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Keywords: Mixed-Mode Loading
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 237–244.
Published Online: May 26, 2004
...Tae-Sang Park; Soon-Bok Lee To give a proper and accurate estimation of the fatigue life of ball grid array (BGA) solder joints, a mechanical fatigue test method under mixed-mode loading is proposed. Experiments were conducted with 63 Sn ∕ 37 Pb and Sn ∕ 3.5 Ag ∕ 0.75 Cu solder joints in room...
