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Journal Articles

Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids

Noriyuki Unno, Kazuhisa Yuki, Risako Kibushi, Atsuyuki Mitani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011104.
Paper No: EP-22-1019
https://doi.org/10.1115/1.4055841
Published Online: October 22, 2022
View Article titled, Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids
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Topics: Boiling, Critical heat flux, Heat flux, Heat transfer, Nanofluids, Water, Thermal resistance, Aluminum, Wall temperature, Temperature
Journal Articles

Heat Transfer in Liquid–Liquid Taylor Flow in Miniscale Curved Tubing for Constant Wall Temperature

Wesam Adrugi, Yuri Muzychka, Kevin Pope
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020909.
Paper No: EP-16-1141
https://doi.org/10.1115/1.4036405
Published Online: June 12, 2017
View Article titled, Heat Transfer in Liquid–Liquid Taylor Flow in Miniscale Curved Tubing for Constant Wall Temperature
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Topics: Flow (Dynamics), Heat transfer, Tubing, Water, Wall temperature
Journal Articles

Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps

Mohamed H. Nasr, Craig E. Green, Peter A. Kottke, Xuchen Zhang, Thomas E. Sarvey, Yogendra K. Joshi, Muhannad S. Bakir, Andrei G. Fedorov
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011006.
Paper No: EP-16-1097
https://doi.org/10.1115/1.4035387
Published Online: January 5, 2017
View Article titled, Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps
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Topics: Boiling, Flow (Dynamics), Flux (Metallurgy), Heat, Thermal resistance, Heat flux, Wall temperature, Coolants, Pressure drop, Thermal management
Journal Articles

Thermal Management of Time-Varying High Heat Flux Electronic Devices

T. David, D. Mendler, A. Mosyak, A. Bar-Cohen, G. Hetsroni
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021003.
Paper No: EP-13-1064
https://doi.org/10.1115/1.4027325
Published Online: April 29, 2014
View Article titled, Thermal Management of Time-Varying High Heat Flux Electronic Devices
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Topics: Flow (Dynamics), Heat flux, Heat sinks, Microchannels, Temperature, Fluids, Steady state, Vapors, Wall temperature, Boiling
Journal Articles

Convective Cooling of a PCB Like Surface With Mixed Heating Conditions in a Vertical Channel

Vipin Yadav, Keshav Kant
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 129–143.
https://doi.org/10.1115/1.2721084
Published Online: July 23, 2006
View Article titled, Convective Cooling of a PCB Like Surface With Mixed Heating Conditions in a Vertical Channel
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Topics: Cooling, Flow (Dynamics), Heat flux, Heating, Temperature, Convection, Wall temperature, Heat
Journal Articles

Effects of Dissolved Air on Subcooled Flow Boiling of a Dielectric Coolant in a Microchannel Heat Sink

Tailian Chen, Suresh V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 398–404.
https://doi.org/10.1115/1.2351905
Published Online: February 1, 2006
View Article titled, Effects of Dissolved Air on Subcooled Flow Boiling of a Dielectric Coolant in a Microchannel Heat Sink
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Topics: Boiling, Bubbles, Flow (Dynamics), Heat sinks, Heat transfer, Microchannels, Pressure drop, Temperature, Wall temperature, Flow instability
Journal Articles

A Novel Semi-empirical Model for Evaluating Thermal Performance of Porous Metallic Foam Heat Sinks

Tzer-Ming Jeng, Li-Kang Liu, Ying-Huei Hung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 223–234.
https://doi.org/10.1115/1.1997159
Published Online: May 8, 2004
View Article titled, A Novel Semi-empirical Model for Evaluating Thermal Performance of Porous Metallic Foam Heat Sinks
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Topics: Aluminum, Fluids, Heat sinks, Heat transfer, Liquid crystals, Metal foams, Porosity, Reynolds number, Steady state, Temperature
Journal Articles

Natural Convection Cooling of Vertical Rectangular Channels in Air Considering Radiation and Wall Conduction

D. A. Hall, G. C. Vliet, T. L. Bergman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1999, 121(2): 75–84.
https://doi.org/10.1115/1.2792671
Published Online: June 1, 1999
View Article titled, Natural Convection Cooling of Vertical Rectangular Channels in Air Considering Radiation and Wall Conduction
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Topics: Cooling, Heat conduction, Natural convection, Radiation (Physics), Temperature, Wall temperature, Emissivity, Plates (structures), Separation (Technology), Temperature distribution
Journal Articles

Decoupling Convective and Conductive Heat Transfer Using the Adiabatic Heat Transfer Coefficient

Ann M. Anderson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 310–316.
https://doi.org/10.1115/1.2905703
Published Online: December 1, 1994
View Article titled, Decoupling Convective and Conductive Heat Transfer Using the Adiabatic Heat Transfer Coefficient
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Topics: Heat transfer, Heat transfer coefficients, Convection, Heat conduction, Temperature, Radiation (Physics), Computation, Computer cooling, Ducts, Errors
Journal Articles

The Adiabatic Heat Transfer Coefficient and the Superposition Kernel Function: Part 2—Modeling Flatpack Data as a Function of Channel Turbulence

A. M. Anderson, R. J. Moffat
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1992, 114(1): 22–28.
https://doi.org/10.1115/1.2905437
Published Online: March 1, 1992
View Article titled, The Adiabatic Heat Transfer Coefficient and the Superposition Kernel Function: Part 2—Modeling Flatpack Data as a Function of Channel Turbulence
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Topics: Heat transfer coefficients, Modeling, Turbulence, Heat transfer, Pressure drop, Electronics, Fluctuations (Physics), Forced convection, Heat, Operating temperature
Journal Articles

The Adiabatic Heat Transfer Coefficient and the Superposition Kernel Function: Part 1—Data for Arrays of Flatpacks for Different Flow Conditions

Ann M. Anderson, Robert J. Moffat
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1992, 114(1): 14–21.
https://doi.org/10.1115/1.2905435
Published Online: March 1, 1992
View Article titled, The Adiabatic Heat Transfer Coefficient and the Superposition Kernel Function: Part 1—Data for Arrays of Flatpacks for Different Flow Conditions
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Topics: Flow (Dynamics), Heat transfer coefficients, Heat transfer, Pressure drop, Electronics, Fluctuations (Physics), Forced convection, Heat, Operating temperature, Turbulence
Journal Articles

An Investigation of the Passive Cooling of Table Model Television Receivers

M. S. Yuki, J. R. Parsons, R. J. Krane
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 279–287.
https://doi.org/10.1115/1.2904380
Published Online: December 1, 1990
View Article titled, An Investigation of the Passive Cooling of Table Model Television Receivers
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Topics: Cooling, Vents, Natural convection, Design, Engineers, Flow (Dynamics), Computer simulation, Electronic products, Flow visualization, Heat transfer