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Journal Articles

Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in a Three-Dimensional Joint Structure

Hideo Koguchi, Kazuhisa Hoshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020902.
https://doi.org/10.1115/1.4006139
Published Online: June 11, 2012
View Article titled, Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in a Three-Dimensional Joint Structure
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Topics: Bonding, Boundary element methods, Delamination, Resins, Stress, Stress singularity, Silicon, Joining, Stress concentration
Journal Articles

Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages

A. Q. Xu, H. F. Nied
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 301–305.
https://doi.org/10.1115/1.1289768
Published Online: December 1, 2000
View Article titled, Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages
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Topics: Corners (Structural elements), Delamination, Epoxy adhesives, Epoxy resins, Finite element analysis, Fracture (Materials), Silicon, Stress, Stress singularity, Geometry
Journal Articles

Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging

Cemal Basaran, Assoc. Prof. and Director,, Ying Zhao, Senior Reliability Engineer,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 218–224.
https://doi.org/10.1115/1.1362674
Published Online: July 6, 1999
View Article titled, Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging
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Topics: Adhesives, Damage, Elastic analysis, Finite element analysis, Stress, Stress concentration, Electronic packaging, Shear stress, Stress singularity
Journal Articles

The Effects of Inclined Free Edges on the Thermal Stresses in a Layered Beam

Wan-Lee Yin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 208–213.
https://doi.org/10.1115/1.2909319
Published Online: June 1, 1993
View Article titled, The Effects of Inclined Free Edges on the Thermal Stresses in a Layered Beam
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Topics: Thermal stresses, Stress, Elasticity, Polynomials, Stress singularity, Variational techniques, Wedges
Journal Articles

Effects of Adhesion and Delamination on Stress Singularities in Plastic-Packaged Integrated Circuits

J. C. W. van Vroonhoven
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 28–33.
https://doi.org/10.1115/1.2909298
Published Online: March 1, 1993
View Article titled, Effects of Adhesion and Delamination on Stress Singularities in Plastic-Packaged Integrated Circuits
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Topics: Adhesion, Delamination, Integrated circuits, Stress singularity, Fracture (Materials), Failure, Fracture (Process), Silicon chips, Stress, Temperature
Journal Articles

A Stress Singularity Parameter Approach for Evaluating the Interfacial Reliability of Plastic Encapsulated LSI Devices

T. Hattori, S. Sakata, G. Murakami
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1989, 111(4): 243–248.
https://doi.org/10.1115/1.3226542
Published Online: December 1, 1989
View Article titled, A Stress Singularity Parameter Approach for Evaluating the Interfacial Reliability of Plastic Encapsulated LSI Devices
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Topics: Reliability, Stress singularity, Adhesives, Stress, Acoustics, Alloys, Bonding, Delamination, Displacement, Epoxy adhesives