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Journal Articles

Characterization of Bulk and Thin Film Fracture in Electronic Packaging

Vijay Subramanian, Kyle Yazzie, Tsgereda Alazar, Bharat Penmecha, Pilin Liu, Yiqun Bai, Pramod Malatkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020912.
Paper No: EP-17-1010
https://doi.org/10.1115/1.4036661
Published Online: June 12, 2017
View Article titled, Characterization of Bulk and Thin Film Fracture in Electronic Packaging
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Topics: Failure, Fracture (Materials), Fracture toughness, Solder masks, Stress, Thin films, Membranes, Fracture (Process), Electronic packaging, Testing
Journal Articles

Mechanical Testing for Stretchable Electronics

Steven A. Klein, Aleksandar Aleksov, Vijay Subramanian, Pramod Malatkar, Ravi Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020905.
Paper No: EP-16-1147
https://doi.org/10.1115/1.4036389
Published Online: April 28, 2017
View Article titled, Mechanical Testing for Stretchable Electronics
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Topics: Electronics, Failure, Mechanical testing, Testing, Tension, Membranes, Reliability, Cycles
Journal Articles

Modular Microfluidic Filters Based on Transparent Membranes

E. Archibong, H. Tuazon, H. Wang, J. Winskas, A. L. Pyayt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041002.
Paper No: EP-16-1049
https://doi.org/10.1115/1.4034369
Published Online: August 19, 2016
View Article titled, Modular Microfluidic Filters Based on Transparent Membranes
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Topics: Filters, Filtration, Membranes, Microfluidics, Particulate matter, Transparency, Manufacturing, Microparticles
Journal Articles

An Overmolded Pressure Sensor Package Using an Ultrathick Photoresist Sacrificial Layer

Lung-Tai Chen, Wood-Hi Cheng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031013.
https://doi.org/10.1115/1.3144156
Published Online: July 31, 2009
View Article titled, An Overmolded Pressure Sensor Package Using an Ultrathick Photoresist Sacrificial Layer
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Topics: Photoresists, Pressure sensors, Packaging, Membranes, Finite element model
Journal Articles

Modeling the Thermal Actuation in a Thermo-Pneumatic Micropump

M. Carmona, S. Marco, J. Samitier, M. C. Acero, J. A. Plaza, J. Esteve
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 527–530.
https://doi.org/10.1115/1.1604154
Published Online: December 15, 2003
View Article titled, Modeling the Thermal Actuation in a Thermo-Pneumatic Micropump
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Topics: Micropumps, Simulation, Finite element methods, Engineering simulation, Modeling, Membranes, Thermomechanics
Journal Articles

Nonlinear Dynamic Response of a Printed Circuit Board to Shock Loads Applied to Its Support Contour

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1992, 114(4): 368–377.
https://doi.org/10.1115/1.2905467
Published Online: December 1, 1992
View Article titled, Nonlinear Dynamic Response of a Printed Circuit Board to Shock Loads Applied to Its Support Contour
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Topics: Dynamic response, Printed circuit boards, Shock (Mechanics), Stress, Deflection, Dimensions, Electronic components, Membranes
Journal Articles

Mechanical Modeling of Multilayered Films on an Elastic Substrate—Part I: Analysis

F. Erdogan, P. F. Joseph
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 309–316.
https://doi.org/10.1115/1.2904383
Published Online: December 1, 1990
View Article titled, Mechanical Modeling of Multilayered Films on an Elastic Substrate—Part I: Analysis
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Topics: Modeling, Stress, Fracture (Materials), Membranes, Shear (Mechanics), Temperature