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Keywords: Microsystems
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041006.
Paper No: EP-18-1016
Published Online: September 10, 2018
..., 2018; published online September 10, 2018. Assoc. Editor: Xiaobing Luo. 28 02 2018 20 07 2018 Flip chip MEMS Microsystems Solder The ongoing technical progress, especially in electronics and its miniaturization, continuously poses new challenges for joining technologies...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031008.
Paper No: EP-18-1004
Published Online: June 26, 2018
... MEMS Microsystems Physics of failure Reliability Sensors Microelectromechanical systems (MEMS) have been widely used in many sensor applications. They can be miniaturized and integrated into the standard CMOS process. Most MEMS structures are moveable and easily generate cyclic deflection...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031003.
Paper No: EP-17-1081
Published Online: May 11, 2018
... in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received September 14, 2017; final manuscript received January 31, 2018; published online May 11, 2018. Assoc. Editor: Baris Dogruoz. 14 09 2017 31 01 2018 3D packaging Dielectrics Microsystems Power packaging Solder Thermal...
Journal Articles
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2018, 140(2): 020301.
Paper No: EP-18-1012
Published Online: May 9, 2018
... or reproduce the published form of this work, or allow others to do so, for United States Government purposes. 16 02 2018 21 02 2018 3D packaging Battery technology Harsh environment High density interconnects Microsystems Optoelectronics Power packaging Sensors SOC Wafer level...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 011001.
Paper No: EP-17-1019
Published Online: March 2, 2018
... for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received February 12, 2017; final manuscript received October 27, 2017; published online March 2, 2018. Assoc. Editor: Yi-Shao Lai. 12 02 2017 27 10 2017 Flip chip Microsystems Underfill The flow of a Newtonian...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031009.
Paper No: EP-17-1012
Published Online: July 14, 2017
... manuscript received May 31, 2017; published online July 14, 2017. Assoc. Editor: Xiulin Ruan. 30 01 2017 31 05 2017 Area array BGA Conductive adhesives Conductive Inks Conformal coatings Electronic Flip chip High density interconnects Microsystems PWB Rework SMT Underfill...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031004.
Paper No: EP-16-1110
Published Online: June 14, 2017
... analysis High density interconnects Microsystems In two-dimensional (2D) packaging, a silicon chip is assembled directly on a higher coefficient of thermal expansion (CTE) ceramic or an organic substrate. Tin-based solder interconnects are typically used to connect the chip to the substrate. Two...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031002.
Paper No: EP-16-1064
Published Online: June 14, 2017
... OURNAL OF E LECTRONIC P ACKAGING . Manuscript received May 18, 2016; final manuscript received January 3, 2017; published online June 14, 2017. Assoc. Editor: Toru Ikeda. 18 05 2016 03 01 2017 Failure analysis Harsh environment Microsystems Physics of failure Reliability SMT...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031001.
Paper No: EP-15-1102
Published Online: June 14, 2017
... Conference on Solid-State Sensors, Actuators and Microsystems ( TRANSDUCERS & EUROSENSORS XXVII ), Barcelona, Spain, June 16–20, pp. 1835 – 1838 . 10.1109/Transducers.2013.6627147 [17] Sheehy , M. , Reid , M. , Punch , J. , Goyal , S. , and Kelly , G. , 2008 , “ The Failure...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011006.
Paper No: EP-16-1097
Published Online: January 5, 2017
... temperature variation. MEMS Microsystems Thermal analysis 12 08 2016 30 11 2016 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received August 12, 2016; final manuscript received...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011005.
Paper No: EP-16-1083
Published Online: January 5, 2017
... transfer in multi-microchannel evaporators under such conditions is currently very limited in the open literature. Microsystems Thermal analysis 13 07 2016 15 11 2016 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011004.
Paper No: EP-16-1075
Published Online: December 29, 2016
... is unlimited. 24 06 2016 04 11 2016 Composite materials Conductive adhesives Microsystems Solder Thermal analysis The performance characteristics of TIMs continue to improve rapidly with the development of novel nanostructured materials and advanced manufacturing processes...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041005.
Paper No: EP-16-1069
Published Online: October 10, 2016
... interconnects Microsystems Reliability Solder 05 06 2016 13 08 2016 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received June 5, 2016; final manuscript received August 13, 2016; published...
Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2016, 138(4): 040801.
Paper No: EP-16-1013
Published Online: August 24, 2016
... manuscript received July 21, 2016; published online August 24, 2016. Assoc. Editor: Eric Wong. 16 01 2016 21 07 2016 3D packaging Microsystems Thermal analysis Flow boiling in microscale systems was studied intensively in the past two decades and is still attracting...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041002.
Paper No: EP-16-1049
Published Online: August 19, 2016
..., the whole functional layer must be replaced, new photolithographic masks must be created, and all fabrication steps must be repeated. Bio-Research Microsystems Copyright © 2016 by ASME 2016 1043-7398/2016/138(4)/041002/6/ $25.00 ...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031008.
Paper No: EP-16-1014
Published Online: July 28, 2016
... LECTRONIC P ACKAGING . Manuscript received January 16, 2016; final manuscript received June 27, 2016; published online July 28, 2016. Assoc. Editor: Pradip Dutta. 16 01 2016 27 06 2016 Microsystems Thermal analysis The rise in energy consumption by data centers over the last...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031005.
Paper No: EP-16-1041
Published Online: May 19, 2016
... and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received February 24, 2016; final manuscript received May 1, 2016; published online May 19, 2016. Assoc. Editor: Xiaobing Luo. 24 02 2016 01 05 2016 Microsystems Thermal...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010905.
Paper No: EP-15-1105
Published Online: March 10, 2016
.... , 64 ( 15 ), pp. 3389 – 3406 . 10.1016/j.ces.2009.04.026 [30] Garstecki , P. , 2010 , “ Formation of Droplets and Bubbles in Microfluidic Systems ,” Microfluidics Based Microsystems , Springer , Dordrecht , pp. 163 – 181 . 10.1007/978-90-481-9029-4_9 [31] Andersson , R...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010914.
Paper No: EP-15-1101
Published Online: March 10, 2016
.... , Chen , W. , and Peroulis , D. , 2015 , “ A Single Crystal Silicon Low-g Switch Tolerant to Impact Accelerations up to 24,000 g ,” 18th International Conference on Solid-State Sensors, Actuators and Microsystems ( TRANSDUCERS ), Anchorage, AK, June 21–25, pp. 1144 – 1147 10.1109/TRANSDUCERS...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010901.
Paper No: EP-15-1091
Published Online: March 10, 2016
... manuscript received December 31, 2015; published online March 10, 2016. Assoc. Editor: Mehdi Asheghi. 25 09 2015 31 12 2015 Microsystems Thermal analysis Microchannel evaporators are one of the most promising cooling techniques for high-performance electronic devices. These heat...