.org/10.1115/1.4005906
Published Online: June 11, 2012
View Article titled, Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages
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Topics: Alloys, Design, Failure, Failure mechanisms, Intermetallic compounds, Reliability, Semiconductor wafers, Solders, Separation (Technology), Shock (Mechanics)
Journal Articles

Cracking of the Intermetallic Compound Layer in Solder Joints Under Drop Impact Loading

Tong An, Fei Qin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031004.
https://doi.org/10.1115/1.4004870
Published Online: September 14, 2011
View Article titled, Cracking of the Intermetallic Compound Layer in Solder Joints Under Drop Impact Loading
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Topics: Fracture (Materials), Fracture (Process), Solder joints, Solders, Tin, Intermetallic compounds, Failure mechanisms, Damage