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Keywords: Flip chip
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031005.
Paper No: EP-20-1106
Published Online: January 19, 2021
... dispense pattern of recently favorable no-flow underfill process. e-mail:  aizatabas@usm.my 27 08 2020 07 11 2020 19 01 2021 flip chip finite volume method ball grid array BGA packaging no-flow underfill The utilization of area array packaging technology...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041006.
Paper No: EP-18-1016
Published Online: September 10, 2018
..., 2018; published online September 10, 2018. Assoc. Editor: Xiaobing Luo. 28 02 2018 20 07 2018 Flip chip MEMS Microsystems Solder The ongoing technical progress, especially in electronics and its miniaturization, continuously poses new challenges for joining technologies...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2018, 140(4): 044502.
Paper No: EP-18-1015
Published Online: August 6, 2018
... investigated the thermosonic flip chip bonding of a copper pillar with a tin cap. The effect of bonding force on bonding strength was studied, and an average bonding strength 2500 g (approximately 84.8 MPa) was obtained in 2 s, at an optimized bonding force of 0.11 N per 40 μ m pillar bump, and substrate...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041002.
Paper No: EP-18-1007
Published Online: August 3, 2018
... – 45 . 10.1109/MDAT.2015.2501302 [3] Lau , J. H. , 2016 , “ Recent Advances and New Trends in Flip Chip Technology ,” ASME J. Electron. Packag. , 138 ( 3 ), p. 030802 . 10.1115/1.4034037 [4] Thadesar , P. A. , Gu , X. , Alapati , R. , and Bakir , M. S. , 2016...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 011001.
Paper No: EP-17-1019
Published Online: March 2, 2018
...X. J. Yao; J. J. Fang; Wenjun Zhang The notion of permeability is very important in understanding and modeling the flow behavior of fluids in a special type of porous medium (i.e., the underfill flow in flip-chip packaging). This paper presents a new concept regarding permeability in a porous...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041010.
Paper No: EP-17-1026
Published Online: October 25, 2017
...Yasuo Takahashi; Hiroki Fukuda; Yasuhiro Yoneshima; Hideki Kitamura; Masakatsu Maeda Low-temperature microjoining, such as wire (or ribbon) bonding, tape automated bonding (TAB), and flip chip bonding (FCB), is necessary for electronics packaging. Each type of microjoining takes on various aspects...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041004.
Paper No: EP-17-1044
Published Online: September 5, 2017
... ACKAGING . Manuscript received April 25, 2017; final manuscript received July 26, 2017; published online September 5, 2017. Assoc. Editor: Yi-Shao Lai. 25 04 2017 26 07 2017 Chip stacking Flip chip Solder-capped Cu pillar bumps are widely used in three-dimensional (3D) chip...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041001.
Paper No: EP-16-1151
Published Online: July 27, 2017
... were bumped with ball grid arrays (BGAs), so that they could be flip-chip bonded onto landing pads on the substrates. The components for impedance matching of each type of filters were determined in Keysight advanced design system with the schematic diagram shown in Fig. 2 . Fig. 2 Schematic...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031009.
Paper No: EP-17-1012
Published Online: July 14, 2017
... manuscript received May 31, 2017; published online July 14, 2017. Assoc. Editor: Xiulin Ruan. 30 01 2017 31 05 2017 Area array BGA Conductive adhesives Conductive Inks Conformal coatings Electronic Flip chip High density interconnects Microsystems PWB Rework SMT Underfill...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041005.
Paper No: EP-14-1064
Published Online: October 12, 2015
...) Young's modulus (GPa) ε 1 ε 2 ε 3 ε 1 / ε 2 1.435 662 34 11 19.5 2.870 567 62 31 9.1 5.740 554 107 52 5.2 28.70 387 224 127 1.7 In order to demonstrate the ability of the microscale compliant interconnects as vibration isolator on an actual flip-chip...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011005.
Paper No: EP-12-1068
Published Online: December 31, 2013
... nucleation flip chip fine pitch high I/O density no-flow underfill void formation Flip chip in package (FCIP) technology has been invented to meet the electrical and mechanical requirements of high performance devices in electronics packaging industry. Such capabilities enables it to be widely...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041007.
Published Online: October 29, 2009
.... , 1995 , “ Modeling and Experimental Studies on Thermosonic Flip-Chip Bonding ,” IEEE Trans. Compon., Packag. Manuf. Technol., Part B 1070-9894 , 18 , pp. 728 – 733 . 10.1109/96.475282 Tan , Q. , Schaible , B. , Bond , L. J. , and Lee , Y. C. , 1998 , “ Thermosonic Flip...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031014.
Published Online: July 31, 2009
...Sangil Lee; M. J. Yim; Daniel Baldwin This paper investigates the void formation mechanism induced by chemical interaction between eutectic solder (Sn63/Pb37) wetting and no-flow underfill material curing during flip chip in package assembly. During the process, low weight molecular components...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011013.
Published Online: February 18, 2009
...Jin Yang; I. Charles Ume Microelectronics packaging technology has evolved from through-hole and bulk configurations to surface-mount and small-profile configurations. Surface mount devices, such as flip chip packages, chip scale packages, and ball grid arrays, use solder bump interconnections...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031005.
Published Online: July 30, 2008
...Cheng-fu Chen; Pramod C. Karulkar Underfill is usually modeled as an isotropic medium containing uniformly distributed filler particles. However, filler particles tend to settle (or segregate) and thus alter the mechanical response of the flip chip die attachment package. The integrity of such flip...