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Journal Articles

Thermal Transport in Self-Assembled Conductive Networks for Thermal Interface Materials

Lin Hu, William Evans, Pawel Keblinski

Publisher: ASME

J. Electron. Packag. June 2011, 133(2): 021002.

https://doi.org/10.1115/1.4003865

Published Online: June 22, 2011

View Article titled, Thermal Transport in Self-Assembled Conductive Networks for Thermal Interface Materials

Topics: Composite materials, Nanoparticles, Particulate matter, Simulation, Thermal conductivity, Wetting, Self-assembly, Molecular dynamics simulation

Journal Articles

The Unravelling of Open-Ended Single Walled Carbon Nanotubes Using Molecular Dynamics Simulations

Tarek Ragab, Cemal Basaran

Publisher: ASME

J. Electron. Packag. June 2011, 133(2): 020903.

https://doi.org/10.1115/1.4003866

Published Online: June 7, 2011

View Article titled, The Unravelling of Open-Ended Single Walled Carbon Nanotubes Using Molecular Dynamics Simulations

Topics: Atoms, Carbon nanotubes, Chain, Displacement, Failure, Molecular dynamics simulation, Nanotubes, Simulation, Single-walled carbon nanotubes, Stress

Journal Articles

The Effects of Thermal Loading on the Mechanical Properties of Interfaces of Dissimilar Materials by Nanoindentation Simulations

Ningbo Liao, Ping Yang, Miao Zhang, Wei Xue

Publisher: ASME

J. Electron. Packag. June 2011, 133(2): 020901.

https://doi.org/10.1115/1.4003513

Published Online: June 7, 2011

View Article titled, The Effects of Thermal Loading on the Mechanical Properties of Interfaces of Dissimilar Materials by Nanoindentation Simulations

Topics: Mechanical properties, Nanoindentation, Simulation, Young's modulus, Molecular dynamics simulation, Heat transfer

Journal Articles

Molecular Dynamics Simulation of Thermal Cycling Test in Electronic Packaging

Hai Bo Fan, Edward K. L. Chan, Cell K. Y. Wong, Matthew M. F. Yuen

Publisher: ASME

J. Electron. Packag. March 2007, 129(1): 35–40.

https://doi.org/10.1115/1.2429707

Published Online: March 14, 2006

View Article titled, Molecular Dynamics Simulation of Thermal Cycling Test in Electronic Packaging

Topics: Adhesion, Electronic packaging, Molecular dynamics simulation, Reliability, Epoxy resins, Simulation, Cycles, Copper, Molecular dynamics

Journal citation

NARROW

Thermal Transport in Self-Assembled Conductive Networks for Thermal Interface Materials

The Unravelling of Open-Ended Single Walled Carbon Nanotubes Using Molecular Dynamics Simulations

The Effects of Thermal Loading on the Mechanical Properties of Interfaces of Dissimilar Materials by Nanoindentation Simulations

Molecular Dynamics Simulation of Thermal Cycling Test in Electronic Packaging

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

Thermal Transport in Self-Assembled Conductive Networks for Thermal Interface Materials

The Unravelling of Open-Ended Single Walled Carbon Nanotubes Using Molecular Dynamics Simulations

The Effects of Thermal Loading on the Mechanical Properties of Interfaces of Dissimilar Materials by Nanoindentation Simulations

Molecular Dynamics Simulation of Thermal Cycling Test in Electronic Packaging

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

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