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Journal Articles

Two-Phase Flow Control of Electronics Cooling With Pseudo-CPUs in Parallel Flow Circuits: Dynamic Modeling and Experimental Evaluation

Nicolas Lamaison, Jackson Braz Marcinichen, John Richard Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 030908.
Paper No: EP-12-1088
https://doi.org/10.1115/1.4024590
Published Online: July 24, 2013
View Article titled, Two-Phase Flow Control of Electronics Cooling With Pseudo-CPUs in Parallel Flow Circuits: Dynamic Modeling and Experimental Evaluation
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Topics: Cooling, Flow (Dynamics), Heat, Simulation, Transients (Dynamics), Vapors, Two-phase flow, Temperature, Pipes, Steady state
Journal Articles

Numerical and Experimental Study of the Effect of Underfloor Blockages on Data Center Performance

Siddharth Bhopte, Bahgat Sammakia, Madhusudan Iyengar, Roger Schmidt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011007.
https://doi.org/10.1115/1.4003603
Published Online: March 9, 2011
View Article titled, Numerical and Experimental Study of the Effect of Underfloor Blockages on Data Center Performance
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Topics: Data centers, Flow (Dynamics), Pipes, Tiles, Computer simulation, Air flow
Journal Articles

An Experimental Investigation in the Performance of Water-Filled Silicon Microheat Pipe Arrays

D. K. Harris, A. Palkar, G. Wonacott, R. Dean, F. Simionescu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021005.
https://doi.org/10.1115/1.4001745
Published Online: June 23, 2010
View Article titled, An Experimental Investigation in the Performance of Water-Filled Silicon Microheat Pipe Arrays
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Topics: Manufacturing, Pipes, Silicon, Testing, Thermal conductivity, Water, Temperature, Thermal resistance
Journal Articles

Numerical Modeling of Perforated Tile Flow Distribution in a Raised-Floor Data Center

Emad Samadiani, Jeffrey Rambo, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021002.
https://doi.org/10.1115/1.4001589
Published Online: May 20, 2010
View Article titled, Numerical Modeling of Perforated Tile Flow Distribution in a Raised-Floor Data Center
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Topics: Computer simulation, Data centers, Flow (Dynamics), Pipes, Tiles, Air flow, Modeling, Porosity
Journal Articles

Influence of the Fluid on the Experimental Performances of Triangular Silicon Microheat Pipes

Guillaume Pandraud, Martine Le Berre, Panagiota Morfouli, Monique Lallemand
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2006, 128(3): 294–296.
https://doi.org/10.1115/1.2229233
Published Online: October 11, 2005
View Article titled, Influence of the Fluid on the Experimental Performances of Triangular Silicon Microheat Pipes
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Topics: Fluids, Methanol, Microchannels, Pipes, Silicon, Thermal conductivity, Semiconductor wafers, Water, Bonding, Ethanol
Journal Articles

Convective Heat Transfer From Longitudinal Fin Arrays in the Entry Region of Turbulent Flow

K. S. Lau, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1989, 111(3): 213–219.
https://doi.org/10.1115/1.3226536
Published Online: September 1, 1989
View Article titled, Convective Heat Transfer From Longitudinal Fin Arrays in the Entry Region of Turbulent Flow
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Topics: Convection, Turbulence, Clearances (Engineering), Fins, Thermal resistance, Air flow, Design, Flow (Dynamics), Heat transfer, Heat transfer coefficients