1-4 of 4
Press fits
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers

Raphael K. Mandel, Daniel G. Bae, Michael M. Ohadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031003.
Paper No: EP-17-1081
https://doi.org/10.1115/1.4039264
Published Online: May 11, 2018
View Article titled, Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers
Open the PDF for Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers in another window
Topics: Coolers, Cooling, Electronics, Flow (Dynamics), Fluids, Flux (Metallurgy), Heat, Heat flux, Manifolds, Microchannels
Journal Articles

Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices

Thomas Fellner, Elena Zukowski, Jürgen Wilde, H. Kück, H. Richter, M. Schober, P. Buckmüller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031002.
https://doi.org/10.1115/1.4006927
Published Online: July 18, 2012
View Article titled, Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices
Open the PDF for Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices in another window
Topics: Creep, Modeling, Press fits, Reliability, Simulation, Stress, Temperature, Deformation, Friction, Manufacturing
Journal Articles

Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators

Michael R. Maughan, Robert R. Stephens, Donald M. Blackketter, Karl K. Rink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011009.
https://doi.org/10.1115/1.3068318
Published Online: February 13, 2009
View Article titled, Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators
Open the PDF for Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators in another window
Topics: Finite element analysis, Glass, Press fits, Shear stress, Stress, Thermal stresses, Welding, Wire, Bridges (Structures), Laser welding
Journal Articles

Analysis of Solderless Press-Fit Interconnections During the Assembly Process

Hironori Tohmyoh, Kiichiro Yamanobe, Masumi Saka, Jiro Utsunomiya, Takeshi Nakamura, Yoshikatsu Nakano
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031007.
https://doi.org/10.1115/1.2957330
Published Online: July 30, 2008
View Article titled, Analysis of Solderless Press-Fit Interconnections During the Assembly Process
Open the PDF for Analysis of Solderless Press-Fit Interconnections During the Assembly Process in another window
Topics: Finite element analysis, Manufacturing, Pins (Engineering), Press fits, Stress, Friction