... investigated the thermosonic flip chip bonding of a copper pillar with a tin cap. The effect of bonding force on bonding strength was studied, and an average bonding strength 2500 g (approximately 84.8 MPa) was obtained in 2 s, at an optimized bonding force of 0.11 N per 40 μ m pillar bump, and substrate...

... Bumping Chip stacking The concealed force behind the successful journey from information technology toward internet of things is the rapid progress in accommodating more functionality with a single silicon chip. This improvement in integrated circuit (IC) performance was primarily achieved...

... of the microbumps used in three-dimensional (3D) integrated circuits (ICs) where the microsolder bumps have only a few microns of bond thicknesses. Several factors such as “squeezed out” solder geometry and IMC thickness are studied through a numerical experiment. Fatigue life is calculated using Coffin–Manson...

...Wan Ho Song; Ali Karimi; Yan Huang; Michael Mayer; Norman Zhou; Jae Pil Jung Bumping of microcircuits and substrates establishes interconnect points required for subsequent bonding of microelectronic components, allowing for power and data distribution. Simultaneous ultrasonic bonding of individual...