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Keywords: Harsh environment
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031006.
Paper No: EP-17-1110
Published Online: June 11, 2018
... ]. Composite materials Conductive adhesives Harsh environment Nanotechnolgy Reliability Thermal analysis 15 10 2017 09 04 2018 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031005.
Paper No: EP-17-1107
Published Online: May 21, 2018
... manuscript received April 27, 2018; published online May 21, 2018. Assoc. Editor: Toru Ikeda. 12 10 2017 27 04 2018 Failure analysis Harsh environment Reliability Solder The fatigue failure of solder joints in printed circuit boards is one of the limiting factors...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031001.
Paper No: EP-17-1046
Published Online: May 10, 2018
... Electronic Encapsulant Harsh environment Reliability Thermal analysis Nowadays, application of outdoor electronics in daily life is constantly growing. Its deployment in climatically harsh environment creates a significant challenge for engineers to design reliable and durable electronic devices...
Journal Articles
Article Type: Guest Editorial
J. Electron. Packag. June 2018, 140(2): 020301.
Paper No: EP-18-1012
Published Online: May 9, 2018
... or reproduce the published form of this work, or allow others to do so, for United States Government purposes. 16 02 2018 21 02 2018 3D packaging Battery technology Harsh environment High density interconnects Microsystems Optoelectronics Power packaging Sensors SOC Wafer level...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020903.
Paper No: EP-17-1100
Published Online: May 9, 2018
... Harsh environment Power packaging Solder Power electronic devices are subject to continuously increasing heat dissipation levels because of growing current densities and voltage levels. Simultaneously, power electronic systems are becoming more miniaturized, further increasing dissipation heat...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020905.
Paper No: EP-17-1083
Published Online: May 9, 2018
... Connectors Harsh environment Physics of failure Reliability Autonomous vehicles represent a major innovation in the automotive industry. A key ingredient in these vehicles is the integration of electronics to improve safety, add comfort, sense, and react to internal and external environments...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021003.
Paper No: EP-17-1115
Published Online: May 9, 2018
... manuscript received March 20, 2018; published online May 9, 2018. Assoc. Editor: Eric Wong. 24 10 2017 20 03 2018 Electronic Failure analysis Harsh environment Metallographic cross sections were made of Au–Sn solder joint belonging to lid 7. The locations of those cross sections...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010905.
Paper No: EP-17-1099
Published Online: March 2, 2018
... . Manuscript received September 27, 2017; final manuscript received December 28, 2017; published online March 2, 2018. Assoc. Editor: Sreekant Narumanchi. 27 09 2017 28 12 2017 3D packaging Chip stacking Harsh environment Thermal analysis The adequate selection...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010906.
Paper No: EP-17-1101
Published Online: March 2, 2018
...Sandeep Mallampati; Liang Yin; David Shaddock; Harry Schoeller; Junghyun Cho Predominant high melting point solders for high-temperature and harsh environment electronics (operating temperatures from 200 to 250 °C) are Pb-based systems, which are being subjected to RoHS regulations because...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010903.
Paper No: EP-17-1090
Published Online: March 2, 2018
... and power electronics heterogeneously integrated into the motor must provide the proper hardware platform. These ultra-smart and ultra-compact power systems will operate in the harsh environments of regular automotive scale, where they must control the processes safely and reliably all time. Sudden...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031002.
Paper No: EP-16-1064
Published Online: June 14, 2017
... OURNAL OF E LECTRONIC P ACKAGING . Manuscript received May 18, 2016; final manuscript received January 3, 2017; published online June 14, 2017. Assoc. Editor: Toru Ikeda. 18 05 2016 03 01 2017 Failure analysis Harsh environment Microsystems Physics of failure Reliability SMT...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031001.
Paper No: EP-15-1102
Published Online: June 14, 2017
... Accelerometers in Harsh Environments ,” ASME Paper No. IPACK2015-48457. 10.1115/IPACK2015-48457 [12] Lall , P. , Abrol , A. , Simpson , L. , and Glover , J. , 2015 , “ Survivability of MEMS Accelerometer Under Sequential Thermal and High-G Mechanical Shock Environments ,” ASME Paper...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020907.
Paper No: EP-16-1139
Published Online: June 12, 2017
... Flexible circuits FR-4 Harsh environment Reliability Thermal analysis With a quadruple increase of optical enhancement in late 1990s creating new application opportunities, light emitting diodes (LEDs) have been widely adopted in various lighting applications with their superior properties...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020903.
Paper No: EP-16-1143
Published Online: April 24, 2017
... 17% and 7%, respectively, and of Fig. 12 are around 34% and 23% respectively. The results show the significant availability of outside air usage (free air cooling) at the Dallas test site during the year. Electronic Failure analysis Harsh environment Physics of failure Reliability Thermal...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020902.
Paper No: EP-16-1149
Published Online: April 24, 2017
... . Manuscript received December 27, 2016; final manuscript received March 24, 2017; published online April 24, 2017. Assoc. Editor: S. Ravi Annapragada. 27 12 2016 24 03 2017 Dielectrics Electronic Flip chip Harsh environment Polyimide Reliability Underfill A typical flip-chip...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011001.
Paper No: EP-16-1073
Published Online: November 10, 2016
... . Manuscript received June 14, 2016; final manuscript received October 25, 2016; published online November 10, 2016. Assoc. Editor: Mehdi Asheghi. 14 06 2016 25 10 2016 Chip stacking Failure analysis Harsh environment Micro vias SOC Thermal analysis Gallium nitride (GaN) based...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041003.
Paper No: EP-16-1046
Published Online: September 2, 2016
... 2016 14 08 2016 Harsh environment Reliability In microelectronics, there are many interfaces that come together to create a product. One such interface is found between flexible polymer films and rigid substrates. Whenever two materials are structurally bonded together, a potential...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010914.
Paper No: EP-15-1101
Published Online: March 10, 2016
... of SAC305 at High Strain Rates ,” ASME J. Electron. Packag. , 137 ( 1 ), p. 011010 . 10.1115/1.4028641 [4] Lall , P. , Kothari , N. , and Glover , J. , 2015 , “ Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments ,” ASME Paper...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021003.
Paper No: EP-14-1056
Published Online: June 1, 2015
... only, since they are made of hollowed aluminum, as it will be shown later. Second, there is no interface material between the contact surfaces. Thus, a new thermal connector is needed to satisfy these needs [ 1 ]. Harsh environment Printed cards card Thermal analysis The electrical...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011009.
Paper No: EP-14-1062
Published Online: October 15, 2014
... than the principal directions of the structure was examined. This method was found to have significant limitations, but showed better agreement with simultaneous multiaxial vibration experiments. Failure analysis Harsh environment Physics of failure Reliability Fig. 14 Single-axis...