... expression of CTE on thermal expansion curve of EMC Fig. 2 Elastic moduli and CTEs of EMC: ( a ) elastic modulus of EMC (DMA test, 3 samples) and ( b ) CTE of EMC (TMA test, 3 samples) Compared with the EMC, the BT laminate from PBGA devices always has relatively unstable material properties...

... integrated circuit packaging integrated circuit reliability light interferometry plastic packaging thermal expansion thermomechanical treatment power cycling accelerated thermal cycling Moiré interferometry flip chip PBGA CBGA finite element analysis computational fluid dynamics...