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Keywords: Cu-Cu bonding
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2025, 147(1): 010801.
Paper No: EP-23-1084
Published Online: July 25, 2024
... researchers are studying Cu-SiO 2 bonding passionately. There are many technologies that use different bonding mechanisms to achieve Cu-SiO 2 bonding, which will affect the bonding strength directly. We review the mechanism and research progress of Cu-Cu bonding, SiO 2 -SiO 2 bonding. What is more, we...
Topics:
Bonding
