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Keywords: BGA
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011003.
Paper No: EP-23-1001
Published Online: May 15, 2023
... fatigue thermal cycling BGA surrogate-model The ever-rising electrification and the increasing percentage of electrified vehicles lead to a wider range of electronic equipment. Due to changing thermal loads and vibrations, these components need to withstand challenging conditions during...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031005.
Paper No: EP-22-1066
Published Online: January 27, 2023
... materials. Real solder joints often encountered in ball grid array (BGA) components have only been considered in limited investigations. In this study, a specialized sandwich BGA test vehicle with a 3 × 3 solder joint was connected to the two substrates. The alloys were tested at room temperature using...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041005.
Paper No: EP-17-1072
Published Online: September 10, 2018
...Qiming Zhang; Jeffery C. C. Lo; S. W. Ricky Lee; Wei Xu In recent years, due to the increased size of ball grid array (BGA) devices, the assembly of BGAs on printed circuit boards through surface mount technology has encountered unprecedented challenges from thermal warpage. The excessive warpage...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041004.
Paper No: EP-17-1062
Published Online: August 20, 2018
... response of the assembly over time. Reliability tests were performed using the resonance tracking sinusoidal test method for assemblies, each consisting of a centrally mounted ball grid array (BGA) device assembled with 63Sn37Pb and SAC105 solder alloys. These tests show that the resonance tracking method...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020905.
Paper No: EP-17-1083
Published Online: May 9, 2018
... of BGA packages. The values are listed in the Table 1 along with the BGA package size used in the evaluation. A review of literature shows exponents in the same range of −5 to −8 for lead free solder alloy. For leaded alloy, it is reported to be smaller and will lead to differences in accelerated...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041007.
Paper No: EP-17-1007
Published Online: October 13, 2017
...Byung-Seung Yim; Young-Eui Shin; Jong-Min Kim In this work, a novel ball grid array (BGA) interconnection process has been developed using solderable polymer–solder composites (SPCs) with low-melting-point alloy (LMPA) fillers to enhance the processability of the conventional capillary underfill...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041001.
Paper No: EP-16-1151
Published Online: July 27, 2017
.... Electroless nickel immersion gold surface finished was applied onto the finished substrates for filter assembly and BGA balling. The substrate fabrication results are shown in Fig. 9 . Fig. 9 Fabrication results of glass substrates: ( a ) electroless SAP metalized layers M1–M4 and ( b ) an embedded...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031009.
Paper No: EP-17-1012
Published Online: July 14, 2017
... manuscript received May 31, 2017; published online July 14, 2017. Assoc. Editor: Xiulin Ruan. 30 01 2017 31 05 2017 Area array BGA Conductive adhesives Conductive Inks Conformal coatings Electronic Flip chip High density interconnects Microsystems PWB Rework SMT Underfill...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 011003.
Paper No: EP-15-1113
Published Online: March 10, 2016
... described. Also, a simple equation for estimating ball grid array (BGA) solder joint axial stiffness was developed. The results of the analytical solution were validated with modal analysis measurements and finite element (FE) models data in terms of natural frequencies and mode shapes. Then, the analytical...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041004.
Paper No: EP-14-1080
Published Online: October 1, 2015
...Tzeng Yih-Fong; Chen Fu-Chen; Chen Chih-Huang This paper presents an integrated approach combining principal component analysis (PCA) and Taguchi methods to develop a ball grid array (BGA), gold (Au) wire bonding process with multiple quality characteristics optimization. Eight main process factors...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021012.
Paper No: EP-14-1077
Published Online: June 1, 2015
... on to apply beyond the region of the test. Individual ball grid array (BGA) scale Sn3Ag0.5Cu (SAC305) solder joints were subjected to isothermal shear fatigue testing at room temperature and 65 °C. The resulting mechanical response degradation and crack behavior, including strain hardening, crack initiation...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 446–451.
Published Online: January 13, 2005
...) solders flip-chip devices high-temperature electronics flip-chip bump/UBM BGA lead-free solder reliability test In packages, defects are mostly found in solder joints. To meet the requirement of environment protection, the related research and development of the lead-free solder become...