Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
NARROW
Format
Article Type
Subject Area
Topics
Date
Availability
1-10 of 10
Keywords: CFD
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011008.
Paper No: EP-19-1056
Published Online: October 10, 2019
...Wen-Xiao Chu; Jui-Lin Wu; Yeng-Yung Tsui; Chi-Chuan Wang This study focused on the improved designs of airflow management in container data centers having overhead air supply. The computational fluid dynamics (CFD) model is first validated with experimental results. Then, the impact of grille...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031008.
Paper No: EP-18-1108
Published Online: May 17, 2019
... optimal strategy is adopted for which the computational fluid dynamics (CFD) results, artificial neural network (ANN), and MOGA are combined. The tubes elliptic ratio and Reynolds number are the design variables. The objective functions include Colburn factor (j) and friction factor (f). The CFD results...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021001.
Paper No: EP-18-1068
Published Online: February 25, 2019
...Georgios Karamanis; Marc Hodes We provide an algorithm to optimize the geometry of the fins in an array of longitudinal-fin heat sinks (HSs) in, e.g., a blade server, which is a prohibitively long task using computational fluid dynamics (CFD). First, banks of CFD simulations are run to precompute...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021010.
Paper No: EP-14-1016
Published Online: June 1, 2015
... assessment of the impact of leaks in the cold aisle that influence the temperature and flow rates. A detailed modeling approach of CACSs is achieved and the results are validated using experimental data. The flow and temperature measurements are shown to be in very good agreement with the CFD results...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011004.
Paper No: EP-13-1140
Published Online: October 6, 2014
... electronic cooling CFD Cooling technology has been developed to prevent damage to electronic components caused by overheating and to improve operational stability. Forced convective air cooling is one of the most commonly used electronic cooling approaches, because of the ease of obtaining...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011006.
Published Online: March 19, 2012
.... With the measured data of temperatures and airflow velocities, the mathematic model is constructed using a commercial Computational Fluid Dynamics (CFD) software and experimental data to present a comparison between test results and numerical simulations. The area of the data center is 311 square meters...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021009.
Published Online: June 25, 2010
.... The computational fluid dynamics (CFD) software that is available has improved over the years. CFD software specific to data center thermal analysis has also been developed. This has improved the time lines of providing some quick analysis of the effects of new hardware into the data center. But it is critically...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021007.
Published Online: April 2, 2009
... was less than 20 times the line pattern width. computational fluid dynamics electronics packaging modules printed circuits semiconductor junctions thermal conductivity 3D module PCB pattern trace semiconductor junction temperature CFD CAD In 1965, Moore ( 1 ) suggested...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011006.
Published Online: January 31, 2008
..., such as the manufacturing cost and the design freedom. More importantly, this study has provided a further step in the direction of demonstrating the opening effect. computational fluid dynamics cooling natural convection substrates CFD experimental opening concept thermal solution Electronic cooling...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 28–34.
Published Online: May 1, 2006
... fluid dynamics (CFD) and finite element analyses (FEA). CFD analysis was used to extract transient heat transfer coefficients while subsequent FEA–thermal and FEA–structural analyses were used to calculate temperature distribution and strain energy density, respectively. The first step...