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Journal Articles

Improved Packaging Design for Maximizing the Thermal Performance of Multifinger Collector-Up HBTs

Hsien-Cheng Tseng

Publisher: ASME

J. Electron. Packag. March 2011, 133(1): 014501.

https://doi.org/10.1115/1.4003515

Published Online: March 9, 2011

View Article titled, Improved Packaging Design for Maximizing the Thermal Performance of Multifinger Collector-Up HBTs

Topics: Design, Gallium arsenide, Genetic algorithms, Optimization, Packaging, Thermal resistance, Transistors, Thermal stability, Thermal management

Journal Articles

Novel Design of Thermal-Via Configurations for Collector-Up HBTs

Pei-Hsuan Lee, Hsien-Cheng Tseng, Jung-Hua Chou

Publisher: ASME

J. Electron. Packag. December 2009, 131(4): 044501.

https://doi.org/10.1115/1.4000282

Published Online: October 21, 2009

View Article titled, Novel Design of Thermal-Via Configurations for Collector-Up HBTs

Topics: Design, Finite element model, Gallium arsenide, Temperature, Temperature distribution, Transistors, Finite element analysis, Packaging, Heat

Journal Articles

Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance

Victor Adrian Chiriac, Tien-Yu Tom Lee

Publisher: ASME

J. Electron. Packag. December 2003, 125(4): 589–596.

https://doi.org/10.1115/1.1604804

Published Online: December 15, 2003

View Article titled, Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance

Topics: Gallium arsenide, Metals, Temperature, Thermal conductivity, Wall thickness, Thermal resistance

Journal Articles

Finite Element Modelling of Flip Chip Gold-Gold Thermocompression Bonding

J. Puigcorbe´, S. Marco, S. Leseduarte, M. Carmona, O. Vendier, C. Devron, S. L. Delage, D. Floriot, H. Blanck

Publisher: ASME

J. Electron. Packag. December 2003, 125(4): 549–555.

https://doi.org/10.1115/1.1604157

Published Online: December 15, 2003

View Article titled, Finite Element Modelling of Flip Chip Gold-Gold Thermocompression Bonding

Topics: Bonding, Creep, Finite element analysis, Flip-chip devices, Modeling, Optimization, Stress, Temperature, Transistors, Gallium arsenide

Journal Articles

Analysis of Substrates for Single Emitter Laser Diodes

Tapani M. Alander, Pekka A. Heino, Eero O. Ristolainen

Publisher: ASME

J. Electron. Packag. September 2003, 125(3): 313–318.

https://doi.org/10.1115/1.1527657

Published Online: September 17, 2003

View Article titled, Analysis of Substrates for Single Emitter Laser Diodes

Topics: Lasers, Stress, Bonding, Thermal conductivity, Ceramics, Temperature, Gallium arsenide

Journal Articles

Die Cracking at Solder (In60-Pb40) Joints on Brittle (GaAs) Chips: Fracture Correlation Using Critical Bimaterial Interface Corner Stress Intensities

Bingzhi Su, Y. C. Lee, Martin L. Dunn

Publisher: ASME

J. Electron. Packag. September 2003, 125(3): 369–377.

https://doi.org/10.1115/1.1602702

Published Online: September 17, 2003

View Article titled, Die Cracking at Solder (In60-Pb40) Joints on Brittle (GaAs) Chips: Fracture Correlation Using Critical Bimaterial Interface Corner Stress Intensities

Topics: Corners (Structural elements), Fracture (Materials), Fracture (Process), Gallium arsenide, Geometry, Solders, Stress, Brittleness, Temperature, Finite element analysis

Journal Articles

Thermal Management Enhancement for GaAs Devices Using CVD Diamond Heat Spreaders in a Plastic Package Environment

Philip M. Fabis, Henry Windischmann

Publisher: ASME

J. Electron. Packag. June 2000, 122(2): 92–97.

https://doi.org/10.1115/1.483139

Published Online: September 21, 1999

View Article titled, Thermal Management Enhancement for GaAs Devices Using CVD Diamond Heat Spreaders in a Plastic Package Environment

Topics: Gallium arsenide, Synthetic diamonds, Thermal management, Flat heat pipes, Packaging

Journal Articles

Failure Estimation of Semiconductor Chip During Wire Bonding Process

T. Ikeda, N. Miyazaki, K. Kudo, K. Arita, H. Yakiyama

Publisher: ASME

J. Electron. Packag. June 1999, 121(2): 85–91.

https://doi.org/10.1115/1.2792672

Published Online: June 1, 1999

View Article titled, Failure Estimation of Semiconductor Chip During Wire Bonding Process

Topics: Failure, Semiconductors (Materials), Wire bonding, Gallium arsenide, Pressure, Wire, Cycles, Deformation, Electronic packaging, Metals

Journal Articles

Temperature Dependence of the Mechanical Properties of GaAs Wafers

Jun Ming Hu, Michael Pecht

Publisher: ASME

J. Electron. Packag. December 1991, 113(4): 331–336.

https://doi.org/10.1115/1.2905416

Published Online: December 1, 1991

View Article titled, Temperature Dependence of the Mechanical Properties of GaAs Wafers

Topics: Gallium arsenide, Mechanical properties, Semiconductor wafers, Temperature effects, Materials properties, Temperature, Bending strength, Design, Elastic moduli, Elemental semiconductors

Journal citation

NARROW

Improved Packaging Design for Maximizing the Thermal Performance of Multifinger Collector-Up HBTs

Novel Design of Thermal-Via Configurations for Collector-Up HBTs

Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance

Finite Element Modelling of Flip Chip Gold-Gold Thermocompression Bonding

Analysis of Substrates for Single Emitter Laser Diodes

Die Cracking at Solder (In60-Pb40) Joints on Brittle (GaAs) Chips: Fracture Correlation Using Critical Bimaterial Interface Corner Stress Intensities

Thermal Management Enhancement for GaAs Devices Using CVD Diamond Heat Spreaders in a Plastic Package Environment

Failure Estimation of Semiconductor Chip During Wire Bonding Process

Temperature Dependence of the Mechanical Properties of GaAs Wafers

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