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Journal Articles

Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

Abel Misrak, Tushar Chauhan, Pavan Rajmane, Rabin Bhandari, Dereje Agonafer

J. Electron. Packag. March 2020, 142(1): 011011.

Paper No: EP-19-1064

DOI: https://doi.org/10.1115/1.4045157

Published Online: November 8, 2019

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Topics: Fillers (Materials), Fourier transform infrared spectroscopy, Infrared spectroscopy, Mechanical properties, Stress, Temperature, Testing, Thermomechanics, High temperature, Reliability

Journal Articles

Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density

Tingting Zhang, Bahgat G. Sammakia, Zhihao Yang, Howard Wang

J. Electron. Packag. September 2018, 140(3): 031006.

Paper No: EP-17-1110

DOI: https://doi.org/10.1115/1.4040204

Published Online: June 11, 2018

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Topics: Composite materials, Copper, Density, Nanocomposites, Packing (Shipments), Packings (Cushioning), Particulate matter, Thermal conductivity, Fillers (Materials), Silver

Journal Articles

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model

Pavan Kumar Vaitheeswaran, Ganesh Subbarayan

J. Electron. Packag. June 2018, 140(2): 020901.

Paper No: EP-17-1092

DOI: https://doi.org/10.1115/1.4039136

Published Online: May 9, 2018

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Topics: Elastic moduli, Network models, Particulate matter, Stiffness, Fillers (Materials), Particle size, Mechanical properties

Journal Articles

Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers

Byung-Seung Yim, Young-Eui Shin, Jong-Min Kim

J. Electron. Packag. December 2017, 139(4): 041007.

Paper No: EP-17-1007

DOI: https://doi.org/10.1115/1.4038028

Published Online: October 13, 2017

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Topics: Ball-Grid-Array packaging, Composite materials, Fillers (Materials), Solders, Wetting, Polymers, Melting, Statistical process control, Flow (Dynamics)

Journal Articles

The Effects of Silica Fillers on the Properties of Encapsulation Molding Compounds

Yowching Liaw, Jung-Hua Chou

J. Electron. Packag. September 2017, 139(3): 031007.

Paper No: EP-16-1120

DOI: https://doi.org/10.1115/1.4037145

Published Online: July 10, 2017

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Topics: Fillers (Materials), Molding, Flow (Dynamics), Thermal conductivity, Water absorption, Bending strength

Journal Articles

Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument

Ronald J. Warzoha, Andrew N. Smith, Maurice Harris

J. Electron. Packag. March 2017, 139(1): 011004.

Paper No: EP-16-1075

DOI: https://doi.org/10.1115/1.4035178

Published Online: December 29, 2016

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Topics: Heat, Instrumentation, Probes, Resolution (Optics), Steady state, Uncertainty, Heat flux, Measurement uncertainty, Fillers (Materials), Temperature measurement

Journal Articles

Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks

Thomas Brunschwiler, Jonas Zürcher, Luca Del Carro, Gerd Schlottig, Brian Burg, Severin Zimmermann, Uwe Zschenderlein, Bernhard Wunderle, Florian Schindler-Saefkow, Rahel Stässle

J. Electron. Packag. December 2016, 138(4): 041009.

Paper No: EP-16-1090

DOI: https://doi.org/10.1115/1.4034927

Published Online: October 21, 2016

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Topics: Fillers (Materials), Particulate matter, Cavities, Nanoparticles

Journal Articles

Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging

Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V. Goicochea, Jonas Zürcher, Heiko Wolf

J. Electron. Packag. December 2014, 136(4): 041012.

Paper No: EP-13-1130

DOI: https://doi.org/10.1115/1.4028332

Published Online: September 19, 2014

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Topics: Cavities, Columns (Structural), Copper, Evaporation, Fillers (Materials), Nanoparticles, Particulate matter, Self-assembly, Silver, Temperature

Journal Articles

HDPE Matrix Composites Filled With Ca 4 La 6 (SiO 4 ) 4 (PO 4 ) 2 O 2 for Microwave Substrate Applications

Dhanesh Thomas, Mailadil T. Sebastian

J. Electron. Packag. September 2014, 136(3): 031002.

Paper No: EP-12-1085

DOI: https://doi.org/10.1115/1.4027089

Published Online: May 5, 2014

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Topics: Composite materials, Fillers (Materials), Microwaves

Journal Articles

Oxidized Graphite Nanoplatelets as an Improved Filler for Thermally Conducting Epoxy-Matrix Composites

Xiaobo Sun, Aiping Yu, Palanisamy Ramesh, Elena Bekyarova, Mikhail E. Itkis, Robert C. Haddon

J. Electron. Packag. June 2011, 133(2): 020905.

DOI: https://doi.org/10.1115/1.4003988

Published Online: June 7, 2011

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Topics: Carbon nanotubes, Composite materials, Epoxy adhesives, Epoxy resins, Fillers (Materials), Graphite, Oxidation, Particle size, Polymers, Thermal conductivity

Journal Articles

Thermal Conductivity of Diamond-Containing Grease

Hung-En Chou, Shang-Ray Yang, Sea-Fue Wang, James C. Sung

J. Electron. Packag. December 2010, 132(4): 041015.

DOI: https://doi.org/10.1115/1.4003002

Published Online: December 9, 2010

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Topics: Diamonds, Fillers (Materials), Plasma desorption mass spectrometry, Thermal conductivity, Viscosity

Journal Articles

High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer

Myung Jin Yim, Yi Li, Kyoung Sik Moon, C. P. Wong

J. Electron. Packag. March 2010, 132(1): 011007.

DOI: https://doi.org/10.1115/1.4001229

Published Online: March 19, 2010

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Topics: Adhesives, Coating processes, Coatings, Copper, Particulate matter, Contact resistance, Anisotropy, Polymers, Fillers (Materials)

Journal Articles

Numerical Simulation of Thermal Conductivity of Particle Filled Epoxy Composites

Jun Zeng, Renli Fu, Simeon Agathopoulos, Shaodong Zhang, Xiufeng Song, Hong He

J. Electron. Packag. December 2009, 131(4): 041006.

DOI: https://doi.org/10.1115/1.4000210

Published Online: October 21, 2009

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Topics: Composite materials, Epoxy resins, Fillers (Materials), Particulate matter, Thermal conductivity, Epoxy adhesives, Finite element analysis

Journal Articles

Characterization of Chemical Cure Shrinkage of Epoxy Molding Compound With Application to Warpage Analysis

Guojun Hu, Jing-En Luan, Spencer Chew

J. Electron. Packag. March 2009, 131(1): 011010.

DOI: https://doi.org/10.1115/1.3068321

Published Online: February 13, 2009

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Topics: Epoxy resins, Finite element analysis, Molding, Shrinkage (Materials), Warping, Thermal expansion, Temperature, Fillers (Materials)

Journal Articles

Underfill Filler Settling Effect on the Die Backside Interfacial Stresses of Flip Chip Packages

Cheng-fu Chen, Pramod C. Karulkar

J. Electron. Packag. September 2008, 130(3): 031005.

DOI: https://doi.org/10.1115/1.2957324

Published Online: July 30, 2008

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Topics: Fillers (Materials), Stress, Particulate matter, Flip-chip packages, Flip-chip devices

Journal Articles

On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials

Yoonchan Oh, C. Steve Suh, Hung-Jue Sue

J. Electron. Packag. June 2008, 130(2): 021009.

DOI: https://doi.org/10.1115/1.2912209

Published Online: May 9, 2008

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Topics: Damage, Epoxy resins, Failure mechanisms, Flip-chip, Flip-chip devices, Reliability, Solder joints, Solders, Viscoelasticity, Waves

Journal Articles

High Thermal Conductive Si 3 N 4 Particle Filled Epoxy Composites With a Novel Structure

Hong He, Renli Fu, Yanchun Han, Yuan Shen, Deliu Wang

J. Electron. Packag. December 2007, 129(4): 469–472.

DOI: https://doi.org/10.1115/1.2804097

Published Online: April 4, 2007

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Topics: Ceramics, Composite materials, Epoxy resins, Fillers (Materials), Particulate matter, Polymers, Thermal conductivity, Dielectric losses, Polymer composites

Journal Articles

Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems

Arun Gowda, David Esler, Sandeep Tonapi, Annita Zhong, K. Srihari, Florian Schattenmann

J. Electron. Packag. June 2006, 128(2): 130–136.

DOI: https://doi.org/10.1115/1.2188952

Published Online: February 14, 2006

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Topics: Acoustics, Adhesives, Aluminum, Computerized tomography, Contact resistance, Fillers (Materials), Magnification, Microscopy, Scanning electron microscopy, Silicon

Journal Articles

Development of Novel Filler Technology for No-Flow and Wafer Level Underfill Materials

Slawomir Rubinsztajn, Donald Buckley, John Campbell, David Esler, Eric Fiveland, Ananth Prabhakumar, Donna Sherman, Sandeep Tonapi

J. Electron. Packag. June 2005, 127(2): 77–85.

DOI: https://doi.org/10.1115/1.1846067

Published Online: June 3, 2005

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Topics: Fillers (Materials), Flip-chip devices, Flow (Dynamics), Reliability, Resins, Semiconductor wafers, Flip-chip, Thermal expansion, Epoxy resins, Solder joints

Journal Articles

Adhesive Joining Process and Joint Property With Low Melting Point Filler

Kiyokazu Yasuda, Jong-Min Kim, Kozo Fujimoto

J. Electron. Packag. March 2005, 127(1): 12–17.

DOI: https://doi.org/10.1115/1.1846060

Published Online: March 21, 2005

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Topics: Adhesives, Alloys, Fillers (Materials), Heat conduction, Melting point, Resins, Joining, Copper, Epoxy resins, Self-organization

Journal citation

NARROW

Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model

Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers

The Effects of Silica Fillers on the Properties of Encapsulation Molding Compounds

Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument

Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks

Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging

HDPE Matrix Composites Filled With Ca 4 La 6 (SiO 4 ) 4 (PO 4 ) 2 O 2 for Microwave Substrate Applications

Oxidized Graphite Nanoplatelets as an Improved Filler for Thermally Conducting Epoxy-Matrix Composites

Thermal Conductivity of Diamond-Containing Grease

High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer

Numerical Simulation of Thermal Conductivity of Particle Filled Epoxy Composites

Characterization of Chemical Cure Shrinkage of Epoxy Molding Compound With Application to Warpage Analysis

Underfill Filler Settling Effect on the Die Backside Interfacial Stresses of Flip Chip Packages

On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials

High Thermal Conductive Si 3 N 4 Particle Filled Epoxy Composites With a Novel Structure

Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems

Development of Novel Filler Technology for No-Flow and Wafer Level Underfill Materials

Adhesive Joining Process and Joint Property With Low Melting Point Filler

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