...Y. W. Wang; M. Y. Tsai; Y. S. Chou A relatively low-cost and easy-to-use strain gauge measurement is proposed here as an alternative method for simultaneously determining the thermally induced warpages and the coefficients of thermal expansion (CTEs) of the flip-chip packages with a cap (or lid...

...Hu Guojun; Andrew A. O. Tay; Luan Jing-En; Ma Yiyi The reliability of the flip chip package is strongly influenced by underfill, which has a much higher coefficient of thermal expansion (CTE) compared with other packaging materials and leads to large thermomechanical stresses developed during...