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Keywords: MEMS
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041006.
Paper No: EP-18-1016
Published Online: September 10, 2018
... technology for flexible and benign joining of heat-sensitive materials, e.g., for microelectromechanical systems (MEMS) applications. However, for successful reactive joining, precise control of heat production and heat distribution is mandatory in order to avoid damaging of the components during the process...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031008.
Paper No: EP-18-1004
Published Online: June 26, 2018
...Chia-Cheng Chang; Sheng-Da Lin; Kuo-Ning Chiang The fatigue characteristics of microelectromechanical systems (MEMS) material, such as silicon or polysilicon, have become very important. Many studies have focused on this topic, but none have defined a good methodology for extracting the applied...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031001.
Paper No: EP-15-1102
Published Online: June 14, 2017
... of an SMT microelectromechanical system (MEMS) component) in an SMT assembly is close to a natural frequency of the PWB, an amplified response is expected in the miniature structure. Components which are regarded as reliable under conventional qualification test methods may still pose a failure risk when...
Journal Articles
Article Type: Review Articles
J. Electron. Packag. September 2017, 139(3): 030801.
Paper No: EP-16-1146
Published Online: June 14, 2017
...Kaysar Rahim; Ahsan Mian The packaging of electronic and microelectromechanical systems (MEMS) devices is an important part of the overall manufacturing process as it ensures mechanical robustness as well as required electrical/electromechanical functionalities. The packaging integration process...
Topics: Lasers, Packaging
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011006.
Paper No: EP-16-1097
Published Online: January 5, 2017
... OF E LECTRONIC P ACKAGING . Manuscript received August 12, 2016; final manuscript received November 30, 2016; published online January 5, 2017. Assoc. Editor: M. Baris Dogruoz. 12 08 2016 30 11 2016 MEMS Microsystems Thermal analysis New cooling solutions are needed...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010914.
Paper No: EP-15-1101
Published Online: March 10, 2016
.... The resonant response in the thickness direction of printed wiring boards (PWBs) (termed the dynamic “breathing mode” of response, in this study) acts as a mechanical bandpass filter and places miniature internal structures in some components (such as microelectromechanical systems (MEMS)) at risk of failure...
Journal Articles
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021009.
Paper No: EP-14-1073
Published Online: June 1, 2015
... the buoyancy forces are negligible compared to the surface tension forces. MEMS Thermal analysis Self-propulsion or pump-less flow of liquid by a variety of means lends significant advantages to form factor and power reduction in microelectronic cooling applications and microfluidic systems...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021001.
Paper No: EP-14-1059
Published Online: June 1, 2015
..., particularly in the case of the Si-PDMS micropump, would lead to enhanced heat transfer for microchip cooling applications as well as for applications involving micrototal analysis systems ( μ TAS). Electronic MEMS EOF pumping is directly applied to the fluid, whereas mechanical pumping requires...
Journal Articles
Article Type: Review Articles
J. Electron. Packag. March 2015, 137(1): 010801.
Paper No: EP-14-1069
Published Online: November 14, 2014
... a start-up company named Pi-MEMS led by Payam Bozorgi. The UCSB TGP is fabricated using multiscale UCSB Titanium (Ti) and Titania (TiO 2 ) processing technology including nanostructured titania (NST). The UCSB TGP features NST (a super-hydrophilic wick material) on microscale, deep etched Ti grooves...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021001.
Paper No: EP-13-1044
Published Online: April 29, 2014
...; published online April 29, 2014. Assoc. Editor: Gongnan Xie. 02 06 2013 02 10 2013 With the rapid development of microelectromechanical systems (MEMS) in IT industry, the heat flux in microchannel has reached a high level which demands preferable cooling technology. Water cooling has...
Journal Articles
Article Type: Technology Review
J. Electron. Packag. June 2014, 136(2): 024002.
Paper No: EP-14-1006
Published Online: April 29, 2014
... the application of fan-out WLP, 3D packaging integrating with WLP technologies and its application in microelectromechanical systems (MEMS). wafer level packaging fan-out WLP three-dimensional packaging reliability analysis MEMS review Chip scale package (CSP) is defined as the package that has...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021011.
Paper No: EP-12-1075
Published Online: April 12, 2013
.... Editor: Gamal Refai-Ahmed. 02 08 2012 07 03 2013 Steady state behavior of a thermally actuated RF MEMS switch in the open and closed positions is simulated using the governing thermal and structural equations. The switch is a bridge with a length of 250 microns, a width of 50 microns...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041004.
Published Online: November 23, 2010
... Conductance of Actuated Interface ,” Appl. Phys. Lett. 0003-6951 , 81 , pp. 1216 – 1218 . 10.1063/1.1499518 Cho , J. , Richards , C. , Bahr , D. , Jiao , J. , and Richards , R. , 2008 , “ Evaluation of Contacts for MEMS Thermal Switch ,” J. Micromech. Microeng. 0960-1317...
Journal Articles