... dispense pattern of recently favorable no-flow underfill process. flip chip finite volume method ball grid array BGA packaging no-flow underfill The utilization of area array packaging technology such as ball grid array (BGA) package, chip scale package (CSP), and flip chip in the course...

...: Xiaobing Luo. 28 02 2018 20 07 2018 Flip chip MEMS Microsystems Solder The ongoing technical progress, especially in electronics and its miniaturization, continuously poses new challenges for joining technologies. Examples are the joining of dissimilar materials (e.g...

... investigated the thermosonic flip chip bonding of a copper pillar with a tin cap. The effect of bonding force on bonding strength was studied, and an average bonding strength 2500 g (approximately 84.8 MPa) was obtained in 2 s, at an optimized bonding force of 0.11 N per 40 μ m pillar bump, and substrate...

... – 45 . 10.1109/MDAT.2015.2501302 [3] Lau , J. H. , 2016 , “ Recent Advances and New Trends in Flip Chip Technology ,” ASME J. Electron. Packag. , 138 ( 3 ), p. 030802 . 10.1115/1.4034037 [4] Thadesar , P. A. , Gu , X. , Alapati , R. , and Bakir , M. S. , 2016...

.... Assoc. Editor: Jin Yang. 28 01 2018 12 05 2018 Area array COB Failure analysis Flip chip Reliability Solder Nowadays, the urgent requirement of fine-pitch interconnects in microelectronic packages, and the utilization of lead-free solders considering environmental...

...X. J. Yao; J. J. Fang; Wenjun Zhang The notion of permeability is very important in understanding and modeling the flow behavior of fluids in a special type of porous medium (i.e., the underfill flow in flip-chip packaging). This paper presents a new concept regarding permeability in a porous...

...Yasuo Takahashi; Hiroki Fukuda; Yasuhiro Yoneshima; Hideki Kitamura; Masakatsu Maeda Low-temperature microjoining, such as wire (or ribbon) bonding, tape automated bonding (TAB), and flip chip bonding (FCB), is necessary for electronics packaging. Each type of microjoining takes on various aspects...

... and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received April 25, 2017; final manuscript received July 26, 2017; published online September 5, 2017. Assoc. Editor: Yi-Shao Lai. 25 04 2017 26 07 2017 Chip stacking Flip chip...

... on ultrathin glass with high yield were developed. SAW and BAW filters were panel-level flip-chip assembled onto both sides of glass using mass reflow. BGA solder balling was accomplished through panel-level paste printing and reflow. The assembled 3D glass packages could be directly assembled onto PCBs...

... manuscript received May 31, 2017; published online July 14, 2017. Assoc. Editor: Xiulin Ruan. 30 01 2017 31 05 2017 Area array BGA Conductive adhesives Conductive Inks Conformal coatings Electronic Flip chip High density interconnects Microsystems PWB Rework SMT Underfill...

.... In the chip-attach process in flip-chip microelectronic packaging, the silicon chip (die) is attached to a substrate by forming joints between solder balls on the substrate and copper bumps on the chip. The chip-attach process uses flux materials to clean oxides on the solder balls in order to enable...

... OF E LECTRONIC P ACKAGING . Manuscript received June 30, 2014; final manuscript received September 16, 2015; published online October 12, 2015. Assoc. Editor: Susan Lu. 30 06 2014 16 09 2015 Flip chip Wafer level packaging Compliant interconnects are an emerging...

... Interconnection Technology: State of the Art ,” ASME J. Electron. Packag. , 136 ( 1 ), p. 014001 . 10.1115/1.4026615 [4] Peng , C.-T. , Liu , C.-M. , Lin , J.-C. , Cheng , H.-C. , and Chiang , K.-N. , 2004 , “ Reliability Analysis and Design for the Fine-Pitch Flip Chip BGA Packaging...

... nucleation flip chip fine pitch high I/O density no-flow underfill void formation Flip chip in package (FCIP) technology has been invented to meet the electrical and mechanical requirements of high performance devices in electronics packaging industry. Such capabilities enables it to be widely...

...Brett Fennell; Sangil Lee; Daniel F. Baldwin Conventional flip chip on board processing involves four major steps: flux application, solder reflow, underfill flow, and underfill cure. The latter two steps are particularly time consuming. To address this issue, a new flip chip process has been...

... moduli finite element analysis gold integrated circuit bonding integrated circuit interconnections stress effects ultrasonic bonding flip chip bumping chip stacking chip on board manufacturing technology finite elements stress analysis micromechanics Research interest...

...Sangil Lee; M. J. Yim; Daniel Baldwin This paper investigates the void formation mechanism induced by chemical interaction between eutectic solder (Sn63/Pb37) wetting and no-flow underfill material curing during flip chip in package assembly. During the process, low weight molecular components...

...Jin Yang; I. Charles Ume Microelectronics packaging technology has evolved from through-hole and bulk configurations to surface-mount and small-profile configurations. Surface mount devices, such as flip chip packages, chip scale packages, and ball grid arrays, use solder bump interconnections...

...S. B. Park; Rahul Joshi; Izhar Ahmed; Soonwan Chung Experimental and numerical techniques are employed to assess the thermomechanical behavior of ceramic and organic flip chip packages under power cycling (PC) and accelerated thermal cycling (ATC). In PC, nonuniform temperature distribution...

...Cheng-fu Chen; Pramod C. Karulkar Underfill is usually modeled as an isotropic medium containing uniformly distributed filler particles. However, filler particles tend to settle (or segregate) and thus alter the mechanical response of the flip chip die attachment package. The integrity of such flip...