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Keywords: Heat Transfer Performance FactorClose
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 104–113.
Published Online: March 14, 2003
... of air mass flow rate with a power of 1.265 is presented. Finally, both heat transfer performance factor “ j ” and pumping power factor “ f ” decrease with increasing Reynolds number in a power of 0.805; while they are independent of chip heat flux. The Colburn analogy can be adequately employed...