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Keywords: CPU temperatures
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031014.
Paper No: EP-18-1110
Published Online: September 19, 2019
... increasing, and the growth in server power densities makes it ever more challenging to keep the servers below their maximum operating temperature. This paper presents a new dynamic load-balancing approach based on individual server central processing unit (CPU) temperatures. In this approach, a load balancer...
