1-18 of 18
Mechanical behavior
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Assembly Reliability and Molding Material Comparison of Miniature Integrated High Power Module With Insulated Metal Substrate

Chang-Chun Lee, Kuo-Shu Kao, Chi-Wei Wang, Tai-Jyun Yu, Tai-Kuang Lee, Po-Kai Chiu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021101.
Paper No: EP-21-1047
https://doi.org/10.1115/1.4052072
Published Online: September 13, 2021
View Article titled, Assembly Reliability and Molding Material Comparison of Miniature Integrated High Power Module With Insulated Metal Substrate
Open the PDF for Assembly Reliability and Molding Material Comparison of Miniature Integrated High Power Module With Insulated Metal Substrate in another window
Topics: Manufacturing, Metals, Molding materials, Reliability, Silicones, Solders, Epoxy resins, Finite element analysis, Mechanical behavior
Journal Articles

Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint

Yang Liu, Zhao Li, Min Zhou, Xianghua Zeng, Fenglian Sun
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031002.
Paper No: EP-20-1047
https://doi.org/10.1115/1.4049128
Published Online: January 19, 2021
View Article titled, Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint
Open the PDF for Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint in another window
Topics: Bonding, Coating processes, Coatings, Composite materials, Mechanical behavior, Shear (Mechanics), Shear strength, Sintering, Fracture (Materials), Deformation
Journal Articles

Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation

Leila Ladani, Ousama Abdelhadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2015, 137(1): 014501.
Paper No: EP-13-1116
https://doi.org/10.1115/1.4027992
Published Online: October 6, 2014
View Article titled, Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation
Open the PDF for Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation in another window
Topics: Intermetallic compounds, Mechanical properties, Nanoindentation, Solder joints, Tin, Mechanical behavior, Size effect, Elastic moduli, Yield strength, Stress
Journal Articles

Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections

Ping Nicole An, Paul A. Kohl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041004.
https://doi.org/10.1115/1.4005289
Published Online: December 9, 2011
View Article titled, Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections
Open the PDF for Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections in another window
Topics: Boundary-value problems, Columns (Structural), Copper, Deformation, Density, Displacement, Errors, Finite element analysis, Finite element model, Modeling
Journal Articles

Multiscale Mechanics in Microelectronics: A Paradigm in Miniaturization

M. G. D. Geers, V. Kouznetsova, W. A. M. Brekelmans
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 255–261.
https://doi.org/10.1115/1.1939007
Published Online: June 24, 2004
View Article titled, Multiscale Mechanics in Microelectronics: A Paradigm in Miniaturization
Open the PDF for Multiscale Mechanics in Microelectronics: A Paradigm in Miniaturization in another window
Topics: Continuum mechanics, Deformation, Dislocations, Lumber, Microelectronic devices, Plasticity, Strain gradient, Boundary-value problems, Metals, Stress
Journal Articles

Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages

K. N. Chiang, Associate Professor, C. W. Chang, Graduate Student, C. T. Lin, Graduate Student
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section On Therminic
J. Electron. Packag. December 2001, 123(4): 331–337.
https://doi.org/10.1115/1.1389847
Published Online: May 10, 2001
View Article titled, Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages
Open the PDF for Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages in another window
Topics: Adhesives, Finite element analysis, Flip-chip devices, Manufacturing, Modeling, Particulate matter, Pressure, Springs, Mechanical behavior, Flip-chip packages
Journal Articles

Modeling of the Mechanical Behavior of Materials in “High-Tech” Systems: Attributes and Review

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial Paper
J. Electron. Packag. December 1999, 121(4): 213–221.
https://doi.org/10.1115/1.2793843
Published Online: December 1, 1999
View Article titled, Modeling of the Mechanical Behavior of Materials in “High-Tech” Systems: Attributes and Review
Open the PDF for Modeling of the Mechanical Behavior of Materials in “High-Tech” Systems: Attributes and Review in another window
Topics: Mechanical behavior, Modeling, Mathematics, Microelectronic devices, Optical fiber, Photonics
Journal Articles

Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry

B. Han, Y. Guo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 185–191.
https://doi.org/10.1115/1.2792090
Published Online: September 1, 1995
View Article titled, Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry
Open the PDF for Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry in another window
Topics: Electronic packaging, Interferometry, Thermal deformation, Deformation, Packaging, Design, Displacement measurement, Mechanical behavior, Optimization, Product development
Journal Articles

How Compliant Should a Die-Attachment be to Protect the Chip From Substrate Bowing?

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 1995, 117(1): 88–92.
https://doi.org/10.1115/1.2792073
Published Online: March 1, 1995
View Article titled, How Compliant Should a Die-Attachment be to Protect the Chip From Substrate Bowing?
Open the PDF for How Compliant Should a Die-Attachment be to Protect the Chip From Substrate Bowing? in another window
Topics: Adhesives, Bending (Stress), Diluents, Elastic constants, Epoxy adhesives, Manufacturing, Mechanical behavior, Rails, Silicones, Stiffness
Journal Articles

Some Effects of Water Immersion on the Mechanical Behavior of a Polyimide Film

B. D. Harper, J. M. Rao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 317–319.
https://doi.org/10.1115/1.2905704
Published Online: December 1, 1994
View Article titled, Some Effects of Water Immersion on the Mechanical Behavior of a Polyimide Film
Open the PDF for Some Effects of Water Immersion on the Mechanical Behavior of a Polyimide Film in another window
Topics: Mechanical behavior, Water, Creep, Polymers, Stiffness, Stress, Temperature
Journal Articles

Elasto-Plastic Large Deflection Analysis of a Copper Film

J. H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 221–225.
https://doi.org/10.1115/1.2906421
Published Online: June 1, 1992
View Article titled, Elasto-Plastic Large Deflection Analysis of a Copper Film
Open the PDF for Elasto-Plastic Large Deflection Analysis of a Copper Film in another window
Topics: Copper, Deflection, Ductility, Pressure, Stress, Finite element methods, Mechanical behavior
Journal Articles

Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling

Yi-Hsin Pao, Scott Badgley, Ratan Govila, Linda Baumgartner, Richard Allor, Ron Cooper
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 135–144.
https://doi.org/10.1115/1.2906410
Published Online: June 1, 1992
View Article titled, Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling
Open the PDF for Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling in another window
Topics: Mechanical behavior, Solder joints, Fracture (Process), Solders, Stress, Creep, Fatigue, Shear stress, Adhesives, Alloys
Journal Articles

Understanding the Cyclic Mechanical Behavior of Lead/Tin Solder

J. K. Tien, B. C. Hendrix, A. I. Attarwala
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 115–120.
https://doi.org/10.1115/1.2905376
Published Online: June 1, 1991
View Article titled, Understanding the Cyclic Mechanical Behavior of Lead/Tin Solder
Open the PDF for Understanding the Cyclic Mechanical Behavior of Lead/Tin Solder in another window
Topics: Mechanical behavior, Solders, Creep, Stress, Temperature, Damage, Deformation, Storage, Testing
Journal Articles

Stiffness and Fatigue Study for Surface Mounted Module/Lead/Card Systems

P. A. Engel, D. V. Caletka, M. R. Palmer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 129–137.
https://doi.org/10.1115/1.2905378
Published Online: June 1, 1991
View Article titled, Stiffness and Fatigue Study for Surface Mounted Module/Lead/Card Systems
Open the PDF for Stiffness and Fatigue Study for Surface Mounted Module/Lead/Card Systems in another window
Topics: Fatigue, Stiffness, Circuits, Stress, Bending (Stress), Computation, Die cutting, Failure, Fatigue strength, Fatigue testing
Journal Articles

Mechanical Behavior of Flip-Chip Encapsulants

E. Suhir, J. M. Segelken
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 327–332.
https://doi.org/10.1115/1.2904385
Published Online: December 1, 1990
View Article titled, Mechanical Behavior of Flip-Chip Encapsulants
Open the PDF for Mechanical Behavior of Flip-Chip Encapsulants in another window
Topics: Flip-chip, Mechanical behavior, Stress, Design, Epoxy adhesives, Epoxy resins, Silicones, Failure, Mechanical properties, Preferences
Journal Articles

Double-Sided “Velcro-Type” Input/Output Contactor Interface Design: Mechanical Behavior of Elastic Contactors

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 1990, 112(4): 383–386.
https://doi.org/10.1115/1.2904393
Published Online: December 1, 1990
View Article titled, Double-Sided “Velcro-Type” Input/Output Contactor Interface Design: Mechanical Behavior of Elastic Contactors
Open the PDF for Double-Sided “Velcro-Type” Input/Output Contactor Interface Design: Mechanical Behavior of Elastic Contactors in another window
Topics: Design, Mechanical behavior, Density, Electronic packaging, Metals
Journal Articles

Mechanical Evaluation of the “Euler” Test Probe

E. Suhir, W. E. Benedetto
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 1990, 112(1): 75–77.
https://doi.org/10.1115/1.2904344
Published Online: March 1, 1990
View Article titled, Mechanical Evaluation of the “Euler” Test Probe
Open the PDF for Mechanical Evaluation of the “Euler” Test Probe in another window
Topics: Probes, Wire, Stress, Buckling, Deflection, Design, Mechanical behavior
Journal Articles

Thermal Stress Analysis of SMT PQFP Packages and Interconnections

J. H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1989, 111(1): 2–8.
https://doi.org/10.1115/1.3226505
Published Online: March 1, 1989
View Article titled, Thermal Stress Analysis of SMT PQFP Packages and Interconnections
Open the PDF for Thermal Stress Analysis of SMT PQFP Packages and Interconnections in another window
Topics: Thermal stresses, Manufacturing, Solder joints, Stress, Design, Finite element methods, Mechanical behavior, Reliability, Surface mount assemblies