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Keywords: COB
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031007.
Paper No: EP-18-1009
Published Online: June 11, 2018
.... Assoc. Editor: Jin Yang. 28 01 2018 12 05 2018 Area array COB Failure analysis Flip chip Reliability Solder Nowadays, the urgent requirement of fine-pitch interconnects in microelectronic packages, and the utilization of lead-free solders considering environmental...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041001.
Paper No: EP-14-1082
Published Online: August 10, 2016
... ACKAGING . Manuscript received September 29, 2014; final manuscript received July 14, 2016; published online August 10, 2016. Assoc. Editor: Toru Ikeda. 29 09 2014 14 07 2016 3D packaging Area array COB CSP FR-4 Wafer level packaging Mechanical failures of hand-held...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041006.
Paper No: EP-14-1089
Published Online: October 15, 2015
.... Editor: Shi-Wei Ricky Lee. 11 10 2014 28 08 2015 COB Dielectrics After extensively utilizing the incandescent lamps for more than a century, their disadvantages in terms of energy consumption and also short lifetimes have forced the scientists to invent better lighting...