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Journal Articles

Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization

Pradeep Lall, Kartik Goyal, Curtis Hill

J. Electron. Packag. June 2023, 145(2): 021011.

Paper No: EP-22-1029

DOI: https://doi.org/10.1115/1.4055986

Published Online: November 23, 2022

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Topics: Copper, Sintering, Surface mount devices, Electrical resistivity, Printing, Drops, Electronics

Journal Articles

Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias

Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller

J. Electron. Packag. June 2022, 144(2): 021117.

Paper No: EP-21-1066

DOI: https://doi.org/10.1115/1.4053766

Published Online: March 11, 2022

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Topics: Aerosols, Failure, Inks, Printing, Shear (Mechanics), Sintering, Stress, Vehicles, Temperature, Silver

Journal Articles

Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies

Jimmy Chuang, Jin Yang, David Shia, Y. L. Li

J. Electron. Packag. December 2021, 143(4): 041108.

Paper No: EP-21-1037

DOI: https://doi.org/10.1115/1.4052711

Published Online: November 2, 2021

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Topics: Boiling, Cooling, Electronic packages, Injection molding, Metals, Printing, Additive manufacturing, Flat heat pipes, Manufacturing

Journal Articles

Process Capability of Aerosol-Jet Additive Processes for Long-Runs Up to 10-Hours

Pradeep Lall, Amrit Abrol, Nakul Kothari, Benjamin Leever, Scott Miller

J. Electron. Packag. December 2020, 142(4): 041003.

Paper No: EP-20-1001

DOI: https://doi.org/10.1115/1.4048535

Published Online: October 12, 2020

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Topics: Aerosols, Electrical resistivity, Failure, Inks, Shear (Mechanics), Sintering, Stress, Temperature, Elastic moduli, Printing

Journal Articles

Flexure and Twist Test Reliability Assurance of Flexible Electronics

Pradeep Lall, Jinesh Narangaparambil, Ben Leever, Scott Miller

J. Electron. Packag. September 2020, 142(3): 031121.

Paper No: EP-20-1008

DOI: https://doi.org/10.1115/1.4047844

Published Online: August 7, 2020

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Topics: Bending (Stress), Cycles, Failure, Reliability, Sintering, Temperature, Inks, Flexible electronics, Testing, Printing

Journal Articles

Effect of Gas Flow Rates on Quality of Aerosol Jet Printed Traces With Nanoparticle Conducting Ink

Neil Dalal, Yuan Gu, Guang Chen, Daniel R. Hines, Abhijit Dasgupta, Siddhartha Das

J. Electron. Packag. March 2020, 142(1): 011012.

Paper No: EP-19-1002

DOI: https://doi.org/10.1115/1.4044960

Published Online: November 14, 2019

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Topics: Aerosols, Electrical conductivity, Flow (Dynamics), Gas flow, Inks, Magnification, Nanoparticles, Printing, Silver, Agglomeration (Materials)

Includes: Supplementary data

Journal Articles

Additive-Manufactured Organic Interposers

A. Roshanghias, M. Krivec, J. Bardong, A. Binder

J. Electron. Packag. March 2020, 142(1): 014501.

Paper No: EP-19-1040

DOI: https://doi.org/10.1115/1.4044279

Published Online: September 19, 2019

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Topics: Additive manufacturing, Manufacturing, Printing

Journal Articles

Assembly of Heterogeneous Materials for Biology and Electronics: From Bio-Inspiration to Bio-Integration

Yuyan Gao, Huanyu Cheng

J. Electron. Packag. June 2017, 139(2): 020801.

Paper No: EP-16-1131

DOI: https://doi.org/10.1115/1.4036238

Published Online: June 13, 2017

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Topics: Electronics, Manufacturing, Printing, Biology

Journal Articles

Flexible RFID Tag Inductor Printed by Liquid Metal Ink Printer and Its Characterization

Yunxia Gao, Rui Liu, Xianping Wang, Jing Liu, Qianfeng Fang

J. Electron. Packag. September 2016, 138(3): 031007.

Paper No: EP-14-1120

DOI: https://doi.org/10.1115/1.4034062

Published Online: July 21, 2016

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Topics: Inductors, Inks, Liquid metals, Printing, Shapes

Journal Articles

Introduction for JEP Special Issue on Printed Electronics

J. Electron. Packag. March 2013, 135(1): 010301.

Paper No: EP-12-1101

DOI: https://doi.org/10.1115/1.4023808

Published Online: March 26, 2013

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Topics: Electronics, Printing

Journal Articles

Preparation of Water-Based Carbon Nanotube Inks and Application in the Inkjet Printing of Carbon Nanotube Gas Sensors

Ziyin Lin, Taoran Le, Xiaojuan Song, Yagang Yao, Zhuo Li, Kyoung-sik Moon, Manos M. Tentzeris, Ching-ping Wong

J. Electron. Packag. March 2013, 135(1): 011001.

Paper No: EP-11-1098

DOI: https://doi.org/10.1115/1.4023758

Published Online: March 26, 2013

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Topics: Carbon nanotubes, Inks, Printing, Sensors, Water

Journal Articles

The Standardization of Printable Materials and Direct Writing Systems

Jessica Hoffman, Seyeon Hwang, Ada Ortega, Nam-Soo Kim, Kyoung-sik Moon

J. Electron. Packag. March 2013, 135(1): 011006.

Paper No: EP-12-1027

DOI: https://doi.org/10.1115/1.4023809

Published Online: March 26, 2013

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Topics: Education, Electronics, Inks, Printing

Journal Articles

Inkjet Printing of Radio Frequency Electronics: Design Methodologies and Application of Novel Nanotechnologies

Taoran Le, Ziyin Lin, Rushi Vyas, Vasileios Lakafosis, Li Yang, Anya Traille, Manos M. Tentzeris, Ching-ping Wong

J. Electron. Packag. March 2013, 135(1): 011007.

Paper No: EP-12-1030

DOI: https://doi.org/10.1115/1.4023671

Published Online: March 26, 2013

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Topics: Printing, Sensors, Inks, Single-walled carbon nanotubes, Electronics

Journal Articles

Statistical Manufacturing Model of Printing Technology

Nam-Soo Kim, Sarah Luna, Jung-Hyou Lee, Tae-Eui Jeong

J. Electron. Packag. March 2013, 135(1): 011004.

Paper No: EP-12-1005

DOI: https://doi.org/10.1115/1.4007450

Published Online: February 26, 2013

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Topics: Packing (Shipments), Packings (Cushioning), Particulate matter, Printing, Computer simulation, Manufacturing, Inks, Particle size

Journal Articles

Characterization of the Solder Paste Release From Small Stencil Apertures in the Stencil Printing Process

Srinivasa Aravamudhan, Daryl Santos, Gerald Pham-Van-Diep, Frank Andres

J. Electron. Packag. September 2005, 127(3): 340–352.

DOI: https://doi.org/10.1115/1.1938208

Published Online: December 10, 2004

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Topics: Printing, Solders

Journal Articles

Open Defects in PBGA Assembly Solder Joints

S. H. Fan, Y. C. Chan, J. K. L. Lai

J. Electron. Packag. March 2003, 125(1): 157–161.

DOI: https://doi.org/10.1115/1.1536951

Published Online: March 14, 2003

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Topics: Manufacturing, Solder joints, Solders, Soldering, Inspection, Thermal stability, Wetting, Printing

Journal Articles

Analysis of Solder Paste Release in Fine Pitch Stencil Printing Processes

G. Rodriguez, D. F. Baldwin

J. Electron. Packag. September 1999, 121(3): 169–178.

DOI: https://doi.org/10.1115/1.2792680

Published Online: September 1, 1999

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Topics: Printing, Solders, Electronic packaging, Adhesives, Analytical methods, Ball-Grid-Array packaging, Flip-chip, Flip-chip devices, Imaging, Measurement systems

Journal Articles

The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints

Y. Li, R. L. Mahajan, G. Subbarayan

J. Electron. Packag. March 1998, 120(1): 54–60.

DOI: https://doi.org/10.1115/1.2792286

Published Online: March 1, 1998

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Topics: Optimization, Printing, Reliability, Solder joints, Solders, Ball-Grid-Array packaging, Ceramics, Fatigue life, Cycles, Design

Journal Articles

Fine Pitch Stencil Printing Process Modeling and Optimization

Y. Li, R. L. Mahajan, N. Nikmanesh

J. Electron. Packag. March 1996, 118(1): 1–6.

DOI: https://doi.org/10.1115/1.2792121

Published Online: March 1, 1996

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Topics: Modeling, Optimization, Printing, Solders, Design, Neural network models, Algorithms, Assembly lines, Engineering simulation, Machinery

Journal Articles

Study of Print Release Process in Solder Paste Printing

C. Sahay, L. M. Head, R. Shereen, P. Dujari, J. H. Constable, G. Westby

J. Electron. Packag. September 1995, 117(3): 230–234.

DOI: https://doi.org/10.1115/1.2792097

Published Online: September 1, 1995

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Topics: Printing, Solders, Shear strength, Boundary layers, Density, Dimensions, Reflow soldering, Separation (Technology), Shear (Mechanics), Surface mount technology

Journal citation

NARROW

Supplemental Material

Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization

Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias

Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies

Process Capability of Aerosol-Jet Additive Processes for Long-Runs Up to 10-Hours

Flexure and Twist Test Reliability Assurance of Flexible Electronics

Effect of Gas Flow Rates on Quality of Aerosol Jet Printed Traces With Nanoparticle Conducting Ink

Additive-Manufactured Organic Interposers

Assembly of Heterogeneous Materials for Biology and Electronics: From Bio-Inspiration to Bio-Integration

Flexible RFID Tag Inductor Printed by Liquid Metal Ink Printer and Its Characterization

Introduction for JEP Special Issue on Printed Electronics

Preparation of Water-Based Carbon Nanotube Inks and Application in the Inkjet Printing of Carbon Nanotube Gas Sensors

The Standardization of Printable Materials and Direct Writing Systems

Inkjet Printing of Radio Frequency Electronics: Design Methodologies and Application of Novel Nanotechnologies

Statistical Manufacturing Model of Printing Technology

Characterization of the Solder Paste Release From Small Stencil Apertures in the Stencil Printing Process

Open Defects in PBGA Assembly Solder Joints

Analysis of Solder Paste Release in Fine Pitch Stencil Printing Processes

The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints

Fine Pitch Stencil Printing Process Modeling and Optimization

Study of Print Release Process in Solder Paste Printing

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