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Keywords: FR-4
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031001.
Paper No: EP-15-1102
Published Online: June 14, 2017
... manuscript received March 1, 2017; published online June 14, 2017. Assoc. Editor: Jeffrey C. Suhling. 26 09 2015 01 03 2017 Composite materials COTS Failure analysis FR-4 Harsh environment MEMS Microsystems Nanotechnolgy PWB Reliability SMT The ever increasing...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020907.
Paper No: EP-16-1139
Published Online: June 12, 2017
... Flexible circuits FR-4 Harsh environment Reliability Thermal analysis With a quadruple increase of optical enhancement in late 1990s creating new application opportunities, light emitting diodes (LEDs) have been widely adopted in various lighting applications with their superior properties...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011003.
Paper No: EP-16-1103
Published Online: December 7, 2016
... , S. , and Wang , Z. , 2016 , “ Directional Transport of High-Temperature Janus Droplets Mediated by Structural Topography ,” Nat. Phys. , 12 ( 6 ), pp. 606 – 613 . 10.1038/nphys3643 Flexible circuits FR-4 Polyimide Power packaging PWB Heat pipes have been used...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041001.
Paper No: EP-14-1082
Published Online: August 10, 2016
... ACKAGING . Manuscript received September 29, 2014; final manuscript received July 14, 2016; published online August 10, 2016. Assoc. Editor: Toru Ikeda. 29 09 2014 14 07 2016 3D packaging Area array COB CSP FR-4 Wafer level packaging Mechanical failures of hand-held...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010914.
Paper No: EP-15-1101
Published Online: March 10, 2016
... P ACKAGING . Manuscript received September 26, 2015; final manuscript received January 6, 2016; published online March 10, 2016. Assoc. Editor: Jeffrey C. Suhling. 26 09 2015 06 01 2016 Composite materials COTS FR-4 Harsh environment MEMS Microsystems Nanotechnolgy PWB...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041007.
Published Online: November 26, 2012
... of this type will be shown in Sec. 4.2 . Equation (6) shows the high sensitivity of SI; any supplementary fringe means an increase of λ /2 in displacement. For a frequency-doubled NdYAG laser, that is about 0.26  μ m. The FR-4 multilayer PCB is shown schematically in Fig. 2 . The most...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 260–265.
Published Online: October 27, 2006
... these demands. In the SBU process, additional dielectric and conductor layers are formed on a core board, which is typically made of FR-4. Microvias are formed on these layers to achieve an electrical connection between them and the core board. Resin-coated copper foil (RCC) is the most widely used dielectric...