... by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received May 29, 2018; final manuscript received July 19, 2018; published online September 10, 2018. Assoc. Editor: Satish Chaparala. 29 05 2018 19 07 2018 Flexible...

... in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received October 22, 2017; final manuscript received June 3, 2018; published online July 2, 2018. Assoc. Editor: Satish Chaparala. 22 10 2017 03 06 2018 Flexible circuits Power packaging Reliability Wirebond Silicon...

... Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received June 7, 2017; final manuscript received March 27, 2018; published online May 11, 2018. Assoc. Editor: Kaustubh Nagarkar. 07 06 2017 27 03 2018 Battery technology Flexible...

... control system. DCA Electrical design Flexible circuits Roll to Roll Manufacturing Sensors 12 10 2017 22 12 2017 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received October...

... Cards ,” IEEE SW Test Workshop, Semiconductor Test Workshop , San Diego, CA, June 8–11, accessed Feb. 28, 2017, http://www.swtest.org/swtw_library/2008proc/pdf/s06_01_ferguson_swtw2008.pdf [26] All Flex , 2016, “Existing Flexible Circuits,” All Flex Flexible Circuits, Northfield, MN, accessed...

... December 1, 2016; final manuscript received February 22, 2017; published online June 13, 2017. Assoc. Editor: Xiaobing Luo. 01 12 2016 22 02 2017 Composite materials Electronic Flexible circuits Nanotechnolgy Given the rapid recent development in heterogeneous integration...

...Justin A. Weibel; S. Ravi Annapragada 22 03 2017 31 03 2017 3D packaging Backplanes Chip stacking Failure analysis Flexible circuits Nanotechnolgy Reliability Solder Thermal analysis Underfill Wafer level packaging ASME's International Mechanical Engineering...

... Flexible circuits FR-4 Harsh environment Reliability Thermal analysis With a quadruple increase of optical enhancement in late 1990s creating new application opportunities, light emitting diodes (LEDs) have been widely adopted in various lighting applications with their superior properties...

... Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received December 26, 2016; final manuscript received April 3, 2017; published online April 28, 2017. Assoc. Editor: S. Ravi Annapragada. 26 12 2016 03 04 2017 Failure analysis Flexible...

... , S. , and Wang , Z. , 2016 , “ Directional Transport of High-Temperature Janus Droplets Mediated by Structural Topography ,” Nat. Phys. , 12 ( 6 ), pp. 606 – 613 . 10.1038/nphys3643 Flexible circuits FR-4 Polyimide Power packaging PWB Heat pipes have been used...

... ,” Master's thesis, Dalian University of Technology, Dalian, China. 27 12 2014 29 06 2016 Conductive Inks Direct write Flexible circuits Radio-frequency identification is the use of a wireless noncontact system for automatic identification and tracking [ 1 – 3 ]. A typical RFID...

.... , Morey , B. , Wang , X. , Ghaffari , R. , Huang , Y. , and Rogers , J. A. , 2015 , “ Soft Core/Shell Packages for Stretchable Electronics ,” Adv. Funct. Mater. , 25 ( 24 ), pp. 3698 – 3704 . 10.1002/adfm.201501086 Flexible circuits Nanotechnolgy Optoelectronics...

... of power; this resistor fails to operate beyond 13.3 W in the absence of fluid circulation. This is, to the best of our knowledge, the best thermal cooling performance ever achieved on multilayer organic substrates. Flexible circuits Organic electronics Power packaging SOP Thermal analysis...

... back to the evaporator as shown in Fig. 1 [ 1 ]. 3D packaging Flexible circuits MEMS Microsystems Nanotechnolgy Thermal analysis Wafer level packaging 04 08 2014 10 10 2014 Contributed by the Electronic and Photonic Packaging Division of ASME for publication...

... such as wet etching, creating a substantial amount of hazardous waste byproducts, which must be treated and disposed of properly. annealing CNT conductive silver ink direct write electrical design flexible circuits graphene inkjet-printed electronics low temperature bonding paper-based...