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Journal Articles

Analytical Solution for Electronic Assemblies Under Vibration

Mohammad A. Gharaibeh, Quang T. Su, James M. Pitarresi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 011003.
Paper No: EP-15-1113
https://doi.org/10.1115/1.4032497
Published Online: March 10, 2016
View Article titled, Analytical Solution for Electronic Assemblies Under Vibration
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Topics: Finite element analysis, Mode shapes, Solder joints, Solders, Stiffness, Stress, Vibration, Manufacturing, Deflection, Modal analysis
Journal Articles

Quality Inspection of Flip Chip Solder Bumps Using Integrated Analytical, Numerical, and Experimental Modal Analyses

Jin Yang, I. Charles Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031009.
https://doi.org/10.1115/1.2957328
Published Online: August 1, 2008
View Article titled, Quality Inspection of Flip Chip Solder Bumps Using Integrated Analytical, Numerical, and Experimental Modal Analyses
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Topics: Flip-chip, Flip-chip devices, Inspection, Lasers, Modal analysis, Solders, Ultrasound, Mode shapes
Journal Articles

A Simple Technique for Maximizing the Fundamental Frequency of Vibrating Structures

J. H. Ong, G. H. Lim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 341–349.
https://doi.org/10.1115/1.1289632
Published Online: February 25, 2000
View Article titled, A Simple Technique for Maximizing the Fundamental Frequency of Vibrating Structures
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Topics: Boundary-value problems, Mode shapes, Optimization, Printed circuit boards, Vibration, Finite element analysis, Cantilevers, Algorithms, Density, Plates (structures)
Journal Articles

Random Change of Vibration Modes in Thermosonic Bonding

S.-Y. Kang, K. Chuang, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 253–258.
https://doi.org/10.1115/1.2792630
Published Online: September 1, 1998
View Article titled, Random Change of Vibration Modes in Thermosonic Bonding
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Topics: Bonding, Vibration, Friction, End effectors, Excitation, Flip-chip assemblies, Generators, Modal analysis, Process control, Resonance
Journal Articles

Structural Analyses of Spacecraft Electronic Packages

S. Kannappan, V. Kunukkassril
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 1992, 114(1): 96–99.
https://doi.org/10.1115/1.2905449
Published Online: March 1, 1992
View Article titled, Structural Analyses of Spacecraft Electronic Packages
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Topics: Electronic packages, Space vehicles, Structural analysis, Finite element methods, Stress, Computer software, Design, Electronics, Manufacturing, Modal analysis
Journal Articles

Experimental Modal Analysis and Dynamic Response Prediction of PC Boards With Surface Mount Electronic Components

Tin-Lup Wong, Karl K. Stevens, Gang Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 244–249.
https://doi.org/10.1115/1.2905402
Published Online: September 1, 1991
View Article titled, Experimental Modal Analysis and Dynamic Response Prediction of PC Boards With Surface Mount Electronic Components
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Topics: Dynamic models, Dynamic response, Electronic components, Lumber, Modal analysis, Mode shapes, Structural dynamics, Surface mount components, Surface mount packaging, Testing