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Keywords: CCD image sensorsClose
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 225–231.
Published Online: July 8, 2004
... January 2004 08 07 2004 solders failure (mechanical) finite element analysis nondestructive testing CCD image sensors electronics packaging For realistic design, reliability and failure analysis of materials such as solders for problems in electronic packaging, it is essential...