.... , Samajdar , I. , Haldar , A. , and Sain , A. , 2013 , “ Micromechanics of Emergent Patterns in Plastic Flows ,” Sci. Rep. , 3 ( 1 ), p. 2728 . 10.1038/srep02728 e-mail:  hzh29@mail.sysu.edu.cn 19 05 2019 14 08 2019 10 10 2019 3D packaging micro...

... packaging Chip stacking Electrical design Flip chip Micro vias Reliability Thermal analysis Through-silicon via (TSV)-based three-dimensional (3D) integration presents a path toward reduced delay, reduced power consumption, higher performance, smaller packaging size, and heterogeneous...

... OF E LECTRONIC P ACKAGING . Manuscript received December 25, 2016; final manuscript received February 28, 2017; published online June 14, 2017. Assoc. Editor: Satish Chaparala. 25 12 2016 28 02 2017 3D packaging CSP Electronic Flexible circuits MEMS Micro vias PWB...

... and silicon CMOS, so as to benefit from the afore described advantages offered by such an arrangement. Chip stacking Failure analysis Harsh environment Micro vias SOC Thermal analysis 14 06 2016 25 10 2016 Contributed by the Electronic and Photonic Packaging Division of ASME...

.... Editor: Mehdi Asheghi. 14 09 2015 14 03 2016 3D packaging Micro vias Improvements in high-performance two-dimensional semiconductors are becoming significantly more difficult to achieve, as fundamental physical issues associated with further scaling down standard...

..., the state-of-the-art, challenge, and trend of 3D integration will be presented and examined. Furthermore, supply chain readiness for high volume manufacturing (HVM) of TSVs is discussed. 3D packaging Micro vias Microsystems Underfill Wirebond Fig. 10 Micron’s sample on HMC [ 140...