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Keywords: Mechanical Shock
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2019, 141(1): 011004.
Paper No: EP-18-1055
Published Online: February 25, 2019
...-density hermetic package components. The aim of this paper is to assess the touch risk of high-density package component under mechanical shock condition. An experiment setup, which can obtain the touch critical load and detect the wires swing touch through voltage signal captured by oscilloscope...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031011.
Paper No: EP-13-1121
Published Online: September 1, 2015
...) drop test mechanical shock Since the introduction of popular portable products like smart phones, tablets, researchers and leading developers of consumer-based electronics have been shifting their focus to impact and drop characterization of portable devices. Industry impact qualifications...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 375–380.
Published Online: February 14, 2005
...Rashed Adnan Islam; Y. C. Chan The contact resistances investigated by this study of ACF joints using Au ∕ Ni bumps and flexible substrates are found to be increased by the induced mechanical shock and also by the combined effect of heat/humidity and the mechanical shock. The samples humidified...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 144–152.
Published Online: March 14, 2003
...Z. Y. Zhu; H. P. Lee; B. T. Cheok A numerical study of the effects of mechanical shock on Radio Frequency (RF) connectors is presented. The finite element method is used to analyze the mechanical shock responses of RF connectors. Three commonly used shock profiles, namely the rectangular...