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Keywords: Area array
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031007.
Paper No: EP-18-1009
Published Online: June 11, 2018
.... Assoc. Editor: Jin Yang. 28 01 2018 12 05 2018 Area array COB Failure analysis Flip chip Reliability Solder Nowadays, the urgent requirement of fine-pitch interconnects in microelectronic packages, and the utilization of lead-free solders considering environmental...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041007.
Paper No: EP-17-1007
Published Online: October 13, 2017
... concentration within the SPC is important to achieve stable conduction path formation. We believe that the proposed BGA interconnection technique using SPCs with LMPA fillers has the potential to be a useful alternative for area-array-type microelectronics package applications. Basic Science Research...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031009.
Paper No: EP-17-1012
Published Online: July 14, 2017
... manuscript received May 31, 2017; published online July 14, 2017. Assoc. Editor: Xiulin Ruan. 30 01 2017 31 05 2017 Area array BGA Conductive adhesives Conductive Inks Conformal coatings Electronic Flip chip High density interconnects Microsystems PWB Rework SMT Underfill...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031004.
Paper No: EP-16-1110
Published Online: June 14, 2017
... Conference on High Density Microsystem Design and Packaging and Component Failure Analysis ( HDP ), Shanghai, China, June 27–30, pp. 242 – 246 . 10.1109/HDP.2006.1707600 3D packaging Area array Chip stacking Failure analysis High density interconnects Microsystems In two-dimensional...
Journal Articles
Article Type: Review Articles
J. Electron. Packag. March 2017, 139(1): 010801.
Paper No: EP-16-1092
Published Online: November 23, 2016
... 2016 Area array MCM Memory Packaging PWB Thermal analysis In the era of internet of things (IoT), the world depends on the gigantic fabric of communication networks. At the hubs of internets, server computers control traffic of diverse sorts of information generated and consumed...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041001.
Paper No: EP-14-1082
Published Online: August 10, 2016
... ACKAGING . Manuscript received September 29, 2014; final manuscript received July 14, 2016; published online August 10, 2016. Assoc. Editor: Toru Ikeda. 29 09 2014 14 07 2016 3D packaging Area array COB CSP FR-4 Wafer level packaging Mechanical failures of hand-held...