... technology for flexible and benign joining of heat-sensitive materials, e.g., for microelectromechanical systems (MEMS) applications. However, for successful reactive joining, precise control of heat production and heat distribution is mandatory in order to avoid damaging of the components during the process...

...Chia-Cheng Chang; Sheng-Da Lin; Kuo-Ning Chiang The fatigue characteristics of microelectromechanical systems (MEMS) material, such as silicon or polysilicon, have become very important. Many studies have focused on this topic, but none have defined a good methodology for extracting the applied...

...Kaysar Rahim; Ahsan Mian The packaging of electronic and microelectromechanical systems (MEMS) devices is an important part of the overall manufacturing process as it ensures mechanical robustness as well as required electrical/electromechanical functionalities. The packaging integration process...

... of an SMT microelectromechanical system (MEMS) component) in an SMT assembly is close to a natural frequency of the PWB, an amplified response is expected in the miniature structure. Components which are regarded as reliable under conventional qualification test methods may still pose a failure risk when...

... temperature variation. MEMS Microsystems Thermal analysis 12 08 2016 30 11 2016 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received August 12, 2016; final manuscript received...

.... The resonant response in the thickness direction of printed wiring boards (PWBs) (termed the dynamic “breathing mode” of response, in this study) acts as a mechanical bandpass filter and places miniature internal structures in some components (such as microelectromechanical systems (MEMS)) at risk of failure...

...Erdal Uzunlar; Paul A. Kohl This study aims at investigating a polymer-based air-gap creation method for the packaging of microelectromechanical systems (MEMS), and exploring the chemical composition of the polymer residue on the final package. Polymer-based air-gap formation utilizes thermal...

....2002.805055 [4] Chujo , H. , Matsumoto , K. , and Shimoyama , I. , 2003 , “ A High Flow Rate Electro-Osmotic Pump With Small Channels in Parallel ,” IEEE 16th Annual International Conference on Micro Electro Mechanical Systems ( MEMS-03 ), Kyoto, Japan , Jan. 19–23, pp. 351 – 354...

... the buoyancy forces are negligible compared to the surface tension forces. MEMS Thermal analysis Self-propulsion or pump-less flow of liquid by a variety of means lends significant advantages to form factor and power reduction in microelectronic cooling applications and microfluidic systems...

... a start-up company named Pi-MEMS led by Payam Bozorgi. The UCSB TGP is fabricated using multiscale UCSB Titanium (Ti) and Titania (TiO 2 ) processing technology including nanostructured titania (NST). The UCSB TGP features NST (a super-hydrophilic wick material) on microscale, deep etched Ti grooves...

... received June 2, 2013; final manuscript received October 2, 2013; published online April 29, 2014. Assoc. Editor: Gongnan Xie. 02 06 2013 02 10 2013 With the rapid development of microelectromechanical systems (MEMS) in IT industry, the heat flux in microchannel has reached a high...

... the application of fan-out WLP, 3D packaging integrating with WLP technologies and its application in microelectromechanical systems (MEMS). wafer level packaging fan-out WLP three-dimensional packaging reliability analysis MEMS review Chip scale package (CSP) is defined as the package that has...

.... Editor: Gamal Refai-Ahmed. 02 08 2012 07 03 2013 Steady state behavior of a thermally actuated RF MEMS switch in the open and closed positions is simulated using the governing thermal and structural equations. The switch is a bridge with a length of 250 microns, a width of 50 microns...

.... , and Talghader , J. J. , 2002 , “ Thermal Contact Conductance of Actuated Interface ,” Appl. Phys. Lett. 0003-6951 , 81 , pp. 1216 – 1218 . 10.1063/1.1499518 Cho , J. , Richards , C. , Bahr , D. , Jiao , J. , and Richards , R. , 2008 , “ Evaluation of Contacts for MEMS...

...Fadi Alsaleem; Mohammad I. Younis; Ronald Miles We present an investigation into the effect of the motion of a printed circuit board (PCB) on the response of a microelectromechanical system (MEMS) device to shock loads. A two-degrees-of-freedom model is used to model the motion of the PCB...