1-20 of 44
Keywords: 3D packaging
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011009.
Paper No: EP-19-1058
Published Online: October 10, 2019
.... In addition, a phenomenological model linking protrusion and microstructural factors and a visual guide from the viewpoint of plastic flow are provided to understand the origins of Cu-TSV protrusion. e-mail:  hzh29@mail.sysu.edu.cn 19 05 2019 14 08 2019 10 10 2019 3D packaging...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2018, 140(4): 044502.
Paper No: EP-18-1015
Published Online: August 6, 2018
... of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received February 28, 2018; final manuscript received July 4, 2018; published online August 6, 2018. Assoc. Editor: Jin Yang. 28 02 2018 04 07 2018 3D packaging Bumping Flip chip To meet...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041002.
Paper No: EP-18-1007
Published Online: August 3, 2018
.... Heat Mass Transfer , 49 ( 17–18 ), pp. 3075 – 3083 . 10.1016/j.ijheatmasstransfer.2006.02.007 [36] Tian , W. , and Cui , H. , 2016 , “ A Simplification Method of TSV Interposer for Thermal Analysis in 3D Packages ,” 16th International Conference on Electronic Packaging Technology...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031004.
Paper No: EP-17-1127
Published Online: May 11, 2018
... OURNAL OF E LECTRONIC P ACKAGING . Manuscript received December 11, 2017; final manuscript received February 14, 2018; published online May 11, 2018. Assoc. Editor: Yi-Shao Lai. 11 12 2017 14 02 2018 3D packaging Wafer level packaging Wafer scale three-dimensional...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031003.
Paper No: EP-17-1081
Published Online: May 11, 2018
... 31, 2018; published online May 11, 2018. Assoc. Editor: Baris Dogruoz. 14 09 2017 31 01 2018 3D packaging Dielectrics Microsystems Power packaging Solder Thermal analysis The rapid increase in heat dissipation of next-generation integrated circuits necessitates...
Journal Articles
Article Type: Guest Editorial
J. Electron. Packag. June 2018, 140(2): 020301.
Paper No: EP-18-1012
Published Online: May 9, 2018
... or reproduce the published form of this work, or allow others to do so, for United States Government purposes. 16 02 2018 21 02 2018 3D packaging Battery technology Harsh environment High density interconnects Microsystems Optoelectronics Power packaging Sensors SOC Wafer level...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021001.
Paper No: EP-17-1126
Published Online: May 9, 2018
... ACKAGING . Manuscript received November 30, 2017; final manuscript received February 23, 2018; published online May 9, 2018. Assoc. Editor: Ankur Jain. 30 11 2017 23 02 2018 3D packaging Thermal analysis Three-dimensional (3D) stacked integrated circuit (IC) chips that stack...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020907.
Paper No: EP-17-1104
Published Online: May 9, 2018
... by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received October 9, 2017; final manuscript received April 13, 2018; published online May 9, 2018. Assoc. Editor: Kaushik Mysore. 09 10 2017 13 04 2018 3D packaging...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010905.
Paper No: EP-17-1099
Published Online: March 2, 2018
.... 27 09 2017 28 12 2017 3D packaging Chip stacking Harsh environment Thermal analysis The adequate selection of the temperature sensor locations within a microchip or a rack of microprocessors may allow a reduction in the number of sensors needed to characterize the thermal...
Journal Articles
Article Type: Review Articles
J. Electron. Packag. March 2018, 140(1): 010801.
Paper No: EP-17-1076
Published Online: March 2, 2018
... October 28, 2017; published online March 2, 2018. Assoc. Editor: Yi-Shao Lai. 31 08 2017 28 10 2017 3D packaging Bumping Chip stacking The concealed force behind the successful journey from information technology toward internet of things is the rapid progress...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041010.
Paper No: EP-17-1026
Published Online: October 25, 2017
... and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received March 9, 2017; final manuscript received September 21, 2017; published online October 25, 2017. Assoc. Editor: Kaushik Mysore. 09 03 2017 21 09 2017 3D packaging CSP...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041002.
Paper No: EP-17-1042
Published Online: July 27, 2017
... and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received April 13, 2017; final manuscript received July 8, 2017; published online July 27, 2017. Assoc. Editor: Yi-Shao Lai. 13 04 2017 08 07 2017 3D packaging MCM SOC...
Topics: Wire, Deflection
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041001.
Paper No: EP-16-1151
Published Online: July 27, 2017
... LECTRONIC P ACKAGING . Manuscript received December 31, 2016; final manuscript received March 28, 2017; published online July 27, 2017. Assoc. Editor: Eric Wong. 31 12 2016 28 03 2017 3D packaging BGA Embedded passives Flip chip Wireless Today's radio frequency (RF) modules...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031008.
Paper No: EP-17-1023
Published Online: July 10, 2017
... received February 27, 2017; final manuscript received June 21, 2017; published online July 10, 2017. Assoc. Editor: Mehdi Asheghi. 27 02 2017 21 06 2017 3D packaging Electronic Thermal analysis The desire for high computational performances and improved power efficiency...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031004.
Paper No: EP-16-1110
Published Online: June 14, 2017
... potential to package significantly more electrical functionality within a given footprint. 3D packaging Area array Chip stacking Failure analysis High density interconnects Microsystems 02 10 2016 28 03 2017 Contributed by the Electronic and Photonic Packaging Division...
Journal Articles
Article Type: Review Articles
J. Electron. Packag. September 2017, 139(3): 030801.
Paper No: EP-16-1146
Published Online: June 14, 2017
... OF E LECTRONIC P ACKAGING . Manuscript received December 25, 2016; final manuscript received February 28, 2017; published online June 14, 2017. Assoc. Editor: Satish Chaparala. 25 12 2016 28 02 2017 3D packaging CSP Electronic Flexible circuits MEMS Micro vias PWB...
Topics: Lasers, Packaging
Journal Articles
Article Type: Guest Editorial
J. Electron. Packag. June 2017, 139(2): 020301.
Paper No: EP-17-1032
Published Online: June 12, 2017
...Justin A. Weibel; S. Ravi Annapragada 22 03 2017 31 03 2017 3D packaging Backplanes Chip stacking Failure analysis Flexible circuits Nanotechnolgy Reliability Solder Thermal analysis Underfill Wafer level packaging ASME's International Mechanical Engineering...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020908.
Paper No: EP-16-1140
Published Online: June 12, 2017
... Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received December 16, 2016; final manuscript received March 27, 2017; published online June 12, 2017. Assoc. Editor: Justin A. Weibel. 16 12 2016 27 03 2017 3D packaging Chip stacking Thermal...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020906.
Paper No: EP-16-1138
Published Online: June 12, 2017
... online June 12, 2017. Assoc. Editor: S. Ravi Annapragada. 14 12 2016 30 03 2017 3D packaging Electrical design Physics of failure Reliability Managing the effects of mechanical stress in silicon chips is a growing challenge—both in order to optimize the device performance...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020911.
Paper No: EP-16-1144
Published Online: June 12, 2017
... 12 2016 07 04 2017 3D packaging Reliability Thermal analysis In order to improve the performance and to reduce the power consumption of electronic products such as mobile phones and wearable devices, the size of semiconductor devices has been miniaturized continuously...