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Keywords: Bumping
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Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2018, 140(4): 044502.
Paper No: EP-18-1015
Published Online: August 6, 2018
... investigated the thermosonic flip chip bonding of a copper pillar with a tin cap. The effect of bonding force on bonding strength was studied, and an average bonding strength 2500 g (approximately 84.8 MPa) was obtained in 2 s, at an optimized bonding force of 0.11 N per 40 μ m pillar bump, and substrate...
Journal Articles
Article Type: Review Articles
J. Electron. Packag. March 2018, 140(1): 010801.
Paper No: EP-17-1076
Published Online: March 2, 2018
... Bumping Chip stacking The concealed force behind the successful journey from information technology toward internet of things is the rapid progress in accommodating more functionality with a single silicon chip. This improvement in integrated circuit (IC) performance was primarily achieved...
Journal Articles
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041007.
Published Online: October 29, 2009
...Wan Ho Song; Ali Karimi; Yan Huang; Michael Mayer; Norman Zhou; Jae Pil Jung Bumping of microcircuits and substrates establishes interconnect points required for subsequent bonding of microelectronic components, allowing for power and data distribution. Simultaneous ultrasonic bonding of individual...