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Keywords: CFD
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011008.
Paper No: EP-19-1056
Published Online: October 10, 2019
...Wen-Xiao Chu; Jui-Lin Wu; Yeng-Yung Tsui; Chi-Chuan Wang This study focused on the improved designs of airflow management in container data centers having overhead air supply. The computational fluid dynamics (CFD) model is first validated with experimental results. Then, the impact of grille...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031008.
Paper No: EP-18-1108
Published Online: May 17, 2019
... optimal strategy is adopted for which the computational fluid dynamics (CFD) results, artificial neural network (ANN), and MOGA are combined. The tubes elliptic ratio and Reynolds number are the design variables. The objective functions include Colburn factor (j) and friction factor (f). The CFD results...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021001.
Paper No: EP-18-1068
Published Online: February 25, 2019
...Georgios Karamanis; Marc Hodes We provide an algorithm to optimize the geometry of the fins in an array of longitudinal-fin heat sinks (HSs) in, e.g., a blade server, which is a prohibitively long task using computational fluid dynamics (CFD). First, banks of CFD simulations are run to precompute...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021010.
Paper No: EP-14-1016
Published Online: June 1, 2015
... Nos. 1134867 and CNS-1040666. Nomenclature CAC = cold aisle containment CACS = cold aisle containment system CFD = computational fluid dynamics CRAC = computer room air conditioner f = free area ratio HAC = hot aisle containment K = pressure loss...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011004.
Paper No: EP-13-1140
Published Online: October 6, 2014
... Exchangers ,” ASME J. Heat Transfer , 130 ( 11 ), p. 111801 . 10.1115/1.2970072 [12] Barrett , A. V. , and Obinelo , I. F. , 1997 , “ Characterization of Longitudinal Fin Heat Sink Thermal Performance and Flow Bypass Effects Through CFD Methods ,” Thirteenth Annual IEEE Semiconductor...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011006.
Published Online: March 19, 2012
.... With the measured data of temperatures and airflow velocities, the mathematic model is constructed using a commercial Computational Fluid Dynamics (CFD) software and experimental data to present a comparison between test results and numerical simulations. The area of the data center is 311 square meters...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021009.
Published Online: June 25, 2010
.... The computational fluid dynamics (CFD) software that is available has improved over the years. CFD software specific to data center thermal analysis has also been developed. This has improved the time lines of providing some quick analysis of the effects of new hardware into the data center. But it is critically...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021007.
Published Online: April 2, 2009
... were divided into 4188 regions. All the regions have not only geometrical data such as coordinates and size but also effective anisotropic thermal conductivities. Inputting the attributes of all 4188 regions to the CFD software would be hugely time consuming. Although the inputting time would depend...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011006.
Published Online: January 31, 2008
..., such as the manufacturing cost and the design freedom. More importantly, this study has provided a further step in the direction of demonstrating the opening effect. Comparison between experimental measurements and CFD simulation The temperature distribution on the substrate can provide more evidence for the CFD...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 28–34.
Published Online: May 1, 2006
... fluid dynamics (CFD) and finite element analyses (FEA). CFD analysis was used to extract transient heat transfer coefficients while subsequent FEA–thermal and FEA–structural analyses were used to calculate temperature distribution and strain energy density, respectively. Temperature contour profile...