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Journal Articles

Mechanical Testing for Stretchable Electronics

Steven A. Klein, Aleksandar Aleksov, Vijay Subramanian, Pramod Malatkar, Ravi Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020905.
Paper No: EP-16-1147
https://doi.org/10.1115/1.4036389
Published Online: April 28, 2017
View Article titled, Mechanical Testing for Stretchable Electronics
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Topics: Electronics, Failure, Mechanical testing, Testing, Tension, Membranes, Reliability, Cycles
Journal Articles

Characterizing the Failure Envelope of a Conductive Adhesive

D. Olliff, J. Qu, M. Gaynes, R. Kodnani, A. Zubelewicz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 23–30.
https://doi.org/10.1115/1.2792657
Published Online: March 1, 1999
View Article titled, Characterizing the Failure Envelope of a Conductive Adhesive
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Topics: Adhesives, Failure, Shear (Mechanics), Coulombs, Tension, Bonding, Compression, Copper, Finite element model, Mechanical testing
Journal Articles

Damage Boundary Curves: A Computational (FEM) Approach

D. V. Caletka, R. N. Caldwell, J. T. Vogelmann
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1990, 112(3): 198–203.
https://doi.org/10.1115/1.2904367
Published Online: September 1, 1990
View Article titled, Damage Boundary Curves: A Computational (FEM) Approach
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Topics: Damage, Finite element methods, Failure, Transients (Dynamics), Deflection, Design, Dynamic analysis, Dynamics (Mechanics), Electronic packages, Failure mechanisms