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Journal Articles

A High Precision Experimental Method to Determine Poisson’s Ratios of Encapsulant Gels

David A. Dillard, Alok Mallick, Donatus C. Ohanehi, Jang-Horng Yu, Didier R. Lefebvre
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031006.
https://doi.org/10.1115/1.2957326
Published Online: July 30, 2008
View Article titled, A High Precision Experimental Method to Determine Poisson’s Ratios of Encapsulant Gels
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Topics: Cylinders, Elastomers, High pressure (Physics), Poisson ratio, Pressure, Casting, Pressure sensors, Deformation, Stress
Journal Articles

Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses

L. J. Ernst, G. Q. Zhang, K. M. B. Jansen, H. J. L. Bressers
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 539–548.
https://doi.org/10.1115/1.1604156
Published Online: December 15, 2003
View Article titled, Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses
Open the PDF for Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses in another window
Topics: Creep, Molding, Poisson ratio, Stress, Temperature, Relaxation (Physics), Packaging
Journal Articles

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

M. Uschitsky, Member ASME, E. Suhir, Fellow ASME, G. W. Kammlott
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 260–267.
https://doi.org/10.1115/1.1349422
Published Online: January 11, 2000
View Article titled, Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach
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Topics: Composite materials, Epoxy adhesives, Epoxy resins, Fillers (Materials), Molding, Particulate matter, Thermal expansion, Elastic moduli, Thermal stresses, Shear modulus
Journal Articles

An Elastoplastic Beam Model for Column-Grid-Array Solder Interconnects

J. A. Swanson, S. M. Heinrich, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 303–311.
https://doi.org/10.1115/1.2793857
Published Online: December 1, 1999
View Article titled, An Elastoplastic Beam Model for Column-Grid-Array Solder Interconnects
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Topics: Solders, Shear (Mechanics), Deflection, Stiffness, Stress, Deformation, Die cutting, Displacement, Fatigue life, Finite element model
Journal Articles

Thermoelastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications

N. R. Sottos, J. M. Ockers, M. Swindeman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 37–43.
https://doi.org/10.1115/1.2792659
Published Online: March 1, 1999
View Article titled, Thermoelastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications
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Topics: Composite materials, Printed circuit boards, Thermoelasticity, Textiles, Geometry, Lumber, Elastic moduli, Epoxy adhesives, Epoxy resins, Fibers