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Journal Articles

Dynamic Load Balancing Using Actual Workload Traces Based on Central Processing Unit Temperatures

Yusuke Nakajo, Jayati Athavale, Minami Yoda, Yogendra Joshi, Hiroaki Nishi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031014.
Paper No: EP-18-1110
https://doi.org/10.1115/1.4044262
Published Online: September 19, 2019
View Article titled, Dynamic Load Balancing Using Actual Workload Traces Based on Central Processing Unit Temperatures
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Topics: Data centers, Stress, Temperature, Rotation
Journal Articles

Heat Transfer Behavior for a Stationary or Rotating MCM Disk With an Unconfined Round Jet Impingement

C. J. Fang, M. C. Wu, Y. M. Kuo, C. Y. Lee, C. H. Peng, Y. H. Hung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 400–410.
https://doi.org/10.1115/1.2804087
Published Online: December 28, 2006
View Article titled, Heat Transfer Behavior for a Stationary or Rotating MCM Disk With an Unconfined Round Jet Impingement
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Topics: Disks, Heat transfer, Nozzles, Reynolds number, Transients (Dynamics), Turbulence, Heat flux, Steady state, Jets, Rotation
Journal Articles

Flip-Chip Underfill Packaging Considering Capillary Force, Pressure Difference, and Inertia Effects

Chao-Ming Lin, Win-Jin Chang, Te-Hua Fang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 48–55.
https://doi.org/10.1115/1.2429709
Published Online: May 13, 2006
View Article titled, Flip-Chip Underfill Packaging Considering Capillary Force, Pressure Difference, and Inertia Effects
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Topics: Flip-chip, Flow (Dynamics), Inertia (Mechanics), Packaging, Pressure, Rotation, Surface tension
Journal Articles

A Finite-Element and Experimental Analysis of Stress Distribution in Various Shear Tests for Solder Joints

T. Reinikainen, M. Poech, M. Krumm, J. Kivilahti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 106–113.
https://doi.org/10.1115/1.2792277
Published Online: March 1, 1998
View Article titled, A Finite-Element and Experimental Analysis of Stress Distribution in Various Shear Tests for Solder Joints
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Topics: Experimental analysis, Finite element analysis, Shear (Mechanics), Solder joints, Stress concentration, Creep, Simulation results, Stress, Alloys, Deformation
Journal Articles

Analysis and Optimization of the Input/Output Fiber Configuration in a Laser Package Design

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 261–265.
https://doi.org/10.1115/1.2792102
Published Online: December 1, 1995
View Article titled, Analysis and Optimization of the Input/Output Fiber Configuration in a Laser Package Design
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Topics: Design, Fibers, Lasers, Optimization, Stress, Rotation, Buckling, Compressive stress, Deformation, Optical instruments
Journal Articles

Local PWB and Component Bowing of an Assembly Subjected to a Bending Moment

D. B. Barker, Sidharth
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 92–97.
https://doi.org/10.1115/1.2905511
Published Online: June 1, 1994
View Article titled, Local PWB and Component Bowing of an Assembly Subjected to a Bending Moment
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Topics: Manufacturing, Printed circuit boards, Cross section (Physics), Electronic components, Rotation, Stiffness, Stress
Journal Articles

Modeling the Vibration Restraints of Wedge Lock Card Guides

D. B. Barker, Y. S. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 189–194.
https://doi.org/10.1115/1.2909316
Published Online: June 1, 1993
View Article titled, Modeling the Vibration Restraints of Wedge Lock Card Guides
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Topics: Locks (Waterways), Modeling, Vibration, Wedges, Boundary-value problems, Deflection, Elastic constants, Frequency response, Rotation, Springs
Journal Articles

Analysis of Parameters Influencing Stresses in the Solder Joints of Leadless Chip Capacitors

M. K. Shah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 147–153.
https://doi.org/10.1115/1.2904355
Published Online: June 1, 1990
View Article titled, Analysis of Parameters Influencing Stresses in the Solder Joints of Leadless Chip Capacitors
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Topics: Capacitors, Solder joints, Stress, Design, Rotation, Solders, Ceramics, Manufacturing, Printed circuit boards