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Keywords: Ball Grid Array (BGA)
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Journal Articles

Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions

Tae-Sang Park, Soon-Bok Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 237–244.
https://doi.org/10.1115/1.1871192
Published Online: May 26, 2004
...Tae-Sang Park; Soon-Bok Lee To give a proper and accurate estimation of the fatigue life of ball grid array (BGA) solder joints, a mechanical fatigue test method under mixed-mode loading is proposed. Experiments were conducted with 63 Sn ∕ 37 Pb and Sn ∕ 3.5 Ag ∕ 0.75 Cu solder joints in room...
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Topics: Ball-Grid-Array packaging, Displacement, Fatigue life, Fatigue testing, Low cycle fatigue, Solder joints, Solders, Stress, Testing, Tin
Journal Articles

Flip-Chip BGA Design to Avert Die Cracking

J.-B. Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 58–63.
https://doi.org/10.1115/1.1329130
Published Online: October 29, 1999
... of experiments Ball Grid Array (BGA) Crack Die Finite Element Analysis (FEA) Flip-Chip Fracture Mechanics Design Methodology Design of Experiment (DOE) Time to market has become a critical factor for electronics industry, which determines how much profit a company can make and how well...
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Topics: Ball-Grid-Array packaging, Design, Finite element analysis, Flip-chip, Fracture (Materials), Fracture (Process), Fracture mechanics, Cracking (Materials)