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Journal Articles

Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform

Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021003.
Paper No: EP-22-1092
https://doi.org/10.1115/1.4062924
Published Online: September 20, 2023
View Article titled, Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform
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Topics: Bonding, Copper, Microchannels, Polishing, Manifolds, Solders
Journal Articles

Effects of Wafer Thinning Condition on the Roughness, Morphology and Fracture Strength of Silicon Die

Neil McLellan, Nelson Fan, Shilai Liu, Kim Lau, Jingshen Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 110–114.
https://doi.org/10.1115/1.1647123
Published Online: April 30, 2004
View Article titled, Effects of Wafer Thinning Condition on the Roughness, Morphology and Fracture Strength of Silicon Die
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Topics: Fracture toughness, Grinding, Semiconductor wafers, Surface roughness, Polishing, Plasma etching
Journal Articles

Chemical-Mechanical Planarization of Low- k Polymers for Advanced IC Structures

Christopher L. Borst, Dipto G. Thakurta, William N. Gill, Ronald J. Gutmann
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 362–366.
https://doi.org/10.1115/1.1510138
Published Online: December 12, 2002
View Article titled, Chemical-Mechanical Planarization of Low- k Polymers for Advanced IC Structures
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Topics: Copper, Polymers, Semiconductor wafers, Slurries, Polishing, Atomic force microscopy, Polymer films, Phthalate plasticizers