...: Xiaobing Luo. 28 02 2018 20 07 2018 Flip chip MEMS Microsystems Solder The ongoing technical progress, especially in electronics and its miniaturization, continuously poses new challenges for joining technologies. Examples are the joining of dissimilar materials (e.g...

... LECTRONIC P ACKAGING . Manuscript received January 15, 2018; final manuscript received May 9, 2018; published online June 26, 2018. Assoc. Editor: Toru Ikeda. 15 01 2018 09 05 2018 Failure analysis MEMS Microsystems Physics of failure Reliability Sensors...

... OF E LECTRONIC P ACKAGING . Manuscript received September 14, 2017; final manuscript received January 31, 2018; published online May 11, 2018. Assoc. Editor: Baris Dogruoz. 14 09 2017 31 01 2018 3D packaging Dielectrics Microsystems Power packaging Solder Thermal analysis...

... or reproduce the published form of this work, or allow others to do so, for United States Government purposes. 16 02 2018 21 02 2018 3D packaging Battery technology Harsh environment High density interconnects Microsystems Optoelectronics Power packaging Sensors SOC Wafer level...

... ACKAGING . Manuscript received February 12, 2017; final manuscript received October 27, 2017; published online March 2, 2018. Assoc. Editor: Yi-Shao Lai. 12 02 2017 27 10 2017 Flip chip Microsystems Underfill The flow of a Newtonian fluid in a porous medium (as shown in Fig...

... manuscript received May 31, 2017; published online July 14, 2017. Assoc. Editor: Xiulin Ruan. 30 01 2017 31 05 2017 Area array BGA Conductive adhesives Conductive Inks Conformal coatings Electronic Flip chip High density interconnects Microsystems PWB Rework SMT Underfill...

... OURNAL OF E LECTRONIC P ACKAGING . Manuscript received May 18, 2016; final manuscript received January 3, 2017; published online June 14, 2017. Assoc. Editor: Toru Ikeda. 18 05 2016 03 01 2017 Failure analysis Harsh environment Microsystems Physics of failure Reliability SMT...

..., it is possible to design a configuration with substantially low average peeling stress level at the aluminum/passivation interface which has a greatly reduced risk of failure. References [1] Ben Yoo , S. J. , 2015 , “ Heterogeneous 2D and 3D Photonic Integration for Future Chip-Scale Microsystems...

..., Actuators and Microsystems ( TRANSDUCERS & EUROSENSORS XXVII ), Barcelona, Spain, June 16–20, pp. 1835 – 1838 . 10.1109/Transducers.2013.6627147 [17] Sheehy , M. , Reid , M. , Punch , J. , Goyal , S. , and Kelly , G. , 2008 , “ The Failure Mechanisms of Micro-Scale...

... OF E LECTRONIC P ACKAGING . Manuscript received August 12, 2016; final manuscript received November 30, 2016; published online January 5, 2017. Assoc. Editor: M. Baris Dogruoz. 12 08 2016 30 11 2016 MEMS Microsystems Thermal analysis New cooling solutions are needed...

... Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received July 13, 2016; final manuscript received November 15, 2016; published online January 5, 2017. Assoc. Editor: M. Baris Dogruoz. 13 07 2016 15 11 2016 Microsystems Thermal analysis...

... is unlimited. 24 06 2016 04 11 2016 Composite materials Conductive adhesives Microsystems Solder Thermal analysis The performance characteristics of TIMs continue to improve rapidly with the development of novel nanostructured materials and advanced manufacturing processes...

.... Editor: Toru Ikeda. 05 06 2016 13 08 2016 High density interconnects Microsystems Reliability Solder The solder joints used as interconnects in today's electronic packaging continue to get smaller and smaller in size to meet the demand on further miniaturization...

... with microscale pore size and pressure regulating valves are also common components in these systems. 3D packaging Microsystems Thermal analysis 16 01 2016 21 07 2016 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E...

....53.005745 Bio-Research Microsystems The traditional approach to microfluidics is based on monolithic integration of multiple components on a single chip [ 1 , 2 ]. This approach allows for the simultaneous fabrication of multiple components including, but not limited to, microfluidic...

... received June 27, 2016; published online July 28, 2016. Assoc. Editor: Pradip Dutta. 16 01 2016 27 06 2016 Microsystems Thermal analysis The rise in energy consumption by data centers over the last few decades has necessitated technological progress in nearly every field...

... February 24, 2016; final manuscript received May 1, 2016; published online May 19, 2016. Assoc. Editor: Xiaobing Luo. 24 02 2016 01 05 2016 Microsystems Thermal analysis Consistent trends toward achieving higher computing performance have led to the miniaturization...

... detachment and coalescence in bends were avoided by an additional bend within the curve based on systematically varied geometrical dimensions. 1 Corresponding author. 01 10 2015 02 01 2016 Microsystems In this work, a modular redispersion system is used to evaluate the bubble...

.... 185 – 196 . http://www.techstreet.com/ashrae/products/1838630 3D packaging Microsystems Thermal analysis Gallium nitride (GaN) HEMTs have received considerable attention over the last decade due to the material characteristics that improve electrical performance [ 1 ]. Thermal...

... and Microsystems ( TRANSDUCERS ), Anchorage, AK, June 21–25, pp. 1144 – 1147 10.1109/TRANSDUCERS.2015.7181130 . [6] Goyal , S. , Upasani , S. , and Patel , D. M. , 1999 , “ Improving Impact Tolerance of Portable Electronic Products: Case Study of Cellular Phones ,” Exp. Mech. , 39 ( 1 ), pp...