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Journal Articles

Reducing Warpage of Printed Circuit Boards by Using Wavy Traces

Parsaoran Hutapea, Joachim L. Grenestedt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 282–287.
https://doi.org/10.1115/1.1756591
Published Online: October 6, 2004
View Article titled, Reducing Warpage of Printed Circuit Boards by Using Wavy Traces
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Topics: Finite element analysis, Printed circuit boards, Thermoelasticity, Warping, Temperature
Journal Articles

The Thermoelastic Analysis of Chip-Substrate System

Linzhi Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 325–332.
https://doi.org/10.1115/1.1772413
Published Online: October 6, 2004
View Article titled, The Thermoelastic Analysis of Chip-Substrate System
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Topics: Fourier series, Heat conduction, Integrated circuits, Stress, Temperature, Thermal stresses, Thermoelasticity, Stress concentration, Reliability, Heat
Journal Articles

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

M. Uschitsky, Member ASME, E. Suhir, Fellow ASME, G. W. Kammlott
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 260–267.
https://doi.org/10.1115/1.1349422
Published Online: January 11, 2000
View Article titled, Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach
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Topics: Composite materials, Epoxy adhesives, Epoxy resins, Fillers (Materials), Molding, Particulate matter, Thermal expansion, Elastic moduli, Thermal stresses, Shear modulus
Journal Articles

Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation

Y. Polsky, I. C. Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 263–270.
https://doi.org/10.1115/1.2793850
Published Online: December 1, 1999
View Article titled, Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation
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Topics: Circuits, Modeling, Printed circuit boards, Reflow soldering, Thermoelasticity, Warping, Copper, Elasticity, Lamination, Micromechanics (Engineering)
Journal Articles

Thermoelastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications

N. R. Sottos, J. M. Ockers, M. Swindeman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 37–43.
https://doi.org/10.1115/1.2792659
Published Online: March 1, 1999
View Article titled, Thermoelastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications
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Topics: Composite materials, Printed circuit boards, Thermoelasticity, Textiles, Geometry, Lumber, Elastic moduli, Epoxy adhesives, Epoxy resins, Fibers
Journal Articles

Analytical Solutions of Stresses in a Cylindrical Plate Due to Polynomial Radial Temperature Distributions

Frank F. H. Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 214–218.
https://doi.org/10.1115/1.2909320
Published Online: June 1, 1993
View Article titled, Analytical Solutions of Stresses in a Cylindrical Plate Due to Polynomial Radial Temperature Distributions
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Topics: Polynomials, Stress, Temperature distribution, Heating, Failure, Fracture (Process), Manufacturing, Temperature, Thermal expansion, Thermal stresses
Journal Articles

Thermoelastic Solutions for a Semi-Infinite Substrate With a Powered Electronic Device

John H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 1992, 114(3): 353–358.
https://doi.org/10.1115/1.2905463
Published Online: September 1, 1992
View Article titled, Thermoelastic Solutions for a Semi-Infinite Substrate With a Powered Electronic Device
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Topics: Thermoelasticity
Journal Articles

Thermoelastic Solutions for a Finite Substrate With an Electronic Device

J. H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 1991, 113(1): 84–88.
https://doi.org/10.1115/1.2905372
Published Online: March 1, 1991
View Article titled, Thermoelastic Solutions for a Finite Substrate With an Electronic Device
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Topics: Thermoelasticity, Design, Displacement, Finite element analysis, Steady state, Stress, Symmetry (Physics), Temperature, Temperature distribution
Journal Articles

Thermoplastic Problem of a Thick Orthotropic Beam on Two-Directional Elastic Foundation

V. Birman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1990, 112(1): 47–51.
https://doi.org/10.1115/1.2904340
Published Online: March 1, 1990
View Article titled, Thermoplastic Problem of a Thick Orthotropic Beam on Two-Directional Elastic Foundation
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Topics: Deformation, Differential equations, Shear (Mechanics), Shear deformation, Thermoelasticity
Journal Articles

Thermomechanical Behavior of Multilayer Structures in Microelectronics

I. M. Daniel, T.-M. Wang, J. T. Gotro
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1990, 112(1): 11–15.
https://doi.org/10.1115/1.2904332
Published Online: March 1, 1990
View Article titled, Thermomechanical Behavior of Multilayer Structures in Microelectronics
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Topics: Deformation, Epoxy adhesives, Epoxy resins, Glass, Hardening (Curing), Laminates, Lamination, Microelectronic devices, Polymerization, Residual stresses