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Journal Articles

Fabrication and Reliability Assessment of Cu Pillar Microbumps With Printed Polymer Cores

Xing Qiu, Jeffery C. C. Lo, Yuanjie Cheng, S. W. Ricky Lee, Yong Jhe Tseng, Peter Chiu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031010.
Paper No: EP-20-1102
https://doi.org/10.1115/1.4049129
Published Online: January 19, 2021
View Article titled, Fabrication and Reliability Assessment of Cu Pillar Microbumps With Printed Polymer Cores
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Topics: Columns (Structural), Manufacturing, Polymers, Reliability, Temperature, Silicon chips, Bonding
Journal Articles

Thermal Stresses of Through Silicon Vias and Si Chips in Three Dimensional System in Package

Takahiro Kinoshita, Takashi Kawakami, Tatsuhiro Hori, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada, Morihiro Kada
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020903.
https://doi.org/10.1115/1.4006515
Published Online: June 11, 2012
View Article titled, Thermal Stresses of Through Silicon Vias and Si Chips in Three Dimensional System in Package
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Topics: Finite element methods, Silicon, Silicon chips, Simulation, Stress, System-in-package, Thermal stresses, Temperature, Stress concentration
Journal Articles

40 μ m Copper–Silver Composite Flip-Chip Interconnect Technology Using Solid-State Bonding

Chu-Hsuan Sha, Wen P. Lin, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021004.
https://doi.org/10.1115/1.4006705
Published Online: June 11, 2012
View Article titled, 40 μ m Copper–Silver Composite Flip-Chip Interconnect Technology Using Solid-State Bonding
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Topics: Bonding, Composite materials, Copper, Flip-chip, Silicon chips, Silver
Journal Articles

Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps

Kota Nakahira, Hironori Tago, Fumiaki Endo, Ken Suzuki, Hideo Miura
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021006.
https://doi.org/10.1115/1.4006142
Published Online: June 11, 2012
View Article titled, Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps
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Topics: Silicon chips, Stress, Mechanical properties, Flip-chip, Deformation, Copper
Journal Articles

Thermal Modeling Technique for Multiple Transistors Within Silicon Chip

Tohru Suwa, Hamid Hadim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041015.
https://doi.org/10.1115/1.4005291
Published Online: December 23, 2011
View Article titled, Thermal Modeling Technique for Multiple Transistors Within Silicon Chip
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Topics: Finite element analysis, Heat, Modeling, Silicon chips, Temperature, Temperature distribution, Transistors
Journal Articles

Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections

Ping Nicole An, Paul A. Kohl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041004.
https://doi.org/10.1115/1.4005289
Published Online: December 9, 2011
View Article titled, Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections
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Topics: Boundary-value problems, Columns (Structural), Copper, Deformation, Density, Displacement, Errors, Finite element analysis, Finite element model, Modeling
Journal Articles

40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding

Chu-Hsuan Sha, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031012.
https://doi.org/10.1115/1.4004660
Published Online: September 30, 2011
View Article titled, 40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding
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Topics: Bonding, Flip-chip, Silicon chips, Silver, Soldering, Thermal expansion, Pressure, Copper
Journal Articles

Low Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates

Chu-Hsuan Sha, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021003.
https://doi.org/10.1115/1.4003868
Published Online: June 22, 2011
View Article titled, Low Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates
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Topics: Bonding, Silicon chips, Pressure, Shear (Mechanics), Silicon, Thermal expansion, Low temperature, Temperature
Journal Articles

Silver Flip-Chip Technology by Solid-State Bonding

Pin J. Wang, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Design Innovations
J. Electron. Packag. September 2010, 132(3): 035001.
https://doi.org/10.1115/1.4002297
Published Online: September 30, 2010
View Article titled, Silver Flip-Chip Technology by Solid-State Bonding
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Topics: Bonding, Flip-chip, Silver, Silicon chips
Journal Articles

PCR Microchip Array Based on Polymer Bonding Technique

Xiaomei Yu, Ting Li, Lin Hao, Dacheng Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 38–42.
https://doi.org/10.1115/1.1849231
Published Online: March 21, 2005
View Article titled, PCR Microchip Array Based on Polymer Bonding Technique
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Topics: Bonding, DNA, Fluorescence, Integrated circuits, Packaging, Photoresists, Polymers, Epoxy adhesives, Epoxy resins, Silicon
Journal Articles

Characterization of Substrate Materials for System-in-a-Package Applications

Liu Chen, Anders S. G. Andræ, Gang Zou, Johan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 195–201.
https://doi.org/10.1115/1.1648057
Published Online: July 8, 2004
View Article titled, Characterization of Substrate Materials for System-in-a-Package Applications
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Topics: Ceramics, Cooling, Density, Epoxy resins, Finite element methods, Manufacturing, Microwaves, Reliability, System-in-package, Thermal expansion
Journal Articles

Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch

J. Lau, Fellow ASME, Z. Mei, S. Pang, C. Amsden, J. Rayner, S. Pan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 403–410.
https://doi.org/10.1115/1.1512294
Published Online: December 12, 2002
View Article titled, Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch
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Topics: Creep, Fatigue, Fatigue testing, Sealing (Process), Solders, Stress, Switches, Density, Cycles, Finite element analysis
Journal Articles

Failure Estimation of Semiconductor Chip During Wire Bonding Process

T. Ikeda, N. Miyazaki, K. Kudo, K. Arita, H. Yakiyama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1999, 121(2): 85–91.
https://doi.org/10.1115/1.2792672
Published Online: June 1, 1999
View Article titled, Failure Estimation of Semiconductor Chip During Wire Bonding Process
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Topics: Failure, Semiconductors (Materials), Wire bonding, Gallium arsenide, Pressure, Wire, Cycles, Deformation, Electronic packaging, Metals
Journal Articles

Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies

X. Yan, R. K. Agarwal
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 150–155.
https://doi.org/10.1115/1.2792607
Published Online: June 1, 1998
View Article titled, Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies
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Topics: Flip-chip assemblies, Fracture toughness, Printed circuit boards, Stress, Fracture (Materials), Silicon chips, Solder masks
Journal Articles

Investigation of the Lead-On-Chip Package’s Reliability

P.-H. Tsao, L. C. Chang, T. C. Chen, C. Haung, C. Z. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 171–174.
https://doi.org/10.1115/1.2792613
Published Online: June 1, 1998
View Article titled, Investigation of the Lead-On-Chip Package’s Reliability
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Topics: Reliability, Epoxy adhesives, Epoxy resins, Silicon chips, Crack propagation, Failure mechanisms, Finite element analysis, Fracture (Materials), Manufacturing, Molding
Journal Articles

Interfacial Thermal Stresses in Layered Structures: The Stepped Edge Problem

Wan-Lee Yin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 153–158.
https://doi.org/10.1115/1.2792083
Published Online: June 1, 1995
View Article titled, Interfacial Thermal Stresses in Layered Structures: The Stepped Edge Problem
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Topics: Bonding, Geometry, Junctions, Laminates, Shear stress, Silicon chips, Stress, Temperature, Thermal stresses
Journal Articles

Effects of Adhesion and Delamination on Stress Singularities in Plastic-Packaged Integrated Circuits

J. C. W. van Vroonhoven
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 28–33.
https://doi.org/10.1115/1.2909298
Published Online: March 1, 1993
View Article titled, Effects of Adhesion and Delamination on Stress Singularities in Plastic-Packaged Integrated Circuits
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Topics: Adhesion, Delamination, Integrated circuits, Stress singularity, Fracture (Materials), Failure, Fracture (Process), Silicon chips, Stress, Temperature
Journal Articles

Thermal Stress Measurement in Silicon Chips Encapsulated in IC Plastic Packages Under Temperature Cycling

Hideo Miura, Makoto Kitano, Asao Nishimura, Sueo Kawai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 9–15.
https://doi.org/10.1115/1.2909307
Published Online: March 1, 1993
View Article titled, Thermal Stress Measurement in Silicon Chips Encapsulated in IC Plastic Packages Under Temperature Cycling
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Topics: Silicon chips, Temperature, Thermal stresses, Stress, Cycles, Molding, Cooling, Heating, Relaxation (Physics), Steady state
Journal Articles

Thermally Induced Failure of Microelectronic Structures

J. F. Cardenas-Garcia, M. C. Chyu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 1990, 112(1): 80–82.
https://doi.org/10.1115/1.2904346
Published Online: March 1, 1990
View Article titled, Thermally Induced Failure of Microelectronic Structures
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Topics: Failure, Stress, Temperature, Temperature gradient, Yield strength, Cooling, Flow (Dynamics), Fluids, Mechanical properties, Silicon chips
Journal Articles

Mechanical Analysis for Thermal Grease Enhanced Modules Enclosing a Silicon Chip

P. A. Engel, D. H. Strope, T. E. Wray
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1989, 111(2): 90–96.
https://doi.org/10.1115/1.3226527
Published Online: June 1, 1989
View Article titled, Mechanical Analysis for Thermal Grease Enhanced Modules Enclosing a Silicon Chip
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Topics: Ceramics, Heat conduction, Manufacturing, Silicon chips, Stress