1-3 of 3
Keywords: COB
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies

Ye Tian, Ning Ren, Xiaoxia Jian, Tie Geng, Yiping Wu
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031007.
Paper No: EP-18-1009
DOI: https://doi.org/10.1115/1.4040298
Published Online: June 11, 2018
.... Assoc. Editor: Jin Yang. 28 01 2018 12 05 2018 Area array COB Failure analysis Flip chip Reliability Solder Nowadays, the urgent requirement of fine-pitch interconnects in microelectronic packages, and the utilization of lead-free solders considering environmental...
View Article
PDF
Topics: Flip-chip assemblies, Reliability, Soldering, Tin, Solders, Finite element analysis, Fracture (Materials), Intermetallic compounds
Journal Articles

Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response

Sharan Kallolimath, Jiang Jenny Zhou
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041001.
Paper No: EP-14-1082
DOI: https://doi.org/10.1115/1.4034187
Published Online: August 10, 2016
... ACKAGING . Manuscript received September 29, 2014; final manuscript received July 14, 2016; published online August 10, 2016. Assoc. Editor: Toru Ikeda. 29 09 2014 14 07 2016 3D packaging Area array COB CSP FR-4 Wafer level packaging Mechanical failures of hand-held...
View Article
PDF
Topics: Electrons, Finite element analysis, Lumber, Shock (Mechanics), Simulation, Stress, Solder joints, Modeling, Symmetry (Physics), Boundary-value problems
Journal Articles

Natural Convection Immersion Cooling With Enhanced Optical Performance of Light-Emitting Diode Systems

Enes Tamdogan, Mehmet Arik
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041006.
Paper No: EP-14-1089
DOI: https://doi.org/10.1115/1.4031480
Published Online: October 15, 2015
.... Editor: Shi-Wei Ricky Lee. 11 10 2014 28 08 2015 COB Dielectrics After extensively utilizing the incandescent lamps for more than a century, their disadvantages in terms of energy consumption and also short lifetimes have forced the scientists to invent better lighting...
View Article
PDF
Topics: Cooling, Heat transfer, Light-emitting diodes, Natural convection, Silicones, Heat conduction, Convection, Fluids, Domes (Structural elements), Coolants