1-20 of 78
Heat conduction
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning

Linmeng Xu, Wanying Zhao, Junhui Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031010.
Paper No: EP-22-1063
https://doi.org/10.1115/1.4062530
Published Online: June 23, 2023
View Article titled, Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning
Open the PDF for Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning in another window
Topics: Convection, Cooling, Cycles, Heat, Temperature, Heat conduction, Optimization, Thermal resistance, Matlab, Energy dissipation
Journal Articles

Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation

Hsien-Chie Cheng, Yan-Cheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021005.
Paper No: EP-22-1012
https://doi.org/10.1115/1.4055591
Published Online: September 28, 2022
View Article titled, Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation
Open the PDF for Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation in another window
Topics: Capacitance, Circuits, Computational fluid dynamics, Energy dissipation, Heat conduction, Junctions, Modeling, MOSFET transistors, Network models, Power conversion systems
Journal Articles

Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs

Han-Ling Li, Yang Shen, Yu-Chao Hua, S. L. Sobolev, Bing-Yang Cao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011203.
Paper No: EP-22-1007
https://doi.org/10.1115/1.4054698
Published Online: July 13, 2022
View Article titled, Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs
Open the PDF for Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs in another window
Topics: Diffusion (Physics), Gallium nitride, Heat, Heating, Modeling, Phonons, Simulation, Temperature, Heat conduction, Junctions
Journal Articles

Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

Kidus Guye, De Dong, Yunseo Kim, Hyoungsoon Lee, Baris Dogruoz, Damena Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041106.
Paper No: EP-21-1120
https://doi.org/10.1115/1.4052465
Published Online: October 13, 2021
View Article titled, Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer
Open the PDF for Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer in another window
Topics: Design, Drops, Evaporation, Heat conduction, Heat transfer, Heat transfer coefficients, Optimization, Particle swarm optimization, Shapes, Vapors
Journal Articles

Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods

Patrick Krane, David Gonzalez Cuadrado, Francisco Lozano, Guillermo Paniagua, Amy Marconnet
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011008.
Paper No: EP-20-1121
https://doi.org/10.1115/1.4050200
Published Online: August 6, 2021
View Article titled, Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods
Open the PDF for Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods in another window
Topics: Electronic packages, Heat, Temperature, Errors, Heat conduction
Journal Articles

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

Nathaniel J. O'Connor, Alexander J. Castaneda, Pavolas N. Christidis, Nicolas Vayas Tobar, Michal Talmor, Jamal Yagoobi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041105.
Paper No: EP-20-1021
https://doi.org/10.1115/1.4047459
Published Online: June 23, 2020
View Article titled, Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling
Open the PDF for Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling in another window
Topics: Computer cooling, Electrohydrodynamics, Flow (Dynamics), Fluids, Heat conduction, Pumps, Electrodes, Design, Electric fields
Journal Articles

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

David Gonzalez Cuadrado, Amy Marconnet, Guillermo Paniagua
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010905.
Paper No: EP-17-1099
https://doi.org/10.1115/1.4039026
Published Online: March 2, 2018
View Article titled, Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips
Open the PDF for Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips in another window
Topics: Heat conduction, Heat flux, Heat transfer, Integrated circuits, Interpolation, Optimization, Sensors, Temperature, Temperature sensors, Genetic algorithms
Journal Articles

Transient Data Processing of Flow Boiling Local Heat Transfer in a Multi-Microchannel Evaporator Under a Heat Flux Disturbance

Houxue Huang, Nicolas Lamaison, John R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011005.
Paper No: EP-16-1083
https://doi.org/10.1115/1.4035386
Published Online: January 5, 2017
View Article titled, Transient Data Processing of Flow Boiling Local Heat Transfer in a Multi-Microchannel Evaporator Under a Heat Flux Disturbance
Open the PDF for Transient Data Processing of Flow Boiling Local Heat Transfer in a Multi-Microchannel Evaporator Under a Heat Flux Disturbance in another window
Topics: Boiling, Flow (Dynamics), Fluids, Heat conduction, Heat flux, Heat transfer, Heat transfer coefficients, Microchannels, Pressure drop, Temperature
Journal Articles

A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction

Cheng Chen, James Geer, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041008.
Paper No: EP-16-1053
https://doi.org/10.1115/1.4034856
Published Online: October 20, 2016
View Article titled, A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction
Open the PDF for A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction in another window
Topics: Diffusion (Physics), Heat conduction, Lattice Boltzmann methods, Phonons, Silicon, Temperature, Thermal conductivity, Density, Heat, Equilibrium (Physics)
Journal Articles

Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities

Tom Saenen, John R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010901.
Paper No: EP-15-1091
https://doi.org/10.1115/1.4032490
Published Online: March 10, 2016
View Article titled, Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities
Open the PDF for Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities in another window
Topics: Flow (Dynamics), Heat conduction, Microchannels, Algorithms, Simulation, Stability
Journal Articles

Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices

Hyoungsoon Lee, Damena D. Agonafer, Yoonjin Won, Farzad Houshmand, Catherine Gorle, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010907.
Paper No: EP-15-1104
https://doi.org/10.1115/1.4032655
Published Online: March 10, 2016
View Article titled, Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices
Open the PDF for Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices in another window
Topics: Boiling, Computational fluid dynamics, Flow (Dynamics), Flux (Metallurgy), Gallium nitride, Heat conduction, Heat transfer coefficients, Microchannels, Microcoolers, Simulation
Journal Articles

Natural Convection Immersion Cooling With Enhanced Optical Performance of Light-Emitting Diode Systems

Enes Tamdogan, Mehmet Arik
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041006.
Paper No: EP-14-1089
https://doi.org/10.1115/1.4031480
Published Online: October 15, 2015
View Article titled, Natural Convection Immersion Cooling With Enhanced Optical Performance of Light-Emitting Diode Systems
Open the PDF for Natural Convection Immersion Cooling With Enhanced Optical Performance of Light-Emitting Diode Systems in another window
Topics: Cooling, Heat transfer, Light-emitting diodes, Natural convection, Silicones, Heat conduction, Convection, Fluids, Domes (Structural elements), Coolants
Journal Articles

Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model

Wataru Nakayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2013, 135(3): 034501.
Paper No: EP-11-1100
https://doi.org/10.1115/1.4024367
Published Online: June 4, 2013
View Article titled, Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model
Open the PDF for Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model in another window
Topics: Heat, Heat conduction, Temperature, Thermal conductivity, Electronic equipment
Journal Articles

Study on Heat Conduction in a Simulated Multicore Processor Chip—Part II: Case Studies

Wataru Nakayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021003.
Paper No: EP-12-1032
https://doi.org/10.1115/1.4023292
Published Online: March 28, 2013
View Article titled, Study on Heat Conduction in a Simulated Multicore Processor Chip—Part II: Case Studies
Open the PDF for Study on Heat Conduction in a Simulated Multicore Processor Chip—Part II: Case Studies in another window
Topics: Cooling, Heat, Heat transfer coefficients, Temperature, Heat conduction, Heat sinks, Dimensions
Journal Articles

Study on Heat Conduction in a Simulated Multicore Processor Chip—Part I: Analytical Modeling

Wataru Nakayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021002.
Paper No: EP-12-1031
https://doi.org/10.1115/1.4023291
Published Online: March 28, 2013
View Article titled, Study on Heat Conduction in a Simulated Multicore Processor Chip—Part I: Analytical Modeling
Open the PDF for Study on Heat Conduction in a Simulated Multicore Processor Chip—Part I: Analytical Modeling in another window
Topics: Heat, Temperature, Heat conduction
Journal Articles

Conjugate Thermal Analysis of Air-Cooled Discrete Flush-Mounted Heat Sources in a Horizontal Channel

Jing He, Liping Liu, Anthony M. Jacobi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041001.
https://doi.org/10.1115/1.4005299
Published Online: November 17, 2011
View Article titled, Conjugate Thermal Analysis of Air-Cooled Discrete Flush-Mounted Heat Sources in a Horizontal Channel
Open the PDF for Conjugate Thermal Analysis of Air-Cooled Discrete Flush-Mounted Heat Sources in a Horizontal Channel in another window
Topics: Convection, Emissivity, Heat, Radiation (Physics), Temperature, Thermal analysis, Thermal conductivity, Heat transfer, Heat conduction, Flow (Dynamics)
Journal Articles

Conjugate Thermal Transport in Gas Flow in Long Rectangular Microchannel

Zhanyu Sun, Yogesh Jaluria
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021008.
https://doi.org/10.1115/1.4004218
Published Online: June 23, 2011
View Article titled, Conjugate Thermal Transport in Gas Flow in Long Rectangular Microchannel
Open the PDF for Conjugate Thermal Transport in Gas Flow in Long Rectangular Microchannel in another window
Topics: Bronze, Gas flow, Heat flux, Heat transfer, Microchannels, Nitrogen, Slip flow, Temperature, Thermal conductivity, Silicon nitride ceramics
Journal Articles

Heat Transfer of an IGBT Module Integrated With a Vapor Chamber

Xiaoling Yu, Lianghua Zhang, Enming Zhou, Quanke Feng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011008.
https://doi.org/10.1115/1.4003214
Published Online: March 10, 2011
View Article titled, Heat Transfer of an IGBT Module Integrated With a Vapor Chamber
Open the PDF for Heat Transfer of an IGBT Module Integrated With a Vapor Chamber in another window
Topics: Circuits, Copper, Heat, Heat transfer, Junctions, Stress, Temperature, Thermal conductivity, Thermal resistance, Transients (Dynamics)
Journal Articles

The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks

Christopher T. DeGroot, Derek Gateman, Anthony G. Straatman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041007.
https://doi.org/10.1115/1.4002724
Published Online: November 24, 2010
View Article titled, The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks
Open the PDF for The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks in another window
Topics: Contact resistance, Heat sinks, Heat transfer, Metal foams, Fluids, Fins, Aluminum, Convection, Heat conduction, Epoxy adhesives
Journal Articles

An Inverse Problem in Estimating the Volumetric Heat Generation for a Three-Dimensional Encapsulated Chip

Cheng-Hung Huang, Wei-Lun Chang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011004.
https://doi.org/10.1115/1.4000720
Published Online: March 4, 2010
View Article titled, An Inverse Problem in Estimating the Volumetric Heat Generation for a Three-Dimensional Encapsulated Chip
Open the PDF for An Inverse Problem in Estimating the Volumetric Heat Generation for a Three-Dimensional Encapsulated Chip in another window
Topics: Heat, Inverse problems, Temperature, Heat conduction, Errors