... creep values. Table 3 Accumulated creep strain as predicted by the different constrain methods for the die-shadow-ball of the BGA Accumulated creep strain as predicted by the different constrain methods for the die-shadow-ball of the BGA Fully constrained a Unrefined Refined...

... materials. Real solder joints often encountered in ball grid array (BGA) components have only been considered in limited investigations. In this study, a specialized sandwich BGA test vehicle with a 3 × 3 solder joint was connected to the two substrates. The alloys were tested at room temperature using...

...Qiming Zhang; Jeffery C. C. Lo; S. W. Ricky Lee; Wei Xu In recent years, due to the increased size of ball grid array (BGA) devices, the assembly of BGAs on printed circuit boards through surface mount technology has encountered unprecedented challenges from thermal warpage. The excessive warpage...

... response of the assembly over time. Reliability tests were performed using the resonance tracking sinusoidal test method for assemblies, each consisting of a centrally mounted ball grid array (BGA) device assembled with 63Sn37Pb and SAC105 solder alloys. These tests show that the resonance tracking method...

.... , and Chung , S. , 2011 , “ High-Cycle Fatigue Life Prediction for Pb-Free BGA Under Random Vibration Loading ,” Microelectron. Reliab. , 51 ( 3 ), pp. 649 – 656 . 10.1016/j.microrel.2010.10.003 [26] MacWilliams , J. , 2013 , “ Electronic Connectors ,” iNEMI Technology Roadmaps, Herndon, VA...

...Byung-Seung Yim; Young-Eui Shin; Jong-Min Kim In this work, a novel ball grid array (BGA) interconnection process has been developed using solderable polymer–solder composites (SPCs) with low-melting-point alloy (LMPA) fillers to enhance the processability of the conventional capillary underfill...

... linewidth/space of 30  μ m/15  μ m and 8  μ m thickness, giving consideration to the skin depth and processability of thin-film laminations. Through glass vias (TGVs) with 100  μ m diameter interconnected the input and output terminals of SAW filter impedance matching networks to the BGA solder balls...

... manuscript received May 31, 2017; published online July 14, 2017. Assoc. Editor: Xiulin Ruan. 30 01 2017 31 05 2017 Area array BGA Conductive adhesives Conductive Inks Conformal coatings Electronic Flip chip High density interconnects Microsystems PWB Rework SMT Underfill...

... described. Also, a simple equation for estimating ball grid array (BGA) solder joint axial stiffness was developed. The results of the analytical solution were validated with modal analysis measurements and finite element (FE) models data in terms of natural frequencies and mode shapes. Then, the analytical...

...Tzeng Yih-Fong; Chen Fu-Chen; Chen Chih-Huang This paper presents an integrated approach combining principal component analysis (PCA) and Taguchi methods to develop a ball grid array (BGA), gold (Au) wire bonding process with multiple quality characteristics optimization. Eight main process factors...

... results for lead free solder joints require the identification of a damage function that can be counted on to apply beyond the region of the test. Individual ball grid array (BGA) scale Sn3Ag0.5Cu (SAC305) solder joints were subjected to isothermal shear fatigue testing at room temperature and 65 °C...

... silver alloys lead alloys failure analysis testing 62/63/2 solder in situ solder characterization area array package chips BGA printed wiring boards test methods failure modes An area array package (AAP) assembly consists of an integrated circuit (silicon chip) packaged...

...) solders flip-chip devices high-temperature electronics flip-chip bump/UBM BGA lead-free solder reliability test In packages, defects are mostly found in solder joints. To meet the requirement of environment protection, the related research and development of the lead-free solder become...